JPS5362270U - - Google Patents
Info
- Publication number
- JPS5362270U JPS5362270U JP14490176U JP14490176U JPS5362270U JP S5362270 U JPS5362270 U JP S5362270U JP 14490176 U JP14490176 U JP 14490176U JP 14490176 U JP14490176 U JP 14490176U JP S5362270 U JPS5362270 U JP S5362270U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14490176U JPS5362270U (US20110009641A1-20110113-C00116.png) | 1976-10-27 | 1976-10-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14490176U JPS5362270U (US20110009641A1-20110113-C00116.png) | 1976-10-27 | 1976-10-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5362270U true JPS5362270U (US20110009641A1-20110113-C00116.png) | 1978-05-26 |
Family
ID=28753503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14490176U Pending JPS5362270U (US20110009641A1-20110113-C00116.png) | 1976-10-27 | 1976-10-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5362270U (US20110009641A1-20110113-C00116.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58167521A (ja) * | 1982-03-11 | 1983-10-03 | レ−ム・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 薬剤用水性被覆剤を製造するための粉末状混合物及び薬剤の被覆法 |
JP2010179313A (ja) * | 2009-02-03 | 2010-08-19 | Nhk Spring Co Ltd | 二つの部材の接合方法及び該方法による接合体 |
-
1976
- 1976-10-27 JP JP14490176U patent/JPS5362270U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58167521A (ja) * | 1982-03-11 | 1983-10-03 | レ−ム・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 薬剤用水性被覆剤を製造するための粉末状混合物及び薬剤の被覆法 |
JP2010179313A (ja) * | 2009-02-03 | 2010-08-19 | Nhk Spring Co Ltd | 二つの部材の接合方法及び該方法による接合体 |