JPS5336477A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5336477A
JPS5336477A JP11150677A JP11150677A JPS5336477A JP S5336477 A JPS5336477 A JP S5336477A JP 11150677 A JP11150677 A JP 11150677A JP 11150677 A JP11150677 A JP 11150677A JP S5336477 A JPS5336477 A JP S5336477A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11150677A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5649457B2 (enrdf_load_stackoverflow
Inventor
Baaringa Waruta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS5336477A publication Critical patent/JPS5336477A/ja
Publication of JPS5649457B2 publication Critical patent/JPS5649457B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/074Stacked arrangements of non-apertured devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
JP11150677A 1976-09-15 1977-09-16 Semiconductor device Granted JPS5336477A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762641500 DE2641500A1 (de) 1976-09-15 1976-09-15 Halbleiteranordnung

Publications (2)

Publication Number Publication Date
JPS5336477A true JPS5336477A (en) 1978-04-04
JPS5649457B2 JPS5649457B2 (enrdf_load_stackoverflow) 1981-11-21

Family

ID=5987968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11150677A Granted JPS5336477A (en) 1976-09-15 1977-09-16 Semiconductor device

Country Status (5)

Country Link
JP (1) JPS5336477A (enrdf_load_stackoverflow)
DE (1) DE2641500A1 (enrdf_load_stackoverflow)
FR (1) FR2365210A1 (enrdf_load_stackoverflow)
GB (1) GB1545650A (enrdf_load_stackoverflow)
IT (1) IT1086076B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101116528B1 (ko) 2003-05-08 2012-02-28 디에스엠 아이피 어셋츠 비.브이. 피부구조를 향상시키는 트리펩타이드 및 그 유도체의 미용용도

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101116528B1 (ko) 2003-05-08 2012-02-28 디에스엠 아이피 어셋츠 비.브이. 피부구조를 향상시키는 트리펩타이드 및 그 유도체의 미용용도

Also Published As

Publication number Publication date
GB1545650A (en) 1979-05-10
FR2365210A1 (fr) 1978-04-14
JPS5649457B2 (enrdf_load_stackoverflow) 1981-11-21
DE2641500A1 (de) 1978-03-16
FR2365210B3 (enrdf_load_stackoverflow) 1980-07-11
IT1086076B (it) 1985-05-28

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