JPS532166U - - Google Patents
Info
- Publication number
- JPS532166U JPS532166U JP8303276U JP8303276U JPS532166U JP S532166 U JPS532166 U JP S532166U JP 8303276 U JP8303276 U JP 8303276U JP 8303276 U JP8303276 U JP 8303276U JP S532166 U JPS532166 U JP S532166U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8303276U JPS532166U (US06633600-20031014-M00021.png) | 1976-06-23 | 1976-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8303276U JPS532166U (US06633600-20031014-M00021.png) | 1976-06-23 | 1976-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS532166U true JPS532166U (US06633600-20031014-M00021.png) | 1978-01-10 |
Family
ID=28564035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8303276U Pending JPS532166U (US06633600-20031014-M00021.png) | 1976-06-23 | 1976-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS532166U (US06633600-20031014-M00021.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6327133U (US06633600-20031014-M00021.png) * | 1986-08-05 | 1988-02-23 |
-
1976
- 1976-06-23 JP JP8303276U patent/JPS532166U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6327133U (US06633600-20031014-M00021.png) * | 1986-08-05 | 1988-02-23 |
