JPS53136479A - Automatic alignment method - Google Patents

Automatic alignment method

Info

Publication number
JPS53136479A
JPS53136479A JP5069777A JP5069777A JPS53136479A JP S53136479 A JPS53136479 A JP S53136479A JP 5069777 A JP5069777 A JP 5069777A JP 5069777 A JP5069777 A JP 5069777A JP S53136479 A JPS53136479 A JP S53136479A
Authority
JP
Japan
Prior art keywords
alignment method
automatic alignment
compensating
coordinates
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5069777A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5724026B2 (US06174465-20010116-C00003.png
Inventor
Yuichi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5069777A priority Critical patent/JPS53136479A/ja
Publication of JPS53136479A publication Critical patent/JPS53136479A/ja
Publication of JPS5724026B2 publication Critical patent/JPS5724026B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP5069777A 1977-05-04 1977-05-04 Automatic alignment method Granted JPS53136479A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5069777A JPS53136479A (en) 1977-05-04 1977-05-04 Automatic alignment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5069777A JPS53136479A (en) 1977-05-04 1977-05-04 Automatic alignment method

Publications (2)

Publication Number Publication Date
JPS53136479A true JPS53136479A (en) 1978-11-29
JPS5724026B2 JPS5724026B2 (US06174465-20010116-C00003.png) 1982-05-21

Family

ID=12866096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5069777A Granted JPS53136479A (en) 1977-05-04 1977-05-04 Automatic alignment method

Country Status (1)

Country Link
JP (1) JPS53136479A (US06174465-20010116-C00003.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559557U (US06174465-20010116-C00003.png) * 1978-07-03 1980-01-22
JPS6169142A (ja) * 1985-06-21 1986-04-09 Hitachi Ltd ワイヤボンデイング装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0514827Y2 (US06174465-20010116-C00003.png) * 1987-04-07 1993-04-20
JPH01115521U (US06174465-20010116-C00003.png) * 1988-01-28 1989-08-03

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559557U (US06174465-20010116-C00003.png) * 1978-07-03 1980-01-22
JPS5849629Y2 (ja) * 1978-07-03 1983-11-12 三菱電機株式会社 半導体装置用容器
JPS6169142A (ja) * 1985-06-21 1986-04-09 Hitachi Ltd ワイヤボンデイング装置
JPS6342410B2 (US06174465-20010116-C00003.png) * 1985-06-21 1988-08-23 Hitachi Ltd

Also Published As

Publication number Publication date
JPS5724026B2 (US06174465-20010116-C00003.png) 1982-05-21

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