JPS53117965A - Production of semiconductor element - Google Patents

Production of semiconductor element

Info

Publication number
JPS53117965A
JPS53117965A JP3224977A JP3224977A JPS53117965A JP S53117965 A JPS53117965 A JP S53117965A JP 3224977 A JP3224977 A JP 3224977A JP 3224977 A JP3224977 A JP 3224977A JP S53117965 A JPS53117965 A JP S53117965A
Authority
JP
Japan
Prior art keywords
production
semiconductor element
brazing
crevasses
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3224977A
Other languages
Japanese (ja)
Other versions
JPS5929141B2 (en
Inventor
Hitoshi Onuki
Masateru Suwa
Kunihiro Matsukuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3224977A priority Critical patent/JPS5929141B2/en
Publication of JPS53117965A publication Critical patent/JPS53117965A/en
Publication of JPS5929141B2 publication Critical patent/JPS5929141B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Abstract

PURPOSE: To reduce forward voltage drop by providing crevasses on the N+ surface layer of a Si substrate and brazing a W or Mo plate by using an Al brazing material.
COPYRIGHT: (C)1978,JPO&Japio
JP3224977A 1977-03-25 1977-03-25 Manufacturing method for semiconductor devices Expired JPS5929141B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3224977A JPS5929141B2 (en) 1977-03-25 1977-03-25 Manufacturing method for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3224977A JPS5929141B2 (en) 1977-03-25 1977-03-25 Manufacturing method for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS53117965A true JPS53117965A (en) 1978-10-14
JPS5929141B2 JPS5929141B2 (en) 1984-07-18

Family

ID=12353727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3224977A Expired JPS5929141B2 (en) 1977-03-25 1977-03-25 Manufacturing method for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5929141B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104846430A (en) * 2015-04-27 2015-08-19 西北工业大学 Method for preparing continuous regular lamellar microgroove based on lamellar eutectic alloy system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104846430A (en) * 2015-04-27 2015-08-19 西北工业大学 Method for preparing continuous regular lamellar microgroove based on lamellar eutectic alloy system
CN104846430B (en) * 2015-04-27 2017-04-12 西北工业大学 Method for preparing continuous regular lamellar microgroove based on lamellar eutectic alloy system

Also Published As

Publication number Publication date
JPS5929141B2 (en) 1984-07-18

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