JPS5295181A - Heating table - Google Patents
Heating tableInfo
- Publication number
- JPS5295181A JPS5295181A JP1146076A JP1146076A JPS5295181A JP S5295181 A JPS5295181 A JP S5295181A JP 1146076 A JP1146076 A JP 1146076A JP 1146076 A JP1146076 A JP 1146076A JP S5295181 A JPS5295181 A JP S5295181A
- Authority
- JP
- Japan
- Prior art keywords
- heating table
- carried objects
- overheat
- troubles
- annealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title abstract 2
- 238000000137 annealing Methods 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
Abstract
PURPOSE: To protect the carried objects from annealing and oxidizing due to the overheat by the heating table to be away from the carried objects in case of the troubles and the adjustment of the assembling and working device.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1146076A JPS6011468B2 (en) | 1976-02-06 | 1976-02-06 | heating table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1146076A JPS6011468B2 (en) | 1976-02-06 | 1976-02-06 | heating table |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59070884A Division JPS60149140A (en) | 1984-04-11 | 1984-04-11 | Bonding equipment for semiconductor device assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5295181A true JPS5295181A (en) | 1977-08-10 |
| JPS6011468B2 JPS6011468B2 (en) | 1985-03-26 |
Family
ID=11778697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1146076A Expired JPS6011468B2 (en) | 1976-02-06 | 1976-02-06 | heating table |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6011468B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149140A (en) * | 1984-04-11 | 1985-08-06 | Hitachi Ltd | Bonding equipment for semiconductor device assembly |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61234093A (en) * | 1985-04-10 | 1986-10-18 | 松下電器産業株式会社 | Wiring substrate |
| JPH01145173U (en) * | 1988-03-29 | 1989-10-05 | ||
| JPH0416584U (en) * | 1990-05-29 | 1992-02-12 |
-
1976
- 1976-02-06 JP JP1146076A patent/JPS6011468B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149140A (en) * | 1984-04-11 | 1985-08-06 | Hitachi Ltd | Bonding equipment for semiconductor device assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6011468B2 (en) | 1985-03-26 |
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