JPS5260267U - - Google Patents
Info
- Publication number
- JPS5260267U JPS5260267U JP14725675U JP14725675U JPS5260267U JP S5260267 U JPS5260267 U JP S5260267U JP 14725675 U JP14725675 U JP 14725675U JP 14725675 U JP14725675 U JP 14725675U JP S5260267 U JPS5260267 U JP S5260267U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14725675U JPS5260267U (US08124630-20120228-C00152.png) | 1975-10-29 | 1975-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14725675U JPS5260267U (US08124630-20120228-C00152.png) | 1975-10-29 | 1975-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5260267U true JPS5260267U (US08124630-20120228-C00152.png) | 1977-05-02 |
Family
ID=28626907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14725675U Pending JPS5260267U (US08124630-20120228-C00152.png) | 1975-10-29 | 1975-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5260267U (US08124630-20120228-C00152.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50110278A (US08124630-20120228-C00152.png) * | 1974-02-06 | 1975-08-30 |
-
1975
- 1975-10-29 JP JP14725675U patent/JPS5260267U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50110278A (US08124630-20120228-C00152.png) * | 1974-02-06 | 1975-08-30 |
