JPS5250512B2 - - Google Patents
Info
- Publication number
- JPS5250512B2 JPS5250512B2 JP50085922A JP8592275A JPS5250512B2 JP S5250512 B2 JPS5250512 B2 JP S5250512B2 JP 50085922 A JP50085922 A JP 50085922A JP 8592275 A JP8592275 A JP 8592275A JP S5250512 B2 JPS5250512 B2 JP S5250512B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/498,342 US3959579A (en) | 1974-08-19 | 1974-08-19 | Apertured semi-conductor device mounted on a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5136083A JPS5136083A (https=) | 1976-03-26 |
| JPS5250512B2 true JPS5250512B2 (https=) | 1977-12-24 |
Family
ID=23980676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50085922A Expired JPS5250512B2 (https=) | 1974-08-19 | 1975-07-15 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3959579A (https=) |
| JP (1) | JPS5250512B2 (https=) |
| DE (1) | DE2536270A1 (https=) |
| FR (1) | FR2282719A1 (https=) |
| GB (1) | GB1469085A (https=) |
| IT (1) | IT1039025B (https=) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4082394A (en) * | 1977-01-03 | 1978-04-04 | International Business Machines Corporation | Metallized ceramic and printed circuit module |
| US4193082A (en) * | 1978-06-23 | 1980-03-11 | International Business Machines Corporation | Multi-layer dielectric structure |
| JPS5728337A (en) * | 1980-07-28 | 1982-02-16 | Hitachi Ltd | Connecting constructin of semiconductor element |
| US4377316A (en) * | 1981-02-27 | 1983-03-22 | International Business Machines Corporation | High density interconnection means for chip carriers |
| JPS582054A (ja) * | 1981-06-26 | 1983-01-07 | Fujitsu Ltd | 半導体装置 |
| JPS5918664A (ja) * | 1982-07-22 | 1984-01-31 | Mitsubishi Electric Corp | 半導体試験用接続装置 |
| JPS5966257A (ja) * | 1982-10-08 | 1984-04-14 | Nippon Telegr & Teleph Corp <Ntt> | メツセ−ジ在中表示方式 |
| US4862245A (en) * | 1985-04-18 | 1989-08-29 | International Business Machines Corporation | Package semiconductor chip |
| US4667404A (en) * | 1985-09-30 | 1987-05-26 | Microelectronics Center Of North Carolina | Method of interconnecting wiring planes |
| US4764644A (en) * | 1985-09-30 | 1988-08-16 | Microelectronics Center Of North Carolina | Microelectronics apparatus |
| US4774630A (en) * | 1985-09-30 | 1988-09-27 | Microelectronics Center Of North Carolina | Apparatus for mounting a semiconductor chip and making electrical connections thereto |
| GB2189084B (en) * | 1986-04-10 | 1989-11-22 | Stc Plc | Integrated circuit package |
| US4754370A (en) * | 1986-08-26 | 1988-06-28 | American Telephone And Telegraph Company, At&T Bell Laboratories | Electrical component with added connecting conducting paths |
| GB2253308B (en) * | 1986-09-26 | 1993-01-20 | Gen Electric Co Plc | Semiconductor circuit arrangements |
| US4868634A (en) * | 1987-03-13 | 1989-09-19 | Citizen Watch Co., Ltd. | IC-packaged device |
| JP2529254B2 (ja) * | 1987-04-21 | 1996-08-28 | シチズン時計株式会社 | Ｉｃ実装装置 |
| US5191224A (en) * | 1987-04-22 | 1993-03-02 | Hitachi, Ltd. | Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein |
| US5061822A (en) * | 1988-09-12 | 1991-10-29 | Honeywell Inc. | Radial solution to chip carrier pitch deviation |
| US5223741A (en) * | 1989-09-01 | 1993-06-29 | Tactical Fabs, Inc. | Package for an integrated circuit structure |
| US5313096A (en) * | 1992-03-16 | 1994-05-17 | Dense-Pac Microsystems, Inc. | IC chip package having chip attached to and wire bonded within an overlying substrate |
| US5483100A (en) * | 1992-06-02 | 1996-01-09 | Amkor Electronics, Inc. | Integrated circuit package with via interconnections formed in a substrate |
| US5264729A (en) * | 1992-07-29 | 1993-11-23 | Lsi Logic Corporation | Semiconductor package having programmable interconnect |
| US6205654B1 (en) * | 1992-12-11 | 2001-03-27 | Staktek Group L.P. | Method of manufacturing a surface mount package |
| US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
| US5682062A (en) * | 1995-06-05 | 1997-10-28 | Harris Corporation | System for interconnecting stacked integrated circuits |
| US5646067A (en) * | 1995-06-05 | 1997-07-08 | Harris Corporation | Method of bonding wafers having vias including conductive material |
| US5608264A (en) * | 1995-06-05 | 1997-03-04 | Harris Corporation | Surface mountable integrated circuit with conductive vias |
| US5814889A (en) * | 1995-06-05 | 1998-09-29 | Harris Corporation | Intergrated circuit with coaxial isolation and method |
| US5668409A (en) * | 1995-06-05 | 1997-09-16 | Harris Corporation | Integrated circuit with edge connections and method |
| US5618752A (en) * | 1995-06-05 | 1997-04-08 | Harris Corporation | Method of fabrication of surface mountable integrated circuits |
| US6572387B2 (en) | 1999-09-24 | 2003-06-03 | Staktek Group, L.P. | Flexible circuit connector for stacked chip module |
| US6608763B1 (en) | 2000-09-15 | 2003-08-19 | Staktek Group L.P. | Stacking system and method |
| US6462408B1 (en) | 2001-03-27 | 2002-10-08 | Staktek Group, L.P. | Contact member stacking system and method |
| US9681550B2 (en) * | 2007-08-28 | 2017-06-13 | Joseph C. Fjelstad | Method of making a circuit subassembly |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2890976A (en) * | 1954-12-30 | 1959-06-16 | Sprague Electric Co | Monocrystalline tubular semiconductor |
| US3374533A (en) * | 1965-05-26 | 1968-03-26 | Sprague Electric Co | Semiconductor mounting and assembly method |
| US3365620A (en) * | 1966-06-13 | 1968-01-23 | Ibm | Circuit package with improved modular assembly and cooling apparatus |
| US3457541A (en) * | 1967-05-01 | 1969-07-22 | Lockheed Aircraft Corp | Mounting board for electronic circuit elements |
| GB1239678A (https=) * | 1968-12-04 | 1971-07-21 | ||
| US3648131A (en) * | 1969-11-07 | 1972-03-07 | Ibm | Hourglass-shaped conductive connection through semiconductor structures |
| US3596140A (en) * | 1969-12-01 | 1971-07-27 | Ronald A Walsh | Demountable peripheral-contact electronic circuit board assembly |
| US3619734A (en) * | 1969-12-17 | 1971-11-09 | Rca Corp | Assembly of series connected semiconductor elements having good heat dissipation |
| IT939391B (it) * | 1970-09-08 | 1973-02-10 | Pasticca semiconduttrice nonche metodo e dispositivo per la sua produzione | |
| US3726002A (en) * | 1971-08-27 | 1973-04-10 | Ibm | Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate |
-
1974
- 1974-08-19 US US05/498,342 patent/US3959579A/en not_active Expired - Lifetime
-
1975
- 1975-05-20 GB GB2162575A patent/GB1469085A/en not_active Expired
- 1975-06-17 IT IT24418/75A patent/IT1039025B/it active
- 1975-07-03 FR FR7521475A patent/FR2282719A1/fr active Granted
- 1975-07-15 JP JP50085922A patent/JPS5250512B2/ja not_active Expired
- 1975-08-14 DE DE19752536270 patent/DE2536270A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| FR2282719A1 (fr) | 1976-03-19 |
| JPS5136083A (https=) | 1976-03-26 |
| US3959579A (en) | 1976-05-25 |
| IT1039025B (it) | 1979-12-10 |
| FR2282719B1 (https=) | 1977-07-22 |
| DE2536270A1 (de) | 1976-03-04 |
| GB1469085A (en) | 1977-03-30 |