JPS5223218B2 - - Google Patents
Info
- Publication number
- JPS5223218B2 JPS5223218B2 JP49017359A JP1735974A JPS5223218B2 JP S5223218 B2 JPS5223218 B2 JP S5223218B2 JP 49017359 A JP49017359 A JP 49017359A JP 1735974 A JP1735974 A JP 1735974A JP S5223218 B2 JPS5223218 B2 JP S5223218B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49017359A JPS5223218B2 (US06342305-20020129-C00040.png) | 1974-02-13 | 1974-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49017359A JPS5223218B2 (US06342305-20020129-C00040.png) | 1974-02-13 | 1974-02-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50113174A JPS50113174A (US06342305-20020129-C00040.png) | 1975-09-05 |
| JPS5223218B2 true JPS5223218B2 (US06342305-20020129-C00040.png) | 1977-06-22 |
Family
ID=11941835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49017359A Expired JPS5223218B2 (US06342305-20020129-C00040.png) | 1974-02-13 | 1974-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5223218B2 (US06342305-20020129-C00040.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5731857U (US06342305-20020129-C00040.png) * | 1980-07-31 | 1982-02-19 | ||
| TWI396268B (zh) * | 2006-05-25 | 2013-05-11 | Taiwan Semiconductor Mfg | 複合連結線與其製造方法 |
-
1974
- 1974-02-13 JP JP49017359A patent/JPS5223218B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50113174A (US06342305-20020129-C00040.png) | 1975-09-05 |
