JPS5223064B2 - - Google Patents

Info

Publication number
JPS5223064B2
JPS5223064B2 JP46104939A JP10493971A JPS5223064B2 JP S5223064 B2 JPS5223064 B2 JP S5223064B2 JP 46104939 A JP46104939 A JP 46104939A JP 10493971 A JP10493971 A JP 10493971A JP S5223064 B2 JPS5223064 B2 JP S5223064B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP46104939A
Other languages
Japanese (ja)
Other versions
JPS4869057A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46104939A priority Critical patent/JPS5223064B2/ja
Publication of JPS4869057A publication Critical patent/JPS4869057A/ja
Publication of JPS5223064B2 publication Critical patent/JPS5223064B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
JP46104939A 1971-12-23 1971-12-23 Expired JPS5223064B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP46104939A JPS5223064B2 (en) 1971-12-23 1971-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46104939A JPS5223064B2 (en) 1971-12-23 1971-12-23

Publications (2)

Publication Number Publication Date
JPS4869057A JPS4869057A (en) 1973-09-20
JPS5223064B2 true JPS5223064B2 (en) 1977-06-22

Family

ID=14394047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46104939A Expired JPS5223064B2 (en) 1971-12-23 1971-12-23

Country Status (1)

Country Link
JP (1) JPS5223064B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59109910A (en) * 1982-12-15 1984-06-25 Komatsu Ltd Teaching method of robot
JPS60132208A (en) * 1983-12-21 1985-07-15 Amada Co Ltd Moving range controlling method of movable body

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5640513B2 (en) * 1973-12-04 1981-09-21
JPS5145761A (en) * 1974-10-18 1976-04-19 Nippon Electric Co Denkibuhinno setsuzokuhoho
JPS5416669A (en) * 1977-07-07 1979-02-07 Mitsubishi Electric Corp Method of manufacturing hybrid integrated circuit device
JPS58223396A (en) * 1982-06-18 1983-12-24 ウラジミ−ル・イオシフオウイツチ・リブシツ Method of producing panel used for microminiature electronic device
JP2753746B2 (en) * 1989-11-06 1998-05-20 日本メクトロン株式会社 Flexible circuit board for mounting IC and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59109910A (en) * 1982-12-15 1984-06-25 Komatsu Ltd Teaching method of robot
JPS60132208A (en) * 1983-12-21 1985-07-15 Amada Co Ltd Moving range controlling method of movable body

Also Published As

Publication number Publication date
JPS4869057A (en) 1973-09-20

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