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Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP7713676UpriorityCriticalpatent/JPS611737Y2/ja
Publication of JPS52168559UpublicationCriticalpatent/JPS52168559U/ja
Application grantedgrantedCritical
Publication of JPS611737Y2publicationCriticalpatent/JPS611737Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
H01L2224/3201—Structure
H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
