JPS5214351A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5214351A JPS5214351A JP9024475A JP9024475A JPS5214351A JP S5214351 A JPS5214351 A JP S5214351A JP 9024475 A JP9024475 A JP 9024475A JP 9024475 A JP9024475 A JP 9024475A JP S5214351 A JPS5214351 A JP S5214351A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- thicknesses
- pellet
- foil
- sum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9024475A JPS5214351A (en) | 1975-07-25 | 1975-07-25 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9024475A JPS5214351A (en) | 1975-07-25 | 1975-07-25 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5214351A true JPS5214351A (en) | 1977-02-03 |
Family
ID=13993076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9024475A Pending JPS5214351A (en) | 1975-07-25 | 1975-07-25 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5214351A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0763476A (ja) * | 1992-01-31 | 1995-03-10 | Daido Hoxan Inc | 高純度窒素ガス製造装置 |
-
1975
- 1975-07-25 JP JP9024475A patent/JPS5214351A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0763476A (ja) * | 1992-01-31 | 1995-03-10 | Daido Hoxan Inc | 高純度窒素ガス製造装置 |
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