JPS5197371A - - Google Patents
Info
- Publication number
- JPS5197371A JPS5197371A JP50021830A JP2183075A JPS5197371A JP S5197371 A JPS5197371 A JP S5197371A JP 50021830 A JP50021830 A JP 50021830A JP 2183075 A JP2183075 A JP 2183075A JP S5197371 A JPS5197371 A JP S5197371A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50021830A JPS5197371A (US07321065-20080122-C00020.png) | 1975-02-24 | 1975-02-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50021830A JPS5197371A (US07321065-20080122-C00020.png) | 1975-02-24 | 1975-02-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5197371A true JPS5197371A (US07321065-20080122-C00020.png) | 1976-08-26 |
Family
ID=12065974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50021830A Pending JPS5197371A (US07321065-20080122-C00020.png) | 1975-02-24 | 1975-02-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5197371A (US07321065-20080122-C00020.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014162387A1 (ja) * | 2013-04-01 | 2014-10-09 | パイオニア株式会社 | ワイヤの接続構造及び電気機器 |
-
1975
- 1975-02-24 JP JP50021830A patent/JPS5197371A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014162387A1 (ja) * | 2013-04-01 | 2014-10-09 | パイオニア株式会社 | ワイヤの接続構造及び電気機器 |