JPS5188178U - - Google Patents
Info
- Publication number
- JPS5188178U JPS5188178U JP1975006089U JP608975U JPS5188178U JP S5188178 U JPS5188178 U JP S5188178U JP 1975006089 U JP1975006089 U JP 1975006089U JP 608975 U JP608975 U JP 608975U JP S5188178 U JPS5188178 U JP S5188178U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975006089U JPS5188178U (https=) | 1975-01-09 | 1975-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975006089U JPS5188178U (https=) | 1975-01-09 | 1975-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5188178U true JPS5188178U (https=) | 1976-07-14 |
Family
ID=28069913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975006089U Pending JPS5188178U (https=) | 1975-01-09 | 1975-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5188178U (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53108868U (https=) * | 1977-02-07 | 1978-08-31 | ||
| JPS53116268U (https=) * | 1977-02-23 | 1978-09-16 |
-
1975
- 1975-01-09 JP JP1975006089U patent/JPS5188178U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53108868U (https=) * | 1977-02-07 | 1978-08-31 | ||
| JPS53116268U (https=) * | 1977-02-23 | 1978-09-16 |