JPS5187965A - - Google Patents

Info

Publication number
JPS5187965A
JPS5187965A JP50012570A JP1257075A JPS5187965A JP S5187965 A JPS5187965 A JP S5187965A JP 50012570 A JP50012570 A JP 50012570A JP 1257075 A JP1257075 A JP 1257075A JP S5187965 A JPS5187965 A JP S5187965A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50012570A
Other languages
Japanese (ja)
Inventor
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50012570A priority Critical patent/JPS5187965A/ja
Publication of JPS5187965A publication Critical patent/JPS5187965A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • H01L2224/78302Shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313Wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP50012570A 1975-01-31 1975-01-31 Pending JPS5187965A (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50012570A JPS5187965A (cs) 1975-01-31 1975-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50012570A JPS5187965A (cs) 1975-01-31 1975-01-31

Publications (1)

Publication Number Publication Date
JPS5187965A true JPS5187965A (cs) 1976-07-31

Family

ID=11809005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50012570A Pending JPS5187965A (cs) 1975-01-31 1975-01-31

Country Status (1)

Country Link
JP (1) JPS5187965A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0424930A (ja) * 1990-05-15 1992-01-28 Nippon Steel Corp ボンディングツール
DE102018219327A1 (de) 2017-11-15 2019-05-16 Okuma Corporation Betriebszustandsanzeige und Verfahren zur Betriebszustandsanzeige für die Vorschubachse in einer Werkzeugmaschine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0424930A (ja) * 1990-05-15 1992-01-28 Nippon Steel Corp ボンディングツール
DE102018219327A1 (de) 2017-11-15 2019-05-16 Okuma Corporation Betriebszustandsanzeige und Verfahren zur Betriebszustandsanzeige für die Vorschubachse in einer Werkzeugmaschine

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