JPS5134265B2 - - Google Patents
Info
- Publication number
- JPS5134265B2 JPS5134265B2 JP47046337A JP4633772A JPS5134265B2 JP S5134265 B2 JPS5134265 B2 JP S5134265B2 JP 47046337 A JP47046337 A JP 47046337A JP 4633772 A JP4633772 A JP 4633772A JP S5134265 B2 JPS5134265 B2 JP S5134265B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/04—Particles; Flakes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Glass Compositions (AREA)
- Inorganic Insulating Materials (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47046337A JPS5134265B2 (US07943777-20110517-C00090.png) | 1972-05-12 | 1972-05-12 | |
US00356441A US3837002A (en) | 1972-05-12 | 1973-05-02 | Glass mold semiconductor device |
DE2323896A DE2323896C3 (de) | 1972-05-12 | 1973-05-11 | Halbleitergleichrichter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47046337A JPS5134265B2 (US07943777-20110517-C00090.png) | 1972-05-12 | 1972-05-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS499191A JPS499191A (US07943777-20110517-C00090.png) | 1974-01-26 |
JPS5134265B2 true JPS5134265B2 (US07943777-20110517-C00090.png) | 1976-09-25 |
Family
ID=12744308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP47046337A Expired JPS5134265B2 (US07943777-20110517-C00090.png) | 1972-05-12 | 1972-05-12 |
Country Status (3)
Country | Link |
---|---|
US (1) | US3837002A (US07943777-20110517-C00090.png) |
JP (1) | JPS5134265B2 (US07943777-20110517-C00090.png) |
DE (1) | DE2323896C3 (US07943777-20110517-C00090.png) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS535971A (en) * | 1976-07-06 | 1978-01-19 | Mitsubishi Electric Corp | Semiconductor device |
JPS5819125B2 (ja) * | 1976-08-11 | 1983-04-16 | 株式会社日立製作所 | 半導体装置の製造方法 |
JPS54978A (en) * | 1977-06-06 | 1979-01-06 | Hitachi Ltd | Semiconductor device of glass seal type |
DE19728693C2 (de) * | 1997-07-04 | 1999-04-29 | Siemens Ag | Halbleitermodul |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2620598A (en) * | 1947-04-22 | 1952-12-09 | James A Jobling And Company Lt | Method of fabricating multi-component glass articles |
BE557975A (US07943777-20110517-C00090.png) * | 1956-06-04 | 1957-11-30 | ||
US3410705A (en) * | 1963-10-30 | 1968-11-12 | Tdk Electronics Co Ltd | Ceramic dielectrics |
US3392312A (en) * | 1963-11-06 | 1968-07-09 | Carman Lab Inc | Glass encapsulated electronic devices |
US3363150A (en) * | 1964-05-25 | 1968-01-09 | Gen Electric | Glass encapsulated double heat sink diode assembly |
US3535133A (en) * | 1968-04-24 | 1970-10-20 | Transitron Electronic Corp | Alkali-free electronic glass and method of manufacture |
-
1972
- 1972-05-12 JP JP47046337A patent/JPS5134265B2/ja not_active Expired
-
1973
- 1973-05-02 US US00356441A patent/US3837002A/en not_active Expired - Lifetime
- 1973-05-11 DE DE2323896A patent/DE2323896C3/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2323896B2 (de) | 1977-09-29 |
JPS499191A (US07943777-20110517-C00090.png) | 1974-01-26 |
DE2323896C3 (de) | 1978-08-31 |
DE2323896A1 (de) | 1973-12-13 |
US3837002A (en) | 1974-09-17 |