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Filing date
Publication date
Application filedfiledCritical
Priority to JP5666175UpriorityCriticalpatent/JPS5254285Y2/ja
Publication of JPS51137261UpublicationCriticalpatent/JPS51137261U/ja
Application grantedgrantedCritical
Publication of JPS5254285Y2publicationCriticalpatent/JPS5254285Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
H01L2224/85909—Post-treatment of the connector or wire bonding area
H01L2224/8592—Applying permanent coating, e.g. protective coating
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Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices
(AREA)
