JPS51121592U - - Google Patents

Info

Publication number
JPS51121592U
JPS51121592U JP1975040695U JP4069575U JPS51121592U JP S51121592 U JPS51121592 U JP S51121592U JP 1975040695 U JP1975040695 U JP 1975040695U JP 4069575 U JP4069575 U JP 4069575U JP S51121592 U JPS51121592 U JP S51121592U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1975040695U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975040695U priority Critical patent/JPS51121592U/ja
Publication of JPS51121592U publication Critical patent/JPS51121592U/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
JP1975040695U 1975-03-26 1975-03-26 Pending JPS51121592U (US20090182215A1-20090716-C00004.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975040695U JPS51121592U (US20090182215A1-20090716-C00004.png) 1975-03-26 1975-03-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975040695U JPS51121592U (US20090182215A1-20090716-C00004.png) 1975-03-26 1975-03-26

Publications (1)

Publication Number Publication Date
JPS51121592U true JPS51121592U (US20090182215A1-20090716-C00004.png) 1976-10-01

Family

ID=28166777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975040695U Pending JPS51121592U (US20090182215A1-20090716-C00004.png) 1975-03-26 1975-03-26

Country Status (1)

Country Link
JP (1) JPS51121592U (US20090182215A1-20090716-C00004.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11503880A (ja) * 1996-02-09 1999-03-30 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 半導体材料のウエファに形成された半導体素子のレーザ分割方法
JP2015159297A (ja) * 2011-06-15 2015-09-03 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated マルチステップ・非対称形状レーザビームスクライビング
JP2018018907A (ja) * 2016-07-26 2018-02-01 株式会社ディスコ デバイスウエーハの加工方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11503880A (ja) * 1996-02-09 1999-03-30 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 半導体材料のウエファに形成された半導体素子のレーザ分割方法
JP2015159297A (ja) * 2011-06-15 2015-09-03 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated マルチステップ・非対称形状レーザビームスクライビング
JP2018018907A (ja) * 2016-07-26 2018-02-01 株式会社ディスコ デバイスウエーハの加工方法

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