JPS51109775A - Handotaisochino seizohoho - Google Patents

Handotaisochino seizohoho

Info

Publication number
JPS51109775A
JPS51109775A JP3415775A JP3415775A JPS51109775A JP S51109775 A JPS51109775 A JP S51109775A JP 3415775 A JP3415775 A JP 3415775A JP 3415775 A JP3415775 A JP 3415775A JP S51109775 A JPS51109775 A JP S51109775A
Authority
JP
Japan
Prior art keywords
handotaisochino seizohoho
handotaisochino
seizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3415775A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5424822B2 (US07345094-20080318-C00003.png
Inventor
Tatsuyuki Tomioka
Noboru Yuigami
Yokutsugu Hamaguchi
Kyoharu Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3415775A priority Critical patent/JPS51109775A/ja
Publication of JPS51109775A publication Critical patent/JPS51109775A/ja
Publication of JPS5424822B2 publication Critical patent/JPS5424822B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Wire Bonding (AREA)
JP3415775A 1975-03-20 1975-03-20 Handotaisochino seizohoho Granted JPS51109775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3415775A JPS51109775A (en) 1975-03-20 1975-03-20 Handotaisochino seizohoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3415775A JPS51109775A (en) 1975-03-20 1975-03-20 Handotaisochino seizohoho

Publications (2)

Publication Number Publication Date
JPS51109775A true JPS51109775A (en) 1976-09-28
JPS5424822B2 JPS5424822B2 (US07345094-20080318-C00003.png) 1979-08-23

Family

ID=12406358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3415775A Granted JPS51109775A (en) 1975-03-20 1975-03-20 Handotaisochino seizohoho

Country Status (1)

Country Link
JP (1) JPS51109775A (US07345094-20080318-C00003.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02503497A (ja) * 1988-03-16 1990-10-18 ジーイーシー　―　マルコニ　リミテッド フリップチップ接着された装置用の副尺構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02503497A (ja) * 1988-03-16 1990-10-18 ジーイーシー　―　マルコニ　リミテッド フリップチップ接着された装置用の副尺構造

Also Published As

Publication number Publication date
JPS5424822B2 (US07345094-20080318-C00003.png) 1979-08-23

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