JPS51108625A - biisnnin keigokin - Google Patents
biisnnin keigokinInfo
- Publication number
- JPS51108625A JPS51108625A JP3293875A JP3293875A JPS51108625A JP S51108625 A JPS51108625 A JP S51108625A JP 3293875 A JP3293875 A JP 3293875A JP 3293875 A JP3293875 A JP 3293875A JP S51108625 A JPS51108625 A JP S51108625A
- Authority
- JP
- Japan
- Prior art keywords
- keigokin
- biisnnin
- biisnnin keigokin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50032938A JPS5810451B2 (en) | 1975-03-20 | 1975-03-20 | BI-SN-IN Keigokin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50032938A JPS5810451B2 (en) | 1975-03-20 | 1975-03-20 | BI-SN-IN Keigokin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51108625A true JPS51108625A (en) | 1976-09-27 |
JPS5810451B2 JPS5810451B2 (en) | 1983-02-25 |
Family
ID=12372874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50032938A Expired JPS5810451B2 (en) | 1975-03-20 | 1975-03-20 | BI-SN-IN Keigokin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5810451B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0629465A1 (en) * | 1993-06-16 | 1994-12-21 | International Business Machines Corporation | Lead-free, high-tin, ternary solder alloy of tin, bismuth, and indium |
EP0629467A1 (en) * | 1993-06-16 | 1994-12-21 | International Business Machines Corporation | Lead free, tin-bismuth solder alloys |
US5755896A (en) * | 1996-11-26 | 1998-05-26 | Ford Motor Company | Low temperature lead-free solder compositions |
EP3715040A4 (en) * | 2018-03-08 | 2020-09-30 | Senju Metal Industry Co., Ltd | Solder alloy, solder paste, solder ball, resin cored solder, and solder joint |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4839694A (en) * | 1971-09-30 | 1973-06-11 |
-
1975
- 1975-03-20 JP JP50032938A patent/JPS5810451B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4839694A (en) * | 1971-09-30 | 1973-06-11 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0629465A1 (en) * | 1993-06-16 | 1994-12-21 | International Business Machines Corporation | Lead-free, high-tin, ternary solder alloy of tin, bismuth, and indium |
EP0629467A1 (en) * | 1993-06-16 | 1994-12-21 | International Business Machines Corporation | Lead free, tin-bismuth solder alloys |
JPH071178A (en) * | 1993-06-16 | 1995-01-06 | Internatl Business Mach Corp <Ibm> | Three component solder |
US5755896A (en) * | 1996-11-26 | 1998-05-26 | Ford Motor Company | Low temperature lead-free solder compositions |
EP0845324A1 (en) * | 1996-11-26 | 1998-06-03 | Ford Motor Company | Solder Compositions |
EP3715040A4 (en) * | 2018-03-08 | 2020-09-30 | Senju Metal Industry Co., Ltd | Solder alloy, solder paste, solder ball, resin cored solder, and solder joint |
Also Published As
Publication number | Publication date |
---|---|
JPS5810451B2 (en) | 1983-02-25 |
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