JPS51108625A - biisnnin keigokin - Google Patents

biisnnin keigokin

Info

Publication number
JPS51108625A
JPS51108625A JP3293875A JP3293875A JPS51108625A JP S51108625 A JPS51108625 A JP S51108625A JP 3293875 A JP3293875 A JP 3293875A JP 3293875 A JP3293875 A JP 3293875A JP S51108625 A JPS51108625 A JP S51108625A
Authority
JP
Japan
Prior art keywords
keigokin
biisnnin
biisnnin keigokin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3293875A
Other languages
Japanese (ja)
Other versions
JPS5810451B2 (en
Inventor
Hideki Murabayashi
Katsuhiko Kawakita
Kisaku Nakamura
Sadao Obata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP50032938A priority Critical patent/JPS5810451B2/en
Publication of JPS51108625A publication Critical patent/JPS51108625A/en
Publication of JPS5810451B2 publication Critical patent/JPS5810451B2/en
Expired legal-status Critical Current

Links

JP50032938A 1975-03-20 1975-03-20 BI-SN-IN Keigokin Expired JPS5810451B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50032938A JPS5810451B2 (en) 1975-03-20 1975-03-20 BI-SN-IN Keigokin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50032938A JPS5810451B2 (en) 1975-03-20 1975-03-20 BI-SN-IN Keigokin

Publications (2)

Publication Number Publication Date
JPS51108625A true JPS51108625A (en) 1976-09-27
JPS5810451B2 JPS5810451B2 (en) 1983-02-25

Family

ID=12372874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50032938A Expired JPS5810451B2 (en) 1975-03-20 1975-03-20 BI-SN-IN Keigokin

Country Status (1)

Country Link
JP (1) JPS5810451B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0629465A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead-free, high-tin, ternary solder alloy of tin, bismuth, and indium
EP0629467A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead free, tin-bismuth solder alloys
US5755896A (en) * 1996-11-26 1998-05-26 Ford Motor Company Low temperature lead-free solder compositions
EP3715040A4 (en) * 2018-03-08 2020-09-30 Senju Metal Industry Co., Ltd Solder alloy, solder paste, solder ball, resin cored solder, and solder joint

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839694A (en) * 1971-09-30 1973-06-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4839694A (en) * 1971-09-30 1973-06-11

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0629465A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead-free, high-tin, ternary solder alloy of tin, bismuth, and indium
EP0629467A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead free, tin-bismuth solder alloys
JPH071178A (en) * 1993-06-16 1995-01-06 Internatl Business Mach Corp <Ibm> Three component solder
US5755896A (en) * 1996-11-26 1998-05-26 Ford Motor Company Low temperature lead-free solder compositions
EP0845324A1 (en) * 1996-11-26 1998-06-03 Ford Motor Company Solder Compositions
EP3715040A4 (en) * 2018-03-08 2020-09-30 Senju Metal Industry Co., Ltd Solder alloy, solder paste, solder ball, resin cored solder, and solder joint

Also Published As

Publication number Publication date
JPS5810451B2 (en) 1983-02-25

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