JPS506147B1 - - Google Patents
Info
- Publication number
- JPS506147B1 JPS506147B1 JP45060402A JP6040270A JPS506147B1 JP S506147 B1 JPS506147 B1 JP S506147B1 JP 45060402 A JP45060402 A JP 45060402A JP 6040270 A JP6040270 A JP 6040270A JP S506147 B1 JPS506147 B1 JP S506147B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45060402A JPS506147B1 (en:Method) | 1970-07-10 | 1970-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45060402A JPS506147B1 (en:Method) | 1970-07-10 | 1970-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS506147B1 true JPS506147B1 (en:Method) | 1975-03-11 |
Family
ID=13141121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45060402A Pending JPS506147B1 (en:Method) | 1970-07-10 | 1970-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS506147B1 (en:Method) |
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1970
- 1970-07-10 JP JP45060402A patent/JPS506147B1/ja active Pending