JPS5021449U - - Google Patents
Info
- Publication number
- JPS5021449U JPS5021449U JP7488773U JP7488773U JPS5021449U JP S5021449 U JPS5021449 U JP S5021449U JP 7488773 U JP7488773 U JP 7488773U JP 7488773 U JP7488773 U JP 7488773U JP S5021449 U JPS5021449 U JP S5021449U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7488773U JPS5021449U (US07993877-20110809-P00003.png) | 1973-06-23 | 1973-06-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7488773U JPS5021449U (US07993877-20110809-P00003.png) | 1973-06-23 | 1973-06-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5021449U true JPS5021449U (US07993877-20110809-P00003.png) | 1975-03-11 |
Family
ID=28247522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7488773U Pending JPS5021449U (US07993877-20110809-P00003.png) | 1973-06-23 | 1973-06-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5021449U (US07993877-20110809-P00003.png) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53126719U (US07993877-20110809-P00003.png) * | 1977-03-14 | 1978-10-07 | ||
JPS56159253U (US07993877-20110809-P00003.png) * | 1980-04-28 | 1981-11-27 | ||
JPS56171250U (US07993877-20110809-P00003.png) * | 1980-05-23 | 1981-12-17 | ||
JPS59157846U (ja) * | 1983-04-07 | 1984-10-23 | 有限会社 吹田印材製作所 | 合わせ印板 |
JPS61206466U (US07993877-20110809-P00003.png) * | 1985-06-17 | 1986-12-26 |
-
1973
- 1973-06-23 JP JP7488773U patent/JPS5021449U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53126719U (US07993877-20110809-P00003.png) * | 1977-03-14 | 1978-10-07 | ||
JPS56159253U (US07993877-20110809-P00003.png) * | 1980-04-28 | 1981-11-27 | ||
JPS56171250U (US07993877-20110809-P00003.png) * | 1980-05-23 | 1981-12-17 | ||
JPS59157846U (ja) * | 1983-04-07 | 1984-10-23 | 有限会社 吹田印材製作所 | 合わせ印板 |
JPS61206466U (US07993877-20110809-P00003.png) * | 1985-06-17 | 1986-12-26 |