JPS501786A - - Google Patents

Info

Publication number
JPS501786A
JPS501786A JP4846073A JP4846073A JPS501786A JP S501786 A JPS501786 A JP S501786A JP 4846073 A JP4846073 A JP 4846073A JP 4846073 A JP4846073 A JP 4846073A JP S501786 A JPS501786 A JP S501786A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4846073A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4846073A priority Critical patent/JPS501786A/ja
Publication of JPS501786A publication Critical patent/JPS501786A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
JP4846073A 1973-05-02 1973-05-02 Pending JPS501786A (US06826419-20041130-M00005.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4846073A JPS501786A (US06826419-20041130-M00005.png) 1973-05-02 1973-05-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4846073A JPS501786A (US06826419-20041130-M00005.png) 1973-05-02 1973-05-02

Publications (1)

Publication Number Publication Date
JPS501786A true JPS501786A (US06826419-20041130-M00005.png) 1975-01-09

Family

ID=12803963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4846073A Pending JPS501786A (US06826419-20041130-M00005.png) 1973-05-02 1973-05-02

Country Status (1)

Country Link
JP (1) JPS501786A (US06826419-20041130-M00005.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519900A (en) * 1978-07-26 1980-02-12 Nat Semiconductor Corp Method of manufacturing composite tape with bump for automatically bonding semiconductor device
JP2006186229A (ja) * 2004-12-28 2006-07-13 Mitsui High Tec Inc リードフレーム及びこれを用いた半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519900A (en) * 1978-07-26 1980-02-12 Nat Semiconductor Corp Method of manufacturing composite tape with bump for automatically bonding semiconductor device
JP2006186229A (ja) * 2004-12-28 2006-07-13 Mitsui High Tec Inc リードフレーム及びこれを用いた半導体装置

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