JPS5015741A - - Google Patents

Info

Publication number
JPS5015741A
JPS5015741A JP6763773A JP6763773A JPS5015741A JP S5015741 A JPS5015741 A JP S5015741A JP 6763773 A JP6763773 A JP 6763773A JP 6763773 A JP6763773 A JP 6763773A JP S5015741 A JPS5015741 A JP S5015741A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6763773A
Other languages
Japanese (ja)
Other versions
JPS5339857B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6763773A priority Critical patent/JPS5339857B2/ja
Publication of JPS5015741A publication Critical patent/JPS5015741A/ja
Publication of JPS5339857B2 publication Critical patent/JPS5339857B2/ja
Expired legal-status Critical Current

Links

JP6763773A 1973-06-15 1973-06-15 Expired JPS5339857B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6763773A JPS5339857B2 (en) 1973-06-15 1973-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6763773A JPS5339857B2 (en) 1973-06-15 1973-06-15

Publications (2)

Publication Number Publication Date
JPS5015741A true JPS5015741A (en) 1975-02-19
JPS5339857B2 JPS5339857B2 (en) 1978-10-24

Family

ID=13350694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6763773A Expired JPS5339857B2 (en) 1973-06-15 1973-06-15

Country Status (1)

Country Link
JP (1) JPS5339857B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328360A (en) * 1989-05-29 1991-02-06 Shimizu:Kk Immersion solder plating bath
US5104688A (en) * 1990-06-04 1992-04-14 Macdermid, Incorporated Pretreatment composition and process for tin-lead immersion plating
US5143544A (en) * 1990-06-04 1992-09-01 Shipley Company Inc. Tin lead plating solution
US5169692A (en) * 1991-11-19 1992-12-08 Shipley Company Inc. Tin lead process
US5173109A (en) * 1990-06-04 1992-12-22 Shipley Company Inc. Process for forming reflowable immersion tin lead deposit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328360A (en) * 1989-05-29 1991-02-06 Shimizu:Kk Immersion solder plating bath
US5104688A (en) * 1990-06-04 1992-04-14 Macdermid, Incorporated Pretreatment composition and process for tin-lead immersion plating
US5143544A (en) * 1990-06-04 1992-09-01 Shipley Company Inc. Tin lead plating solution
US5173109A (en) * 1990-06-04 1992-12-22 Shipley Company Inc. Process for forming reflowable immersion tin lead deposit
US5169692A (en) * 1991-11-19 1992-12-08 Shipley Company Inc. Tin lead process

Also Published As

Publication number Publication date
JPS5339857B2 (en) 1978-10-24

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