JPS5015741A - - Google Patents
Info
- Publication number
- JPS5015741A JPS5015741A JP6763773A JP6763773A JPS5015741A JP S5015741 A JPS5015741 A JP S5015741A JP 6763773 A JP6763773 A JP 6763773A JP 6763773 A JP6763773 A JP 6763773A JP S5015741 A JPS5015741 A JP S5015741A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6763773A JPS5339857B2 (en) | 1973-06-15 | 1973-06-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6763773A JPS5339857B2 (en) | 1973-06-15 | 1973-06-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5015741A true JPS5015741A (en) | 1975-02-19 |
JPS5339857B2 JPS5339857B2 (en) | 1978-10-24 |
Family
ID=13350694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6763773A Expired JPS5339857B2 (en) | 1973-06-15 | 1973-06-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5339857B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0328360A (en) * | 1989-05-29 | 1991-02-06 | Shimizu:Kk | Immersion solder plating bath |
US5104688A (en) * | 1990-06-04 | 1992-04-14 | Macdermid, Incorporated | Pretreatment composition and process for tin-lead immersion plating |
US5143544A (en) * | 1990-06-04 | 1992-09-01 | Shipley Company Inc. | Tin lead plating solution |
US5169692A (en) * | 1991-11-19 | 1992-12-08 | Shipley Company Inc. | Tin lead process |
US5173109A (en) * | 1990-06-04 | 1992-12-22 | Shipley Company Inc. | Process for forming reflowable immersion tin lead deposit |
-
1973
- 1973-06-15 JP JP6763773A patent/JPS5339857B2/ja not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0328360A (en) * | 1989-05-29 | 1991-02-06 | Shimizu:Kk | Immersion solder plating bath |
US5104688A (en) * | 1990-06-04 | 1992-04-14 | Macdermid, Incorporated | Pretreatment composition and process for tin-lead immersion plating |
US5143544A (en) * | 1990-06-04 | 1992-09-01 | Shipley Company Inc. | Tin lead plating solution |
US5173109A (en) * | 1990-06-04 | 1992-12-22 | Shipley Company Inc. | Process for forming reflowable immersion tin lead deposit |
US5169692A (en) * | 1991-11-19 | 1992-12-08 | Shipley Company Inc. | Tin lead process |
Also Published As
Publication number | Publication date |
---|---|
JPS5339857B2 (en) | 1978-10-24 |