JPS50134574A - - Google Patents
Info
- Publication number
- JPS50134574A JPS50134574A JP50037441A JP3744175A JPS50134574A JP S50134574 A JPS50134574 A JP S50134574A JP 50037441 A JP50037441 A JP 50037441A JP 3744175 A JP3744175 A JP 3744175A JP S50134574 A JPS50134574 A JP S50134574A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7404364A NL7404364A (nl) | 1974-04-01 | 1974-04-01 | Werkwijze en inrichting voor het bewerken van vlakke voorwerpen. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50134574A true JPS50134574A (ja) | 1975-10-24 |
Family
ID=19821089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50037441A Pending JPS50134574A (ja) | 1974-04-01 | 1975-03-29 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US4009540A (ja) |
| JP (1) | JPS50134574A (ja) |
| BE (1) | BE827435A (ja) |
| CA (1) | CA1010159A (ja) |
| CH (1) | CH583969A5 (ja) |
| DE (1) | DE2512400C2 (ja) |
| FR (1) | FR2266304B1 (ja) |
| GB (1) | GB1491938A (ja) |
| IT (1) | IT1049391B (ja) |
| NL (1) | NL7404364A (ja) |
| SE (1) | SE7503558L (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5364463A (en) * | 1976-11-22 | 1978-06-08 | Nippon Telegr & Teleph Corp <Ntt> | Fixing tray of semiconductor wafers |
| JPS53108763A (en) * | 1977-02-28 | 1978-09-21 | Siltec Corp | Device for polishing semiconductor wafer |
| JPH04180650A (ja) * | 1990-11-15 | 1992-06-26 | Nec Kyushu Ltd | フルカットダイシング用テープ |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0013684A1 (de) * | 1979-01-26 | 1980-08-06 | Heinrich Wagner Maschinenfabrik GmbH & Co | Form- oder Rüttelformmaschine |
| US4519168A (en) * | 1979-09-18 | 1985-05-28 | Speedfam Corporation | Liquid waxless fixturing of microsize wafers |
| US4707201A (en) * | 1986-08-20 | 1987-11-17 | Canadian Instrumentation And Research Limited | Method of producing polished block type, single mode, evanscent wave directional couplers by means of mass production of the coupler halves |
| JPH0828086B2 (ja) * | 1991-06-04 | 1996-03-21 | 富士通株式会社 | 磁気ヘッドスライダの製造装置及び製造方法 |
| US5220754A (en) * | 1992-03-02 | 1993-06-22 | Amad Tayebi | Recovered compact disk and a method and an apparatus for recovery thereof |
| US5267418A (en) * | 1992-05-27 | 1993-12-07 | International Business Machines Corporation | Confined water fixture for holding wafers undergoing chemical-mechanical polishing |
| US5398459A (en) * | 1992-11-27 | 1995-03-21 | Kabushiki Kaisha Toshiba | Method and apparatus for polishing a workpiece |
| FR2715503B1 (fr) * | 1994-01-26 | 1996-04-05 | Commissariat Energie Atomique | Substrat pour composants intégrés comportant une couche mince et son procédé de réalisation. |
| US5733175A (en) * | 1994-04-25 | 1998-03-31 | Leach; Michael A. | Polishing a workpiece using equal velocity at all points overlapping a polisher |
| US5607341A (en) * | 1994-08-08 | 1997-03-04 | Leach; Michael A. | Method and structure for polishing a wafer during manufacture of integrated circuits |
| US5632667A (en) * | 1995-06-29 | 1997-05-27 | Delco Electronics Corporation | No coat backside wafer grinding process |
| US20070122997A1 (en) | 1998-02-19 | 2007-05-31 | Silicon Genesis Corporation | Controlled process and resulting device |
| US6033974A (en) | 1997-05-12 | 2000-03-07 | Silicon Genesis Corporation | Method for controlled cleaving process |
| US5985742A (en) | 1997-05-12 | 1999-11-16 | Silicon Genesis Corporation | Controlled cleavage process and device for patterned films |
| US6291313B1 (en) | 1997-05-12 | 2001-09-18 | Silicon Genesis Corporation | Method and device for controlled cleaving process |
| US6548382B1 (en) | 1997-07-18 | 2003-04-15 | Silicon Genesis Corporation | Gettering technique for wafers made using a controlled cleaving process |
| US6291326B1 (en) | 1998-06-23 | 2001-09-18 | Silicon Genesis Corporation | Pre-semiconductor process implant and post-process film separation |
| US6263941B1 (en) | 1999-08-10 | 2001-07-24 | Silicon Genesis Corporation | Nozzle for cleaving substrates |
| US6500732B1 (en) | 1999-08-10 | 2002-12-31 | Silicon Genesis Corporation | Cleaving process to fabricate multilayered substrates using low implantation doses |
| FR2828579B1 (fr) * | 2001-08-13 | 2004-01-30 | St Microelectronics Sa | Procede de manipulation d'une plaquette de silicium mince |
| US7018268B2 (en) * | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
| US8187377B2 (en) | 2002-10-04 | 2012-05-29 | Silicon Genesis Corporation | Non-contact etch annealing of strained layers |
| US8293619B2 (en) | 2008-08-28 | 2012-10-23 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled propagation |
| US9362439B2 (en) | 2008-05-07 | 2016-06-07 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled shear region |
| US8993410B2 (en) | 2006-09-08 | 2015-03-31 | Silicon Genesis Corporation | Substrate cleaving under controlled stress conditions |
| US7811900B2 (en) | 2006-09-08 | 2010-10-12 | Silicon Genesis Corporation | Method and structure for fabricating solar cells using a thick layer transfer process |
| US8330126B2 (en) | 2008-08-25 | 2012-12-11 | Silicon Genesis Corporation | Race track configuration and method for wafering silicon solar substrates |
| US8329557B2 (en) | 2009-05-13 | 2012-12-11 | Silicon Genesis Corporation | Techniques for forming thin films by implantation with reduced channeling |
| DE102009052744B4 (de) * | 2009-11-11 | 2013-08-29 | Siltronic Ag | Verfahren zur Politur einer Halbleiterscheibe |
| CN103258764B (zh) * | 2012-02-21 | 2016-06-15 | 欣兴电子股份有限公司 | 用于晶片薄化的载具及其制法 |
| FR3012257A1 (fr) * | 2013-10-21 | 2015-04-24 | Soitec Silicon On Insulator | Procede de prehension d'un substrat |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2353066A (en) * | 1943-11-03 | 1944-07-04 | Walter W Phillips | Safety razor blade sharpener |
| US2443987A (en) * | 1945-10-13 | 1948-06-22 | O H Calhoun | Work holder |
| US2855653A (en) * | 1955-10-07 | 1958-10-14 | Tile Council Of America | Apparatus for making tile panels |
| US3004766A (en) * | 1959-11-02 | 1961-10-17 | Andrew J Bryant | Vacuum chuck |
| US3330714A (en) * | 1962-03-08 | 1967-07-11 | Vari Products Co | Method of adhering adhesive backed light reflector unit to a mounting surface |
| US3131476A (en) * | 1963-03-21 | 1964-05-05 | Philco Corp | Production of semiconductor blanks |
| DE1982787U (de) * | 1968-01-13 | 1968-04-04 | Albert Fezer | Vorrichtung zum halten von insbesondere duennwandigen werkstuecken, z. b. duennen blechen, folien od. dgl. |
| US3681139A (en) * | 1969-10-16 | 1972-08-01 | Western Electric Co | Method for handling and maintaining the orientation of a matrix of miniature electrical devices |
| US3740900A (en) * | 1970-07-01 | 1973-06-26 | Signetics Corp | Vacuum chuck assembly for semiconductor manufacture |
| US3809050A (en) * | 1971-01-13 | 1974-05-07 | Cogar Corp | Mounting block for semiconductor wafers |
-
1974
- 1974-04-01 NL NL7404364A patent/NL7404364A/xx not_active Application Discontinuation
-
1975
- 1975-03-21 DE DE2512400A patent/DE2512400C2/de not_active Expired
- 1975-03-25 US US05/561,938 patent/US4009540A/en not_active Expired - Lifetime
- 1975-03-26 SE SE7503558A patent/SE7503558L/xx unknown
- 1975-03-27 GB GB12923/75A patent/GB1491938A/en not_active Expired
- 1975-03-27 CH CH398575A patent/CH583969A5/xx not_active IP Right Cessation
- 1975-03-27 CA CA223,604A patent/CA1010159A/en not_active Expired
- 1975-03-28 IT IT21829/75A patent/IT1049391B/it active
- 1975-03-29 JP JP50037441A patent/JPS50134574A/ja active Pending
- 1975-04-01 FR FR7510153A patent/FR2266304B1/fr not_active Expired
- 1975-04-01 BE BE154987A patent/BE827435A/xx unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5364463A (en) * | 1976-11-22 | 1978-06-08 | Nippon Telegr & Teleph Corp <Ntt> | Fixing tray of semiconductor wafers |
| JPS542537B2 (ja) * | 1976-11-22 | 1979-02-08 | ||
| JPS53108763A (en) * | 1977-02-28 | 1978-09-21 | Siltec Corp | Device for polishing semiconductor wafer |
| JPS5833699B2 (ja) * | 1977-02-28 | 1983-07-21 | スイルテク・コ−ポレ−シヨン | 半導体ウエ−フア−用の研磨装置 |
| JPH04180650A (ja) * | 1990-11-15 | 1992-06-26 | Nec Kyushu Ltd | フルカットダイシング用テープ |
Also Published As
| Publication number | Publication date |
|---|---|
| CH583969A5 (ja) | 1977-01-14 |
| FR2266304B1 (ja) | 1978-07-13 |
| GB1491938A (en) | 1977-11-16 |
| US4009540A (en) | 1977-03-01 |
| FR2266304A1 (ja) | 1975-10-24 |
| BE827435A (fr) | 1975-10-01 |
| DE2512400C2 (de) | 1982-03-18 |
| SE7503558L (ja) | 1975-10-02 |
| NL7404364A (nl) | 1975-10-03 |
| DE2512400A1 (de) | 1975-10-02 |
| CA1010159A (en) | 1977-05-10 |
| IT1049391B (it) | 1981-01-20 |