JPS50108400A - - Google Patents

Info

Publication number
JPS50108400A
JPS50108400A JP1682574A JP1682574A JPS50108400A JP S50108400 A JPS50108400 A JP S50108400A JP 1682574 A JP1682574 A JP 1682574A JP 1682574 A JP1682574 A JP 1682574A JP S50108400 A JPS50108400 A JP S50108400A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1682574A
Other languages
Japanese (ja)
Other versions
JPS529480B2 (forum.php
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49016825A priority Critical patent/JPS529480B2/ja
Publication of JPS50108400A publication Critical patent/JPS50108400A/ja
Publication of JPS529480B2 publication Critical patent/JPS529480B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP49016825A 1974-02-01 1974-02-01 Expired JPS529480B2 (forum.php)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49016825A JPS529480B2 (forum.php) 1974-02-01 1974-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49016825A JPS529480B2 (forum.php) 1974-02-01 1974-02-01

Publications (2)

Publication Number Publication Date
JPS50108400A true JPS50108400A (forum.php) 1975-08-26
JPS529480B2 JPS529480B2 (forum.php) 1977-03-16

Family

ID=11926943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49016825A Expired JPS529480B2 (forum.php) 1974-02-01 1974-02-01

Country Status (1)

Country Link
JP (1) JPS529480B2 (forum.php)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555929A (en) * 1978-06-26 1980-01-17 Nitto Electric Ind Co Ltd Semiconductor sealing epoxy resin composition
JPS5598848A (en) * 1979-01-24 1980-07-28 Hitachi Ltd Resin-sealed type semiconductor device
DE3100536A1 (de) 1980-01-14 1981-12-17 Plaskon Products Inc., 43614 Toledo, Ohio Verfahren zur herstellung einer gratbildungsbestaendigen epoxyeinkapselungsmasse
JPS57109642A (en) * 1980-12-27 1982-07-08 Toshiba Chem Prod Copper plated laminated board
JPS63269555A (ja) * 1987-04-27 1988-11-07 Nitto Electric Ind Co Ltd 半導体装置
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200172A (en) * 1958-12-18 1965-08-10 Ciba Ltd Moulding compositions comprising epoxidized novolak, novolak and amine
US3280216A (en) * 1962-04-20 1966-10-18 Dow Chemical Co Self-extinguishing epoxy resin containing a halogenated polynuclear phenol and a hardening agent
US3519697A (en) * 1968-04-15 1970-07-07 Gen Electric Flame retardant epoxy resins

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200172A (en) * 1958-12-18 1965-08-10 Ciba Ltd Moulding compositions comprising epoxidized novolak, novolak and amine
US3280216A (en) * 1962-04-20 1966-10-18 Dow Chemical Co Self-extinguishing epoxy resin containing a halogenated polynuclear phenol and a hardening agent
US3519697A (en) * 1968-04-15 1970-07-07 Gen Electric Flame retardant epoxy resins

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555929A (en) * 1978-06-26 1980-01-17 Nitto Electric Ind Co Ltd Semiconductor sealing epoxy resin composition
JPS5598848A (en) * 1979-01-24 1980-07-28 Hitachi Ltd Resin-sealed type semiconductor device
DE3100536A1 (de) 1980-01-14 1981-12-17 Plaskon Products Inc., 43614 Toledo, Ohio Verfahren zur herstellung einer gratbildungsbestaendigen epoxyeinkapselungsmasse
DE3153142C2 (forum.php) * 1980-01-14 1991-11-14 Plaskon Products Inc., Toledo, Ohio, Us
JPS57109642A (en) * 1980-12-27 1982-07-08 Toshiba Chem Prod Copper plated laminated board
JPS63269555A (ja) * 1987-04-27 1988-11-07 Nitto Electric Ind Co Ltd 半導体装置
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device

Also Published As

Publication number Publication date
JPS529480B2 (forum.php) 1977-03-16

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