JPS5010636B2 - - Google Patents
Info
- Publication number
- JPS5010636B2 JPS5010636B2 JP6297771A JP6297771A JPS5010636B2 JP S5010636 B2 JPS5010636 B2 JP S5010636B2 JP 6297771 A JP6297771 A JP 6297771A JP 6297771 A JP6297771 A JP 6297771A JP S5010636 B2 JPS5010636 B2 JP S5010636B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Epoxy Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6297771A JPS5010636B2 (zh) | 1971-08-20 | 1971-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6297771A JPS5010636B2 (zh) | 1971-08-20 | 1971-08-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4829899A JPS4829899A (zh) | 1973-04-20 |
| JPS5010636B2 true JPS5010636B2 (zh) | 1975-04-23 |
Family
ID=13215912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6297771A Expired JPS5010636B2 (zh) | 1971-08-20 | 1971-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5010636B2 (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6231042U (zh) * | 1985-08-12 | 1987-02-24 | ||
| EP2546275A2 (en) | 2002-09-05 | 2013-01-16 | Daicel Chemical Industries, Ltd. | Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation. |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5226162B2 (ja) * | 2001-05-14 | 2013-07-03 | 株式会社ダイセル | 液状エポキシ樹脂組成物及びその用途 |
| US20030059618A1 (en) | 2001-03-23 | 2003-03-27 | Hideyuke Takai | Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can |
| CN1934098B (zh) * | 2004-03-18 | 2012-04-25 | 大赛璐化学工业株式会社 | 高纯度脂环式环氧化合物、其制备方法、可固化环氧树脂组合物、其固化产物及其应用 |
| JP4688503B2 (ja) | 2005-01-07 | 2011-05-25 | ダイセル化学工業株式会社 | 高純度脂環式ジエポキシ化合物およびその製造方法 |
| JP5340726B2 (ja) * | 2006-04-18 | 2013-11-13 | 株式会社ダイセル | 環状オレフィン化合物の製造方法 |
| JP6962449B2 (ja) * | 2018-03-07 | 2021-11-05 | Jsr株式会社 | 液晶配向剤、液晶配向膜及び液晶素子 |
-
1971
- 1971-08-20 JP JP6297771A patent/JPS5010636B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6231042U (zh) * | 1985-08-12 | 1987-02-24 | ||
| EP2546275A2 (en) | 2002-09-05 | 2013-01-16 | Daicel Chemical Industries, Ltd. | Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation. |
| EP2546275A3 (en) * | 2002-09-05 | 2013-05-22 | Daicel Chemical Industries, Ltd. | Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation. |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4829899A (zh) | 1973-04-20 |