JPS4975274A - - Google Patents
Info
- Publication number
- JPS4975274A JPS4975274A JP11842372A JP11842372A JPS4975274A JP S4975274 A JPS4975274 A JP S4975274A JP 11842372 A JP11842372 A JP 11842372A JP 11842372 A JP11842372 A JP 11842372A JP S4975274 A JPS4975274 A JP S4975274A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11842372A JPS4975274A (US06486227-20021126-C00005.png) | 1972-11-24 | 1972-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11842372A JPS4975274A (US06486227-20021126-C00005.png) | 1972-11-24 | 1972-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4975274A true JPS4975274A (US06486227-20021126-C00005.png) | 1974-07-19 |
Family
ID=14736260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11842372A Pending JPS4975274A (US06486227-20021126-C00005.png) | 1972-11-24 | 1972-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4975274A (US06486227-20021126-C00005.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5383581A (en) * | 1976-12-29 | 1978-07-24 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
| JPS55145348A (en) * | 1979-04-27 | 1980-11-12 | Toshiba Corp | Fabricating method of semiconductor device |
-
1972
- 1972-11-24 JP JP11842372A patent/JPS4975274A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5383581A (en) * | 1976-12-29 | 1978-07-24 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
| JPS55145348A (en) * | 1979-04-27 | 1980-11-12 | Toshiba Corp | Fabricating method of semiconductor device |
