JPS495385B1 - - Google Patents
Info
- Publication number
- JPS495385B1 JPS495385B1 JP5645069A JP5645069A JPS495385B1 JP S495385 B1 JPS495385 B1 JP S495385B1 JP 5645069 A JP5645069 A JP 5645069A JP 5645069 A JP5645069 A JP 5645069A JP S495385 B1 JPS495385 B1 JP S495385B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5645069A JPS495385B1 (US06272168-20010807-M00014.png) | 1969-07-18 | 1969-07-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5645069A JPS495385B1 (US06272168-20010807-M00014.png) | 1969-07-18 | 1969-07-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS495385B1 true JPS495385B1 (US06272168-20010807-M00014.png) | 1974-02-06 |
Family
ID=13027420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5645069A Pending JPS495385B1 (US06272168-20010807-M00014.png) | 1969-07-18 | 1969-07-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS495385B1 (US06272168-20010807-M00014.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5274792U (US06272168-20010807-M00014.png) * | 1975-12-03 | 1977-06-03 | ||
JPS63191967U (US06272168-20010807-M00014.png) * | 1987-05-30 | 1988-12-09 |
-
1969
- 1969-07-18 JP JP5645069A patent/JPS495385B1/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5274792U (US06272168-20010807-M00014.png) * | 1975-12-03 | 1977-06-03 | ||
JPS63191967U (US06272168-20010807-M00014.png) * | 1987-05-30 | 1988-12-09 |