JPS4922583B1 - - Google Patents
Info
- Publication number
- JPS4922583B1 JPS4922583B1 JP6683870A JP6683870A JPS4922583B1 JP S4922583 B1 JPS4922583 B1 JP S4922583B1 JP 6683870 A JP6683870 A JP 6683870A JP 6683870 A JP6683870 A JP 6683870A JP S4922583 B1 JPS4922583 B1 JP S4922583B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6683870A JPS4922583B1 (US07655688-20100202-C00086.png) | 1970-07-29 | 1970-07-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6683870A JPS4922583B1 (US07655688-20100202-C00086.png) | 1970-07-29 | 1970-07-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4922583B1 true JPS4922583B1 (US07655688-20100202-C00086.png) | 1974-06-10 |
Family
ID=13327375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6683870A Pending JPS4922583B1 (US07655688-20100202-C00086.png) | 1970-07-29 | 1970-07-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4922583B1 (US07655688-20100202-C00086.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5296478U (US07655688-20100202-C00086.png) * | 1976-01-19 | 1977-07-19 | ||
JPS56215U (US07655688-20100202-C00086.png) * | 1979-06-12 | 1981-01-06 | ||
JPS60206423A (ja) * | 1984-03-29 | 1985-10-18 | Tachikawa Spring Co Ltd | 集塵装置 |
JPH04102614U (ja) * | 1991-02-08 | 1992-09-04 | 三菱自動車工業株式会社 | 集塵機のフイルタはたき装置 |
-
1970
- 1970-07-29 JP JP6683870A patent/JPS4922583B1/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5296478U (US07655688-20100202-C00086.png) * | 1976-01-19 | 1977-07-19 | ||
JPS56215U (US07655688-20100202-C00086.png) * | 1979-06-12 | 1981-01-06 | ||
JPS60206423A (ja) * | 1984-03-29 | 1985-10-18 | Tachikawa Spring Co Ltd | 集塵装置 |
JPH04102614U (ja) * | 1991-02-08 | 1992-09-04 | 三菱自動車工業株式会社 | 集塵機のフイルタはたき装置 |