JPS4895776A - - Google Patents
Info
- Publication number
- JPS4895776A JPS4895776A JP2666472A JP2666472A JPS4895776A JP S4895776 A JPS4895776 A JP S4895776A JP 2666472 A JP2666472 A JP 2666472A JP 2666472 A JP2666472 A JP 2666472A JP S4895776 A JPS4895776 A JP S4895776A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2666472A JPS5232718B2 (enrdf_load_stackoverflow) | 1972-03-17 | 1972-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2666472A JPS5232718B2 (enrdf_load_stackoverflow) | 1972-03-17 | 1972-03-17 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15496775A Division JPS51115779A (en) | 1975-12-26 | 1975-12-26 | Semiconductor apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4895776A true JPS4895776A (enrdf_load_stackoverflow) | 1973-12-07 |
| JPS5232718B2 JPS5232718B2 (enrdf_load_stackoverflow) | 1977-08-23 |
Family
ID=12199661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2666472A Expired JPS5232718B2 (enrdf_load_stackoverflow) | 1972-03-17 | 1972-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5232718B2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7772677B2 (en) | 2006-02-02 | 2010-08-10 | Fuji Electric Systems Co., Ltd. | Semiconductor device and method of forming the same having a junction termination structure with a beveled sidewall |
-
1972
- 1972-03-17 JP JP2666472A patent/JPS5232718B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7772677B2 (en) | 2006-02-02 | 2010-08-10 | Fuji Electric Systems Co., Ltd. | Semiconductor device and method of forming the same having a junction termination structure with a beveled sidewall |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5232718B2 (enrdf_load_stackoverflow) | 1977-08-23 |