JPS4861959A - - Google Patents

Info

Publication number
JPS4861959A
JPS4861959A JP46098883A JP9888371A JPS4861959A JP S4861959 A JPS4861959 A JP S4861959A JP 46098883 A JP46098883 A JP 46098883A JP 9888371 A JP9888371 A JP 9888371A JP S4861959 A JPS4861959 A JP S4861959A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP46098883A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46098883A priority Critical patent/JPS4861959A/ja
Priority to US00308465A priority patent/US3851223A/en
Publication of JPS4861959A publication Critical patent/JPS4861959A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP46098883A 1971-12-06 1971-12-06 Pending JPS4861959A (US06277897-20010821-C00009.png)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP46098883A JPS4861959A (US06277897-20010821-C00009.png) 1971-12-06 1971-12-06
US00308465A US3851223A (en) 1971-12-06 1972-11-21 Microcircuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46098883A JPS4861959A (US06277897-20010821-C00009.png) 1971-12-06 1971-12-06

Publications (1)

Publication Number Publication Date
JPS4861959A true JPS4861959A (US06277897-20010821-C00009.png) 1973-08-30

Family

ID=14231533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46098883A Pending JPS4861959A (US06277897-20010821-C00009.png) 1971-12-06 1971-12-06

Country Status (2)

Country Link
US (1) US3851223A (US06277897-20010821-C00009.png)
JP (1) JPS4861959A (US06277897-20010821-C00009.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144154U (US06277897-20010821-C00009.png) * 1978-03-30 1979-10-06
CN100372445C (zh) * 2003-08-21 2008-02-27 三星电子株式会社 印刷电路板及具有该印刷电路板的成像装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5441102B2 (US06277897-20010821-C00009.png) * 1975-03-04 1979-12-06
US4389771A (en) * 1981-01-05 1983-06-28 Western Electric Company, Incorporated Treatment of a substrate surface to reduce solder sticking
JPS62263693A (ja) * 1986-05-05 1987-11-16 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 電子部品をプリント回路基板にはんだ付けする方法
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造
JPH0183331U (US06277897-20010821-C00009.png) * 1987-11-25 1989-06-02
FR2723502B1 (fr) * 1994-08-04 1997-01-10 Valeo Electronique Borne collectrice pour la mise en contact d'une pile pour l'alimentation d'un circuit electronique, circuit electronique et emetteur de telecommande l'incorporant
US5644475A (en) * 1994-09-30 1997-07-01 Allen-Bradley Company, Inc. Solder mask for a finger connector on a single in-line package module
FR2781068B1 (fr) * 1998-07-07 2000-10-13 Rue Cartes Et Systemes De Procede de fabrication d'une carte a microcircuit permettant de limiter les contraintes mecaniques transmises a celui-ci et carte ainsi obtenue
JP3575001B2 (ja) * 1999-05-07 2004-10-06 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
US6347175B1 (en) 1999-07-14 2002-02-12 Corning Incorporated Solderable thin film
WO2012066465A1 (en) * 2010-11-19 2012-05-24 Koninklijke Philips Electronics N.V. Soldering connection with a wetting and non-wetting metal layer
US8802556B2 (en) * 2012-11-14 2014-08-12 Qualcomm Incorporated Barrier layer on bump and non-wettable coating on trace

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144154U (US06277897-20010821-C00009.png) * 1978-03-30 1979-10-06
CN100372445C (zh) * 2003-08-21 2008-02-27 三星电子株式会社 印刷电路板及具有该印刷电路板的成像装置

Also Published As

Publication number Publication date
US3851223A (en) 1974-11-26

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