JPS4852379A - - Google Patents

Info

Publication number
JPS4852379A
JPS4852379A JP8700671A JP8700671A JPS4852379A JP S4852379 A JPS4852379 A JP S4852379A JP 8700671 A JP8700671 A JP 8700671A JP 8700671 A JP8700671 A JP 8700671A JP S4852379 A JPS4852379 A JP S4852379A
Authority
JP
Grant status
Application
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8700671A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

JP8700671A 1971-11-01 1971-11-01 Pending JPS4852379A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8700671A JPS4852379A (en) 1971-11-01 1971-11-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8700671A JPS4852379A (en) 1971-11-01 1971-11-01

Publications (1)

Publication Number Publication Date
JPS4852379A true true JPS4852379A (en) 1973-07-23

Family

ID=13902822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8700671A Pending JPS4852379A (en) 1971-11-01 1971-11-01

Country Status (1)

Country Link
JP (1) JPS4852379A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50132637U (en) * 1974-04-17 1975-10-31
JPS6063953A (en) * 1984-07-06 1985-04-12 Hitachi Ltd Resin-sealed semiconductor device
JPH0282560A (en) * 1988-09-19 1990-03-23 Matsushita Electron Corp Semiconductor device
JPH03194957A (en) * 1989-12-21 1991-08-26 Internatl Business Mach Corp <Ibm> Plastic chip circuit package, method for increasing heat dissipation of electronic component, and method for mounting heat sink element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50132637U (en) * 1974-04-17 1975-10-31
JPS5519007Y2 (en) * 1974-04-17 1980-05-06
JPS6063953A (en) * 1984-07-06 1985-04-12 Hitachi Ltd Resin-sealed semiconductor device
JPH0282560A (en) * 1988-09-19 1990-03-23 Matsushita Electron Corp Semiconductor device
JPH03194957A (en) * 1989-12-21 1991-08-26 Internatl Business Mach Corp <Ibm> Plastic chip circuit package, method for increasing heat dissipation of electronic component, and method for mounting heat sink element