JPS482400B1 - - Google Patents

Info

Publication number
JPS482400B1
JPS482400B1 JP576468A JP576468A JPS482400B1 JP S482400 B1 JPS482400 B1 JP S482400B1 JP 576468 A JP576468 A JP 576468A JP 576468 A JP576468 A JP 576468A JP S482400 B1 JPS482400 B1 JP S482400B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP576468A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS482400B1 publication Critical patent/JPS482400B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/927—Electromigration resistant metallization
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP576468A 1967-02-03 1968-02-01 Pending JPS482400B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61394767A 1967-02-03 1967-02-03

Publications (1)

Publication Number Publication Date
JPS482400B1 true JPS482400B1 (ja) 1973-01-24

Family

ID=24459309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP576468A Pending JPS482400B1 (ja) 1967-02-03 1968-02-01

Country Status (4)

Country Link
US (1) US3474530A (ja)
JP (1) JPS482400B1 (ja)
BE (1) BE709744A (ja)
FR (1) FR1558596A (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3548491A (en) * 1967-02-03 1970-12-22 Ibm Mass production of electronic devices
NL87258C (ja) * 1969-01-15
US3879840A (en) * 1969-01-15 1975-04-29 Ibm Copper doped aluminum conductive stripes and method therefor
US3878442A (en) * 1970-05-26 1975-04-15 Harshad J Bhatt Electrical conductor having a high resistance to electromigration
US3631304A (en) * 1970-05-26 1971-12-28 Cogar Corp Semiconductor device, electrical conductor and fabrication methods therefor
US4534100A (en) * 1982-06-28 1985-08-13 The United States Of America As Represented By The Secretary Of The Air Force Electrical method of making conductive paths in silicon
USRE32625E (en) * 1983-01-05 1988-03-15 Syracuse University Dynamic testing of electrical conductors
US4483629A (en) * 1983-01-05 1984-11-20 Syracuse University Dynamic testing of electrical conductors
US4606781A (en) * 1984-10-18 1986-08-19 Motorola, Inc. Method for resistor trimming by metal migration
US4652812A (en) * 1984-11-27 1987-03-24 Harris Corporation One-sided ion migration velocity measurement and electromigration failure warning device
US5497076A (en) * 1993-10-25 1996-03-05 Lsi Logic Corporation Determination of failure criteria based upon grain boundary electromigration in metal alloy films
US5612627A (en) * 1994-12-01 1997-03-18 Advanced Micro Devices, Inc. Method for evaluating the effect of a barrier layer on electromigration for plug and non-plug interconnect systems
JP2880695B2 (ja) * 1996-09-27 1999-04-12 松下電子工業株式会社 半導体記憶装置の加速試験方法
JP3189778B2 (ja) * 1998-03-11 2001-07-16 日本電気株式会社 配線の温度上昇シミュレーション方法
JP4480649B2 (ja) * 2005-09-05 2010-06-16 富士通マイクロエレクトロニクス株式会社 ヒューズ素子及びその切断方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2799824A (en) * 1953-03-10 1957-07-16 Louis N Heynick Shock testing device

Also Published As

Publication number Publication date
US3474530A (en) 1969-10-28
FR1558596A (ja) 1969-02-28
BE709744A (ja) 1968-05-30

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