JPS4410453Y1 - - Google Patents

Info

Publication number
JPS4410453Y1
JPS4410453Y1 JP4365566U JP4365566U JPS4410453Y1 JP S4410453 Y1 JPS4410453 Y1 JP S4410453Y1 JP 4365566 U JP4365566 U JP 4365566U JP 4365566 U JP4365566 U JP 4365566U JP S4410453 Y1 JPS4410453 Y1 JP S4410453Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4365566U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4365566U priority Critical patent/JPS4410453Y1/ja
Publication of JPS4410453Y1 publication Critical patent/JPS4410453Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
JP4365566U 1966-05-11 1966-05-11 Expired JPS4410453Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4365566U JPS4410453Y1 (en) 1966-05-11 1966-05-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4365566U JPS4410453Y1 (en) 1966-05-11 1966-05-11

Publications (1)

Publication Number Publication Date
JPS4410453Y1 true JPS4410453Y1 (en) 1969-04-26

Family

ID=31778381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4365566U Expired JPS4410453Y1 (en) 1966-05-11 1966-05-11

Country Status (1)

Country Link
JP (1) JPS4410453Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240974A (en) * 1975-09-27 1977-03-30 Mitsubishi Electric Corp Package for semiconductor chips

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240974A (en) * 1975-09-27 1977-03-30 Mitsubishi Electric Corp Package for semiconductor chips

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