JPH1174561A - Photoelectric device and its forming method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photoelectric device of stable light-electricity conversion characteristics independent of usage environment, relating to a photoelectric device, while size-reduction is possible, which is utilized with an indicator, a display, a photo coupler, a back light source, an optical printer head, etc. SOLUTION: A photoelectric device comprises a package 101 provided with an opening part, a first and a second external electrodes 106 which provide conduction between the inside of opening of the package 101 and the outside part, a photoelectric element 105 which, allocated inside the opening part of the package 101, is electrically connected to the first and the second outside electrodes 106, respectively, and a mold member 103 which is, while coating the photoelectric element 105 inside the opening part of the package 101, allocated lower than the surface of the package 101, and the mold member 103 is of silicon resin while the package 101 comprises a holding means 102 for holding the mold member 103.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compact photoelectric device used for various indicators, optical sensors, displays, photocouplers, backlight light sources, optical printer heads, and the like. The present invention relates to a photoelectric device having improved photoelectric conversion characteristics.

[0002]

2. Description of the Related Art A light emitting device using an LED, which is a type of photoelectric device, can be made smaller than a light bulb or the like, and is more resistant to vibration.
It has begun to be applied to various fields due to its excellent light emission characteristics at the time of ff. FIGS. 4 and 5 are schematic cross-sectional views of a chip type LED as a light emitting device. LED chip 20
5 is protected by a package 201 made of a material such as various resins or ceramics so as to be easily handled at the time of soldering or transportation. The package 201 has an opening inside which the LED chip 205 can be arranged, and is electrically connected so that power can be supplied from the outside to the LED chip 205 arranged inside through an external electrode 206 provided in the package. .

Specifically, the LED chip 205 is die-bonded in the opening of the package 201 with an Ag paste 208 or the like. The die-bonded LED chip 205 is electrically connected to an external electrode 206 provided on the package via an Ag paste. The other electrode of the LED chip is wire-bonded to another external electrode provided on the package by a gold wire 207.

A light-transmitting mold member 203 is provided in the package opening to protect the LED chip from dust and the like. The translucent mold member 203 is
It can be formed relatively easily by filling a thermosetting epoxy resin or the like in one opening and heat-curing. The formed mold member 203 is the LED chip 2
05 and the package 201. Thus, a photoelectric device that can be reduced in size can be obtained.

In consideration of heat dissipation and strength, the package 201
If a material such as ceramic or FRP is used for the material,
When exposed to a high temperature such as an excessive heat cycle test or soldering, the photoelectric characteristics may be reduced, or the light emission or light reception characteristics may not function. This is a particularly serious problem at present when high reliability is required even in a severe environment such as a temperature cycle such as for a vehicle.

Although the reason for such a problem is not clear,
It is considered that the thermal expansion and the elastic modulus of the mold member 201 and the package greatly contribute. In particular, package 201
If the coefficient of thermal expansion of the material is smaller than the mold member 203 and the strength is higher, the LED chip 205 or the conductive wire 20 may be used.
Excessive force works on 7 etc. Therefore, the LED chip 20
5 for connecting conductive paste to external electrode 206
It is considered that the electrical characteristics are reduced or the light is not emitted due to the crack of No. 8 or the disconnection of the conductive wire 207. These can be solved by using a material having a high elastic modulus.

On the other hand, the mold member satisfies the above-mentioned characteristics and has other characteristics such as (1) having a light-transmitting property, (2) being excellent in weather resistance, and (3) being excellent in adhesion. Needs to be satisfied. At present, there is no resin that satisfies all these properties by itself. The present inventor has found that a silicone resin can be selected as a material for a mold member that relatively satisfies these characteristics.

[0008]

However, the silicone resin has an adhesive property and causes adhesion of dust and the like, but does not have sufficient adhesiveness to the package. Also, the silicone resin tends to crawl up the package side wall due to surface tension. When the mold member crawls also on the surface side of the package, the mold member comes into contact with an external one and an external force is easily applied. The protruding mold member is liable to be attached to dust and to be easily caught by an external member. For example, there is a problem that the mold member is relatively easily peeled off from the package by contacting or being caught with a sorter for classifying light emission characteristics or other components on the substrate. In today's day when reliability is required to be further improved with the expansion of the use environment, the photoelectric device having the above configuration is not sufficient, and a more reliable photoelectric device is required. Therefore, an object of the present invention is to provide a more reliable photoelectric device.

[0009]

SUMMARY OF THE INVENTION The present invention provides a package having an opening, first and second external electrodes capable of conducting between the inside of the opening of the package and the outside, and disposed in the opening of the package. The present invention relates to a photoelectric device having a photoelectric element electrically connected to first and second external electrodes, respectively, and a mold member that covers the photoelectric element in the package opening and is disposed lower than the surface of the package opening. is there. In particular, in the photoelectric device of the present invention,
The mold member is a silicone resin, and has a holding means for holding the mold member in a package.

The photoelectric device according to the second aspect of the present invention uses at least one end on the package surface side narrower than the inside of the opening where the photoelectric element is arranged as the holding means.

In the photoelectric device according to a third aspect of the present invention, the package is made of ceramic and the mold member exposed from the package is depressed when viewed from the light emission observation surface side.

According to a fourth aspect of the present invention, in the photoelectric device, the photoelectric element is a light-emitting element and the mold member contains a phosphor.

According to a fifth aspect of the present invention, there is provided a method for forming a photoelectric device, comprising: a package having an opening and at least a first and a second external electrode disposed therein; and a first and a second external electrode. And a mold member that is electrically connected to each other and is provided in the package opening, and a mold member that covers the photoelectric element in the package opening. In particular, a step of pouring the silicone resin into a narrower opening than at least one end of the package surface side where the photoelectric element is arranged;
A step of heating and curing a silicone resin to form a mold member; and a method of forming an optoelectronic device.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION As a result of various experiments, the inventor of the present invention has found that the reliability can be significantly improved by selecting a silicone resin for a mold member and forming a package into a specific shape. Reached.

That is, by selecting a silicone resin for the mold member, the electrical characteristics are deteriorated due to cracks in the conductive paste for connecting the LED chip and the external electrodes and disconnection of the conductive wires when the temperature of the photoelectric device is raised. In this case, the low adhesiveness of the silicone resin is improved in the form of a package while suppressing light emission or non-emission. Hereinafter, an example of the present invention is shown in FIG. FIG. 1 is a schematic cross-sectional view of an optical sensor using a light receiving element as a photoelectric element.

The package used was a polycarbonate resin containing glass fibers in which a pair of lead frames were arranged as external electrodes. Amorphous silicon was deposited as a photoelectric element on a glass substrate by a plasma CVD method. The photoelectric element has a pair of electrodes provided on N-type silicon. The electrodes on the photoelectric element and the external electrodes were electrically connected to each other using an Ag paste. Thus, the photoelectric device was formed by pouring the silicone resin into the package in which the light receiving elements were arranged. The surface of the package opening is
It is narrower than the bottom surface where the light receiving element is arranged. The surface of the silicone resin is disposed below the height of the surface on the package opening side.

[0017] With the photoelectric device having such a structure, the photoelectric device can be protected from an external environment while being resistant to a temperature cycle. Hereinafter, each configuration of the present invention will be described in detail.

(Package 101) The package 101 has a photoelectric element 105 disposed at least inside to protect it from an external environment. The package 101 is provided with an external electrode 106 that can electrically connect the photoelectric element 105 disposed inside to the outside. Therefore,
Various shapes are available depending on the number and size of the photoelectric elements 105. Specifically, a U-shaped package 101
Examples include a photocoupler having an opening that opposes the tip and arranges a light receiving element and a light emitting element in a set.

The characteristics required of the package 101 include (1) sufficient strength to protect the internal photoelectric element 105 from external force, and (2) insulation from the photoelectric element 105 is maintained. (3) The mold member 103 can be formed into a shape that can be held. Specific examples of such a package 101 material include a ceramic substrate and various types of FRP (fiber-reinforced plastics).
And the like. A material in which the package 101 is made of an inorganic material, such as ceramic or glass fiber, has a smaller thermal expansion coefficient and higher strength than a resin used for a molding member.

Package 101 Using Ceramic
Is a method in which a green sheet is laminated in multiple layers as a material before ceramic firing, and an inner space (in a package opening) in which the photoelectric element 105 is arranged and a molding member 10 are arranged.
3 can be formed relatively easily. Further, the external electrode 10 can be relatively easily formed only by printing a W (tungsten) paste on a green sheet.
6 can be formed. In particular, LEDs that generate a large amount of heat
In the case of a light emitting device such as a light emitting device or an LD, the light emission luminance and the light emission wavelength may change due to a rise in temperature of the light emitting device itself. Therefore, it is desired that the package 101 itself has good heat dissipation and efficiently discharges heat from the light emitting element to the outside. Especially,
Ceramics are preferably mentioned as a more excellent material in terms of miniaturization, heat dissipation and strength.

Since the ceramic has porosity, the resin constituting the mold member may leak out of the hole, so that the amount of the mold member is reduced, and the shape is depressed when viewed from the light emission observation surface side (from the vertical section of the package). Look at the concave shape)
It is preferable that

(Holding means 102, 112, 122, 13)
2) The holding means 102 holds the mold member 103 so as to be hard to separate from the package 101. Accordingly, examples of the holding unit include a unit provided with a hole or a groove in a side wall or the like inside the package 101, a unit 122 having a protrusion in an opening of the package 101, and a unit 132 having a hook inside. Furthermore, at least one end 10 on the package surface side narrower than the inside of the opening where the photoelectric element 105 is arranged.
Various shapes, such as providing two, can be adopted. A plurality of holding means 102 can be provided, and a plurality of desired shapes can be combined. Such holding means 1
02 is shown in FIGS. 3A, 3B and 3C. FIG.
(A), (B), (C) are all schematic longitudinal sectional views of the photoelectric device. 1 and 2 have the same reference numerals. FIG. 3A shows the holding means 112 in which the entire surface side of the package 101 is narrower than the inside of the opening where the photoelectric elements are arranged. Accordingly, the holding means 11 can be formed with a relatively simple configuration while reducing external damage.
2 can be configured. In FIG. 3B, a groove 122 is provided on the inner side wall of the package opening, and the mold member enters the inside of the groove 122. This groove functions as the holding means 122. Thereby, it is possible to hold the mold member while increasing the opening area. FIG. 3C shows a case where wedge-shaped holding means 132 are provided in two stages in the depth direction on the side wall inside the opening of the package 101. Thereby, the mold member 103 can be more firmly held.

In particular, by making a part of the surface of the package 101 narrower than the inside where the photoelectric element 105 is arranged, it is possible to prevent the mold member 103 from rising. Therefore, dust can be reduced from adhering to the silicone resin constituting the mold member 103. In addition, it can be prevented from being caught outside.

(Mold member 103) Mold member 10
3 is a photoelectric device 10 provided inside the package 101.
5 and the conductive wire 107 are protected from dust, moisture, external force, and the like. In the present invention, a silicone resin is selected as the mold member 103. Silicone resin has lower physical strength and lower adhesiveness than epoxy resin and the like. Also, the coefficient of thermal expansion is high. However, it has excellent heat resistance and water repellency. In addition, it can have a certain degree of strength and a light-transmitting property. Furthermore, it has excellent characteristics such as high elastic modulus and is considered not to accumulate moisture inside.

For this reason, the molding member 101 such as soldering
Even if thermal expansion and thermal contraction are repeated, the conductive paste and the die bond resin 108 which are the electrical connection members between the photoelectric element 105 and the external electrodes 106 are not damaged.

On the other hand, the silicone resin has an adhesive property and causes adhesion of dust and the like, but the adhesive property with the package 101 is not sufficient. Also, the mold member 103 tends to crawl on the side wall of the package 101 due to surface tension. The mold member 103 is also provided outside the opening of the package 101.
When crawling up, an external force is likely to be applied to the mold member 103. The protruding mold member 103 is liable to be stuck to an external object while dust adheres thereto, and is relatively easily peeled off by an external force.

Therefore, it is preferable that the silicone resin accommodated in the package 101 be disposed inside the surface of the package 101 rather than inside. Accordingly, adhesion of dust and the like from the outside is reduced, and the silicone resin that has protruded from the package 101 by some protrusion is less likely to be peeled off. In particular, when ceramic is used for the package 101, the ceramic package 101 itself has porosity. Therefore, the amount of resin of the mold member 103 is reduced so that the resin does not easily seep out onto the surface of the package 101. As a result, the mold member 103 exposed from the package 101
Is more preferably a concave shape when viewed from the light emission observation surface side.

The mold member 103 may contain various components such as a colorant, a light stabilizer, and a fluorescent material, if desired. Specifically, a coloring agent such as a pigment or a dye is included for the purpose of cutting unnecessary wavelengths in accordance with the emission wavelength and the reception wavelength of the light emitting element. Further, a benzotriazole-based ultraviolet absorber or the like for absorbing light emitted from the light emitting element or ultraviolet light emitted from the outside or reflecting infrared light, or titanium oxide serving as an infrared reflecting member can be used.

(Phosphor 104) The phosphor 104 is a light emitting element.
Can emit other wavelengths in response to the emission wavelength
And the sensitivity of the light receiving element by receiving a specific wavelength from the outside
It can be combined. In particular, the ratio
Nitride-based compound semiconductor capable of emitting relatively short wavelength visible light
Receives the emission wavelength from the light-emitting element and emits longer wavelength light
Depending on the combination with the phosphor that can emit light,
A desired luminescent color can be obtained. Specifically, the phosphor and
Yttrium aluminum activated by cerium
Mu-garnet phosphor (specifically, Y_ThreeAl_FiveO₁₂:
Ce and Y may be completely replaced by Gd and La
l may be completely replaced with In or Ga. ) And perylene
Nitride that can emit high-energy light with system derivatives
Compound semiconductor (In_pGa_qAl _rN, 0 ≦ p ≦ 1, 0 ≦ q
≦ 1, 0 ≦ r ≦ 1, p + q + r = 1) in the light emitting layer
A high-brightness light-emitting device is obtained by combining with a conductor light-emitting element.
Can be In particular, the light emitted from the light emitting element is blue light.
Yes, if the emission from the phosphor is yellow light, white
A light-emitting device capable of emitting light of a color system can be provided. Phosphor
Open the package 101 by mixing it in silicone resin
The molding member 103 containing the phosphor is injected into the
Can be achieved.

(Photoelectric element 105)
An optical sensor that changes its electrical resistance in response to light, a solar cell that generates electromotive force, and an LED or LD that receives light to emit light
(Laser diode) and the like. Two or more such photoelectric elements 105 can be arranged as desired, and two or more kinds can be arranged. Specific examples include a photocoupler combining an optical sensor and an LED, and a full-color light emitting diode capable of emitting RGB light.

Examples of the light receiving element include those using single crystal or non-single crystal polycrystal, microcrystal, amorphous silicon, germanium, or the like. The light receiving element is PI
A semiconductor junction such as N, PN, or IN may be formed, or a semiconductor junction may not be formed. When amorphous silicon is used as a light receiving element, a silicon thin film can be formed on a glass substrate by a plasma CVD method or the like. By depositing a pair of electrodes on the formed semiconductor surface, an optical sensor can be formed relatively easily.

On the other hand, as a light emitting element, gallium nitride, gallium phosphide, gallium arsenide phosphide, gallium aluminum arsenide, gallium aluminum indium phosphide, indium gallium nitride, indium aluminum gallium nitride, or the like is emitted on a substrate by MOCVD or the like. One formed as a layer is exemplified. The structure of the semiconductor is M
Examples include a homostructure having an IS junction, a PIN junction, and a PN junction, a heterostructure, and a double heterostructure. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal thereof. Also, a single quantum well structure or a multiple quantum well structure in which the semiconductor active layer is formed as a thin film in which a quantum effect occurs can be used.

(External Electrode 106) The external electrode 106 is a photoelectric element 105 disposed outside and inside the package 101.
Is to be electrically connected to. Therefore, there are various types such as a conductive pattern provided on the package 106 and a type utilizing a lead frame embedded in the package 101. Further, the external electrode 106 can be formed in various sizes in consideration of heat dissipation, electric conductivity, characteristics of the photoelectric element, and the like. It is preferable that the external electrode 106 has good thermal conductivity for disposing the photoelectric elements 105 and radiating the heat emitted from the photoelectric elements 105 to the outside. The specific electric resistance of the external electrode 106 is preferably 300 μΩ · cm or less, more preferably 3 μΩ · cm or less. Also,
The specific thermal conductivity is 0.01 cal / (S) (cm ² )
(° C./cm) or more, more preferably 0.5
cal / (S) (cm ² ) (° C./cm) or more.

As a specific material of the external electrode 106, a material obtained by plating a copper or phosphor bronze plate surface with a metal plating such as silver, palladium or gold, or a solder plating is preferably used. As the external electrode 106 provided on a substrate such as glass epoxy resin or ceramic, a material obtained by plating a copper foil or a tungsten layer with a noble metal is preferably used. When an external electrode is formed on a ceramic, it can be formed relatively easily by screen-printing and firing a resin paste containing tungsten on a green sheet. In addition, a conductive paste of tungsten was partially adhered to the surface of the green sheet to form a positive electrode and a negative electrode simultaneously with the formation of the external electrode.
9 can also be formed.

(Conductive Wire 107) The conductive wire 107 is required to have good ohmic properties, mechanical connectivity, electrical conductivity and thermal conductivity with the electrodes of the photoelectric element 105. 0.01 cal / (s) as thermal conductivity
(cm ² ) (° C./cm) or more, more preferably 0.5 cal / (s) (cm ² ) (° C./cm) or more.
Also, considering the workability, etc., the diameter of the conductive wire is
Preferably, it is Φ10 μm or more and Φ45 μm or less.
Specifically, as such a conductive wire 107,
Suitable materials include metals such as gold, copper, platinum, and aluminum and alloys thereof. Conductive wire 10
7 can easily connect the electrode of each photoelectric element 105 and the external electrode 106 by a wire bonding device.

(Die bond resin 108) Photoelectric element 105
The package 101 can be bonded to the package 101 by a die bond resin 108 such as a thermosetting resin. Specifically, an epoxy resin, an acrylic resin, an imide resin, and the like can be given. An Ag paste, a carbon paste, an ITO paste, a metal bump, or the like can be used for die-bonding the photoelectric element 105 and electrically connecting the photoelectric element 105 to an external electrode of the package 101. Hereinafter, specific examples of the present invention will be described in detail, but needless to say, the present invention is not limited thereto.

[0037]

【Example】

(Example 1) The package was formed of ceramic. As a ceramic material, a green sheet mainly composed of alumina was cut into a predetermined shape. The cut green sheet has a major diameter of about 2.5 m to form an opening that serves as a cavity for placing the LED chip.
m, a track-shaped through hole having a short diameter of about 1.5 mm was formed. Similarly, a piece constituting the inside of the cavity formed a rectangular through hole of about 2.5 mm and about 1.5 mm. Further, through holes were also formed in a green sheet serving as a bottom surface of the package on which the light emitting elements were arranged so that a part of the external electrode could be formed.

Next, from the side where no LED chip was mounted as a light emitting element, through holes were filled with a conductive paste of tungsten by screen printing and the wiring portion was printed.

Similarly, a conductor layer of tungsten is printed on the green sheet on the side on which the LED chips are mounted by a screen printing method. A green body on which conductor printing is formed and a green sheet constituting a cavity in which a mold member is arranged are laminated and pressed to obtain a molded body. (Note that the conductor paste of tungsten is partially adhered on the green sheet serving as the package surface so that the positive electrode and the negative electrode are marked so that the positive electrode and the negative electrode can be identified.) Plating was performed to form a package having external electrodes and an opening having a depth of about 0.7 mm.

On the other hand, the main emission wavelength of the LED chip is 4
A 60 nm In _0.2 Ga _0.8 N semiconductor was used. The LED chip is formed by flowing a TMG (trimethyl gallium) gas, a TMI (trimethyl indium) gas, a nitrogen gas and a dopant gas together with a carrier gas on a cleaned sapphire substrate, and forming a gallium nitride-based compound semiconductor by MOCVD. Formed. By switching between SiH ₄ and Cp ₂ Mg as the dopant gas, a gallium nitride-based semiconductor having N-type conductivity and a gallium nitride-based semiconductor having P-type conductivity are formed to form a PN junction.

The semiconductor light emitting device includes a contact layer made of a gallium nitride semiconductor having N-type conductivity, a clad layer made of a gallium aluminum nitride semiconductor having P-type conductivity, and a gallium nitride semiconductor having P-type conductivity. A contact layer was formed. An active layer of non-doped InGaN having a thickness of about 3 nm and a single quantum well structure was formed between a contact layer having N-type conductivity and a cladding layer having P-type conductivity. (Note that a gallium nitride semiconductor is formed at a low temperature on a sapphire substrate to serve as a buffer layer. A semiconductor having P-type conductivity is annealed at 400 ° C. or more after film formation.) Sapphire by etching After exposing the surface of each PN contact layer on the substrate, each electrode was formed by sputtering. After the scribe line was drawn on the semiconductor wafer thus completed, it was divided by external force to form LED chips of 350 μm square.

An LED chip is die-bonded to the center of the package opening with epoxy resin. After the die bond resin was cured at 140 ° C. for 2 hours, the electrode of the LED chip and the external electrode of the package were wire-bonded with a gold wire having a diameter of 30 μm.

On the other hand, as a phosphor, a solution in which rare earth elements of Y, Gd and Ce were dissolved in an acid at a stoichiometric ratio was coprecipitated with oxalic acid. This is mixed with a coprecipitated oxide obtained by calcination and aluminum oxide to obtain a mixed raw material. This was mixed with ammonium fluoride as a flux, packed in a crucible, and fired in air at a temperature of 1400 ° C. for 3 hours to obtain a fired product.
The calcined product was ball milled in water, washed, separated, dried, and finally formed through a sieve. Formed (Y _0.8 G
_{d 0.2) 3 Al 5 O 12} : a Ce _0.03 phosphor is contained in the epoxy resin.

In the silicone resin, (Y _0.8 Gd _0.2 ) ₃ A
l ₅ O _12: Ce _0.03 phosphor at a weight ratio of 10: LED chip that is mixed and stirred is filled to the arrangement package opening to 1. The application amount was a concave shape (a depth of about 0.25 mm from the surface) in which the surface was depressed so that the silicone resin did not wet the package surface. After the silicone resin was cured at 150 ° C. for 2 hours, the silicone resin containing the phosphor was formed in a mortar shape when viewed from the surface side of the package. Also, the silicone resin did not exude on the surface of the ceramic package. 500 light emitting diodes thus formed were formed.

All the formed light emitting diodes can emit light, have an average luminous intensity of about 2 cd, and have an average chromaticity point of (x,
y) = (0.310, 0.300). A heat cycle test was performed on 250 light emitting diodes.
The heat cycle test was performed at -5 ° C for 10 minutes and at 80 ° C for 15 minutes as one cycle, and was subjected to 3000 cycles. All the light-emitting diodes after the heat cycle test were able to emit light, and there was no change in luminous intensity or chromaticity point.

Next, a tensile test was performed on the remaining 250 light emitting diodes. In the tensile test, a load of 50 g was applied to the hook-shaped tip, and the package surface was run at 20 mm / s across the opening. After the tensile test, there was no abnormality in all the remaining light emitting diodes, and light emission was possible as before the test. It should be noted that the same result can be obtained in the photoelectric device that does not contain a phosphor.

Comparative Example 1 The procedure was the same as in Example 1 except that the material of the mold member was epoxy resin. In the same manner as in Example 1, 500 light emitting diodes were formed. All the formed light emitting diodes can emit light,
Light emission characteristics almost similar to those of Example 1 were exhibited. A heat cycle test and a tensile test were performed under the same conditions as in Example 1. After the heat cycle test, those that could emit light were:
There were only six and most of them could not emit light. When the unlit LED is disassembled, an external electrode or LED
In most cases, wires were cut at bonding portions formed on the electrodes of the chip. In the tensile test, there was no abnormality in the light emitting diode as in Example 1, and light emission was possible as before the test. In addition, when the number of heat cycle tests was reduced and the heat cycle test was performed, some of the lamps became unlit from about 100 cycles, and all were unlit at 1000 cycles.

(Comparative Example 2) 500 light emitting diodes were formed in the same manner as in Example 1 except that there was no mold member holding means at the package opening where at least a part of the opening tip was narrower than the inner end. . All of the formed light emitting diodes were capable of emitting light, and exhibited light emission characteristics substantially similar to those of Example 1. A heat cycle test and a tensile test were performed under the same conditions as in Example 1. After the heat cycle test,
The light emission characteristics were almost the same as before the test. In the tensile test, up to 164 out of 250 silicone resin were removed. As a result, most of the lamps were not able to emit white light but were not lit.

[0049]

According to the constitution of the present invention, heating,
It is possible to provide a photoelectric device having high reliability against external force and moisture. Therefore, it is possible to constitute a light emitting diode or the like that can be used even in an environment where demands for vibration, heat cycle, and miniaturization are severe, such as for a vehicle.

In particular, by adopting the structure described in claim 1,
A large force due to thermal expansion of the mold member such as at the time of soldering is not applied to the photoelectric element or the like. Therefore, the photoelectric element does not shift from a desired portion of the package. In addition, there is no crack in the conductive paste or disconnection of the conductive wire for electrically connecting the photoelectric element and the external electrode. Therefore, even if the temperature cycle is performed, the photoelectric characteristics do not deteriorate and no light emission occurs. In addition, moisture can enter and exit the silicone resin relatively freely inside and outside the resin as compared with the epoxy resin and the like. Therefore, the photoelectric element itself coated with the silicone resin is extremely unlikely to be damaged by moisture contained in the resin.

Further, by providing the package with the holding means, the silicone resin having low adhesiveness does not separate from the package. By using a mold member that is disposed lower than the surface of the package opening, external dust and the like hardly adhere to the silicone resin having low adhesiveness. In addition, the mold member adheres to an external object, making it difficult for the mold member to peel off from the package.

According to the structure of the second aspect, the mold resin is prevented from rising and is mechanically held. Therefore, a photoelectric device which is resistant to thermal shock and the like while maintaining desired optical characteristics can be provided. Further, a highly reliable photoelectric device can be formed relatively easily while covering the weak point of the low adhesiveness of the silicone resin.

According to the third aspect of the present invention, a strong photoelectric device having good heat dissipation can be obtained. By making the mold member concave, even if it is a porous ceramic package, the mold resin does not exude on the surface of the ceramic package, and the adhesion of dust can be reduced.

According to the fourth aspect of the present invention, there is provided a light emitting device capable of receiving a light emitting wavelength from a light emitting element to emit a different light emitting wavelength or a light receiving device capable of receiving a specific wavelength from the outside and receiving different wavelengths. can do. In particular, since the present invention is strong in thermal characteristics and can hold the mold member, it does not function as a photoelectric device having desired photoelectric characteristics due to peeling of the mold member containing the phosphor.

According to the method described in claim 5, it is possible to relatively easily form a photoelectric device with high productivity and high reliability.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a chip type LED which is the photoelectric device of the present invention.

FIG. 2 is a schematic sectional view taken along line AA of FIG. 1;

FIG. 3 is a schematic cross-sectional view of a photoelectric device showing an example of a holding unit used in the present invention. FIG. 3 (A) shows that the entire opening of the package surface is narrower than the inside, and FIG. B)
In FIG. 3, a groove is provided in a side wall inside the package opening, and FIG.
(C) shows a wedge-shaped projection formed on a side wall in the package opening.

FIG. 4 is a schematic plan view of a chip type LED shown for comparison with the present invention.

FIG. 5 is a schematic sectional view taken along line BB of FIG. 4;

[Explanation of symbols]

 101: Package 102, 112, 122, 132: Holding means 103: Mold member 104: Phosphor 105: Photoelectric element 106: External electrode 107: Conductive wire 108:・ ・ Die bond resin 109 ・ ・ ・ Marking 201 ・ ・ ・ Package 203 ・ ・ ・ Mold member 205 ・ ・ ・ Photoelectric element 206 ・ ・ ・ External electrode 207 ・ ・ ・ Conductive wire 208 ・ ・ ・ Die bond resin

Claims (5)

[Claims] 1. A package having an opening, first and second external electrodes capable of conducting between the inside of the opening of the package and the outside, and the inside of the opening of the package. And a photoelectric element electrically connected to the first and second external electrodes (106) in the package, respectively.
(105) and a mold member (103) that covers the photoelectric element (105) in the opening of the package (101) and is disposed lower than the surface of the package (101), The photoelectric device, wherein the mold member (103) is a silicone resin, and the package (101) has a holding means (102) for holding the mold member (103). 2. The photoelectric device according to claim 1, wherein the holding means is at least one end on the surface side of the package, which is narrower than the inside of the opening in which the photoelectric element is arranged. 3. A mold member (103) wherein said package (101) is ceramic and is exposed from said package (101).
The photoelectric device according to claim 1, wherein the light-emitting device is recessed when viewed from a light emission observation surface side. 4. An optoelectronic device according to claim 1, wherein said optoelectronic device is a light emitting device and said mold member includes a phosphor. 5. A package (101) having an opening and having at least first and second external electrodes (106) disposed therein,
A photoelectric element (105) electrically connected to the first and second external electrodes (106) and provided in the opening of the package (101); and the photoelectric element in the opening of the package (101). A mold member (103) covering the (105),
A step of pouring a silicone resin into an opening having at least one end on the surface side of the package (101) narrower than the inside of the opening in which the photoelectric element (105) is arranged; and And a step of forming a mold member (103) by heat-curing the resin to form a mold member (103).