JPH1171184A - Binder for aln sintered product, its production and binding of aln sintered product therewith - Google Patents

Binder for aln sintered product, its production and binding of aln sintered product therewith

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Publication number
JPH1171184A
JPH1171184A JP9242077A JP24207797A JPH1171184A JP H1171184 A JPH1171184 A JP H1171184A JP 9242077 A JP9242077 A JP 9242077A JP 24207797 A JP24207797 A JP 24207797A JP H1171184 A JPH1171184 A JP H1171184A
Authority
JP
Japan
Prior art keywords
powder
aln
aln sintered
binder
sintered products
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9242077A
Other languages
Japanese (ja)
Other versions
JP3513736B2 (en
Inventor
Koji Sano
幸司 佐野
Shinichiro Aonuma
伸一朗 青沼
Shigeko Muramatsu
滋子 村松
Mitsuhiro Fujita
光広 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Original Assignee
Toshiba Ceramics Co Ltd
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Filing date
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Application filed by Toshiba Ceramics Co Ltd filed Critical Toshiba Ceramics Co Ltd
Priority to JP24207797A priority Critical patent/JP3513736B2/en
Publication of JPH1171184A publication Critical patent/JPH1171184A/en
Application granted granted Critical
Publication of JP3513736B2 publication Critical patent/JP3513736B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To obtain a binder for AlN sintered products, capable of highly enhancing the air tightness and binding strength of a bound portion by mixing YAG powder with AlN powder, calcining the mixture and subsequently crushing the calcination product into particles having particle diameters of a specific value or less. SOLUTION: This binder for AlN sintered products is obtained by mixing 100 pts.wt. of YAG (Y3 Al5 O12 ) powder having an average particle diameter of <=50 μm with 30-150 pts.wt. of AlN(aluminum nitride) powder in a solvent, drying the mixture, granulating the dried mixture, calcining the granules at a temperature of 1,500-1,850 deg.C in the atmosphere of nitrogen gas and subsequently crushing the calcined granules into particles having particle diameters of <=100 μm. The AlN sintered products are bound to each other by kneading the binder in an organic solvent, coating the obtained paste on the binding portions of the AlN sintered products, or forming the binder into a sheet-like product, disposing the sheet-like product on the binding portions of the AlN sintered products, and subsequently thermally treating the superposed AlN sintered products at a temperature exceeding 1,850 deg.C in the atmosphere of nitrogen gas. The binding of the AlN sintered products with the binder gives a volume contraction coefficient of <=10% on the sintering, a porosity of <=5% in the bound portion, and a binding strength of >=50 Mpa.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、AlN(窒化アル
ミニウム)焼結体同士の接合に使用するAlN焼結体用
接合剤、その製造方法及びそれを用いたAlN焼結体の
接合方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding agent for AlN sintered bodies used for bonding AlN (aluminum nitride) sintered bodies, a method for producing the same, and a method for bonding AlN sintered bodies using the same.

【0002】[0002]

【従来の技術】近年、半導体製造装置であるエッチャー
やCVD装置においては、ウエハを保持するサセプター
やクランプリング等を、高熱伝導性及び高温での剛性又
は急速昇降温度に対する耐熱衝撃性を高めるため、Al
N焼結体によって形成することが行われている。従来、
上記サセプターやクランプリングを作製するため、Al
N焼結体製の複雑な形状の部品を接合する接合剤として
は、Y2 3 (イットリア)等の焼結助剤を用いて焼成
されるAlN焼結体の粒界相成分と同一成分又はこれと
低融点化添加物からなる粉末が知られている。この接合
剤は、ペースト状としてAlN焼結体の接合部に塗布
し、AlN焼結体の焼成温度と同程度又はそれ以下で、
かつその焼成雰囲気と同様の雰囲気で熱処理してAlN
焼結体同士の接合に使用されるものである。
2. Description of the Related Art In recent years, in an etcher or a CVD apparatus which is a semiconductor manufacturing apparatus, a susceptor or a clamp ring for holding a wafer is required to have high thermal conductivity, high rigidity at high temperature, or high thermal shock resistance against a rapid rise and fall temperature. Al
Forming with an N sintered body is performed. Conventionally,
To make the above susceptor and clamp ring,
As a bonding agent for bonding a component having a complicated shape made of an N sintered body, the same component as a grain boundary phase component of an AlN sintered body fired using a sintering aid such as Y 2 O 3 (yttria) is used. Alternatively, a powder comprising this and an additive for lowering the melting point is known. This bonding agent is applied as a paste to the joint portion of the AlN sintered body, and at or below the firing temperature of the AlN sintered body,
Heat treatment in the same atmosphere as the firing
It is used for joining sintered bodies.

【0003】[0003]

【発明が解決しようとする課題】しかし、従来のAlN
焼結体用接合剤では、その焼結収縮によりAlN焼結体
と寸法差を生じ、AlN焼結体の接合部に隙間を生じる
ので、接合部の気密性及び接合強度が低下する不具合が
ある。そこで、本発明は、接合部の気密性と接合強度を
大幅に高め得るAlN焼結体用接合剤、その製造方法及
びそれを用いたAlN焼結体の接合方法を提供すること
を目的とする。
However, the conventional AlN
The bonding agent for a sintered body causes a dimensional difference from the AlN sintered body due to its sintering shrinkage, and a gap is generated in the joint of the AlN sintered body, so that the hermeticity and the joint strength of the joint are reduced. . Therefore, an object of the present invention is to provide a bonding agent for an AlN sintered body capable of significantly improving the airtightness and bonding strength of a bonded portion, a method for producing the same, and a method for bonding an AlN sintered body using the same. .

【0004】[0004]

【課題を解決するための手段】前記課題を解決するた
め、本発明のAlN焼結体用接合剤は、YAG粉末又は
YAG組成となるY2 3 とAl2 3 の混合粉末10
0重量部とAlN粉末30〜150重量部とを混合・仮
焼・粉砕した粒子径100μm以下の粉粒体からなるこ
とを特徴とする。又、AlN焼結体用接合剤の製造方法
は、YAG粉末又はYAG組成となるY2 3 とAl2
3 の混合粉末100重量部とAlN粉末30〜150
重量部とに溶媒を加え混合・乾燥造粒し、これを窒素ガ
ス雰囲気中において1500〜1850℃の温度で仮焼
した後、粒子径100μm以下に粉砕することを特徴と
する。更に、AlN焼結体の接合方法は、前記AlN焼
結体用接合剤に有機溶剤を添加してペースト状とし、こ
れをAlN焼結体の接合部に塗布し又はこれをシート状
に成形してAlN焼結体の接合部間に介装し、窒素ガス
雰囲気において1850℃を超える温度で熱処理するこ
とを特徴とする。
In order to solve the above-mentioned problems, a bonding agent for an AlN sintered body of the present invention comprises a YAG powder or a mixed powder of Y 2 O 3 and Al 2 O 3 having a YAG composition.
0 parts by weight and 30 to 150 parts by weight of AlN powder are mixed, calcined, and pulverized to form a powder having a particle diameter of 100 μm or less. In the method of manufacturing the AlN sintered body for a bonding agent is a YAG powder or YAG composition Y 2 O 3 and Al 2
100 parts by weight of a mixed powder of O 3 and 30 to 150 AlN powders
The mixture is dried, granulated, and calcined at a temperature of 1500 to 1850 ° C. in a nitrogen gas atmosphere, and then pulverized to a particle diameter of 100 μm or less. Further, in the method of joining the AlN sintered body, an organic solvent is added to the above-mentioned bonding agent for the AlN sintered body to form a paste, which is applied to the joint of the AlN sintered body or formed into a sheet. And a heat treatment at a temperature exceeding 1850 ° C. in a nitrogen gas atmosphere.

【0005】AlN焼結体用接合剤において、YAG
(Y3 Al5 12)粉末又はYAG組成となるY2 3
とAl2 3 の混合粉末100重量部に対し、AlN粉
末が30重量部未満であると、焼結による体積収縮率が
10%を超え、接合部に隙間が生じたり、又、AlN焼
結体接合体の寸法制御(焼結後の接合剤部の肉厚寸法制
御)が困難となる。一方、150重量部を超えると、焼
結後の接合剤部の気孔率が5%を超え、開気孔を生じて
気密性が劣り、かつ接合強度も十分なものとならない。
AlN粉末のより好ましい添加量は、YAG粉末又はY
AG組成となるY2 3 とAl2 3 の混合粉末100
重量部に対し80〜100重量部である。又、YAG粉
末又はYAG組成となるY2 3 とAl2 3 の混合粉
末とAlN粉末とを順次混合・仮焼・粉砕したものであ
ることが重要であり、特に、接合剤の焼結収縮量を制御
する上で、仮焼処理が不可欠なものである。更に、粉粒
体の粒子径が100μmを超えると、接合剤部の気密性
が低下し、接合強度も低下すると共に、その塗布性が悪
くなる。より好ましい粒子径は、10μm以下である。
なお、上記AlN焼結体用接合剤によれば、焼結時の体
積収縮率10%以下、焼結後の該接合剤部の気孔率5%
以下、及び接合強度50MPa以上となる。一方、YA
G粉末又はYAG組成となるY2 3 とAl2 3 の混
合粉末の粒子径は、平均粒径で50μm以下であること
が好ましい。平均粒径が50μmを超えると、スラリー
調製が困難となる。より好ましい平均粒径は、1μmで
ある。又、AlN粉末の粒子径は、平均粒径で10μm
以下であることが好ましい。平均粒径が10μmを超え
ると、同様にスラリー調製が困難となる。より好ましい
平均粒径は、1μmである。
[0005] As a bonding agent for AlN sintered bodies, YAG
(Y 3 Al 5 O 12) a powder or YAG composition Y 2 O 3
If the AlN powder is less than 30 parts by weight with respect to 100 parts by weight of the mixed powder of AlN 2 and Al 2 O 3, the volume shrinkage due to sintering exceeds 10%, and a gap is formed in the joint, and It is difficult to control the dimensions of the joined body (control of the thickness dimension of the bonding agent after sintering). On the other hand, if it exceeds 150 parts by weight, the porosity of the bonding agent after sintering exceeds 5%, and open pores are generated, resulting in poor airtightness and insufficient bonding strength.
A more preferable addition amount of the AlN powder is YAG powder or YAG powder.
Mixed powder 100 of Y 2 O 3 and Al 2 O 3 having AG composition
It is 80 to 100 parts by weight based on parts by weight. Further, it is important that YAG powder or a mixed powder of Y 2 O 3 and Al 2 O 3 having a YAG composition and AlN powder are sequentially mixed, calcined, and pulverized. To control the amount of shrinkage, the calcination treatment is indispensable. Further, when the particle size of the powder exceeds 100 μm, the airtightness of the bonding agent portion is reduced, the bonding strength is reduced, and the coating property is deteriorated. A more preferred particle size is 10 μm or less.
According to the bonding agent for AlN sintered body, the volume shrinkage at the time of sintering is 10% or less, and the porosity of the bonding agent portion after sintering is 5%.
Or less, and the bonding strength is 50 MPa or more. On the other hand, YA
The particle diameter of the G powder or the mixed powder of Y 2 O 3 and Al 2 O 3 having a YAG composition is preferably 50 μm or less in average particle diameter. If the average particle size exceeds 50 μm, slurry preparation becomes difficult. A more preferred average particle size is 1 μm. The particle diameter of the AlN powder is 10 μm in average particle diameter.
The following is preferred. When the average particle size exceeds 10 μm, it is similarly difficult to prepare a slurry. A more preferred average particle size is 1 μm.

【0006】AlN焼結体用接合剤の製造において、仮
焼温度が、1500℃未満であると体積収縮率が10%
を超え、1850℃を超えると、接合時の熱処理温度と
同等となり、接合時に熱拡散が実質的に生じることがな
いため、接合強度が50MPa未満となり、実使用に耐
えられない。好ましい仮焼温度は、1800〜1850
℃である。
In the production of a bonding agent for an AlN sintered body, if the calcination temperature is less than 1500 ° C., the volume shrinkage is 10%.
If the temperature exceeds 1850 ° C., the temperature becomes equal to the heat treatment temperature at the time of joining, and substantially no heat diffusion occurs at the time of joining. Therefore, the joining strength becomes less than 50 MPa, and the product cannot withstand practical use. Preferred calcination temperatures are 1800 to 1850
° C.

【0007】AlN焼結体用接合剤を用いたAlN焼結
体の接合において、接合剤に添加する有機溶剤として
は、ブチルカルビトール、熱可塑性セルロースエーテル
及びフタル酸ジブチル等が用いられる。又、接合熱処理
条件については、熱処理温度が、1850℃以下である
と、基材焼結温度より低いため、接合時の物質拡散がで
きず、接合強度が50MPa未満となる。
[0007] In joining AlN sintered bodies using the bonding agent for AlN sintered bodies, butyl carbitol, thermoplastic cellulose ether, dibutyl phthalate and the like are used as organic solvents to be added to the bonding agent. Regarding the bonding heat treatment condition, if the heat treatment temperature is 1850 ° C. or lower, since the temperature is lower than the base material sintering temperature, material diffusion during bonding cannot be performed, and the bonding strength becomes less than 50 MPa.

【0008】[0008]

【発明の実施の形態】以下、本発明の実施の形態につい
て具体的な実施例及び比較例を参照して説明する。 実施例1〜4、比較例1〜8 先ず、YAG粉末(高純度化学製、アルミン酸イットリ
ウム、平均粒径50μm)100重量部に対し、AlN
粉末(三井東圧化学製、品名MAN−2、平均粒径1μ
m)又はY2 3 とAl2 3 (アルミナ)をYAG組
成の重量比で混合した混合粉末(表1においてはYO+
AOと記す。)を表1に示す割合でそれぞれ添加し、混
合器(4リットルマロン樹脂ポット、直径5mmのAl
Nボール250g使用)を用いて混合すると共に、これ
に溶媒(メタノール1級)を添加(AlN原料500g
に対して450cc添加)し、130rpmの回転台で
15時間かけて混合してスラリーを調製した。次に、各
スラリーを乾燥装置(エバポレーター(減圧加熱乾燥装
置))を用いて造粒した後、篩い分けして粒径100μ
m以下の造粒粉を得た。次いで、各造粒粉(比較例1、
4、8を除く)をAlN製の蓋付き匣鉢に収容し、大気
圧の窒素ガス雰囲気中においてそれぞれ仮焼した。仮焼
時の最高温度は、後述する接合温度未満であり、接合温
度が1900℃の場合の加熱条件は、下記の通りであ
る。 室温〜1100℃:550℃/h 1100〜1500℃:400℃/h 1500〜1850℃:200℃ 1850℃×3h 1850〜1500℃:100℃/h 次に、各仮焼体を粉砕器(AlN製乳鉢、AlN製乳
棒)を用いて粉砕した後、篩い分けして粒径50μm以
下の粉粒体の接合剤を得た。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to specific examples and comparative examples. Examples 1 to 4 and Comparative Examples 1 to 8 First, 100 parts by weight of YAG powder (manufactured by Kojundo Chemical Co., Ltd., yttrium aluminate, average particle size: 50 μm) was mixed with 100 parts by weight of AlN.
Powder (manufactured by Mitsui Toatsu Chemical, product name MAN-2, average particle size 1μ)
m) or a mixed powder obtained by mixing Y 2 O 3 and Al 2 O 3 (alumina) at a weight ratio of the YAG composition (in Table 1, YO +
Notated as AO. ) Were added at the ratios shown in Table 1, and a mixer (4 liter malon resin pot, 5 mm diameter Al)
Mix using an N ball (250 g) and add a solvent (methanol first grade) to this (500 g of AlN raw material).
, And mixed on a rotary table at 130 rpm for 15 hours to prepare a slurry. Next, each slurry was granulated using a drying device (evaporator (heat-drying device under reduced pressure)), and then sieved to obtain a particle size of 100 μm.
m or less was obtained. Next, each granulated powder (Comparative Example 1,
4 and 8) were placed in a sagger with a lid made of AlN and calcined in an atmosphere of nitrogen gas at atmospheric pressure. The maximum temperature during calcination is lower than the bonding temperature described below, and the heating conditions when the bonding temperature is 1900 ° C. are as follows. Room temperature to 1100 ° C .: 550 ° C./h 1100 to 1500 ° C .: 400 ° C./h 1500 to 1850 ° C .: 200 ° C. 1850 ° C. × 3 h 1850 to 1500 ° C .: 100 ° C./h Next, each calcined body is crushed (AlN The mixture was pulverized using a mortar and an AlN pestle, and then sieved to obtain a powdery binder having a particle size of 50 μm or less.

【0009】[0009]

【表1】 [Table 1]

【0010】上記各接合剤に有機溶剤(溶媒1:ブチル
カルビトール、溶媒2:熱可塑性セルロースエーテル、
溶媒3:フタル酸ジブチル)を添加(接合剤100gに
対し、溶媒1:45.5cc、溶媒2:4.5cc、溶
媒3:4.0ccを添加)し、混合器(AlN製乳鉢、
AlN製乳棒)を用いてペースト状とした。次に、各ペ
ースト状の接合剤を被接合体としてのAlN焼結体板に
スクリーン印刷機で塗布(接合剤の厚みは、印刷回数で
設定)し、2枚のAlN焼結体板を重ね合わせた後、各
積層体を大気圧の窒素ガス雰囲気中において加熱(昇降
温度100℃/h、最高温度600℃×1h)して脱脂
した。次いで、脱脂処理と同様の雰囲気中において熱処
理し、接合剤を焼成して各積層体を接合した。熱処理の
加熱条件は、下記の通りである。 室温〜1100℃:550℃/h 1100〜1500℃:400℃/h 1500〜1900℃:200℃/h 1900℃×3h 1900〜1500℃:100℃/h 熱処理後の各積層体の接合部の体積収縮率、気孔率及び
接合強度等は、表2に示すようになった。
An organic solvent (solvent 1: butyl carbitol, solvent 2: thermoplastic cellulose ether,
Solvent 3: dibutyl phthalate) was added (solvent 1: 100 g, solvent 1: 45.5 cc, solvent 2: 4.5 cc, solvent 3: 4.0 cc were added), and a mixer (AlN mortar,
(AlN pestle) to obtain a paste. Next, each paste-like bonding agent is applied to an AlN sintered body plate as a body to be bonded by a screen printing machine (the thickness of the bonding agent is set by the number of times of printing), and the two AlN sintered body plates are stacked. After being combined, each of the laminates was heated (elevated temperature 100 ° C./h, maximum temperature 600 ° C. × 1 h) and degreased in an atmosphere of nitrogen gas at atmospheric pressure. Next, heat treatment was performed in the same atmosphere as the degreasing treatment, and the bonding agent was fired to bond the respective laminates. The heating conditions for the heat treatment are as follows. Room temperature to 1100 ° C .: 550 ° C./h 1100 to 1500 ° C .: 400 ° C./h 1500 to 1900 ° C .: 200 ° C./h 1900 ° C. × 3 h 1900 to 1500 ° C .: 100 ° C./h Table 2 shows the volume shrinkage, porosity, bonding strength and the like.

【0011】[0011]

【表2】 [Table 2]

【0012】表1、表2から、YAG100重量部に対
しAlN30〜150重量部含む粉末を混合・仮焼・粉
砕して粒子径100μm以下の粉粒体とすることによ
り、焼結時の体積収縮率10%以下、気孔率5%以下及
び接合強度100〜200MPaとなるので、AlN焼
結体同士の接合を良好に行えることがわかる。
According to Tables 1 and 2, a powder containing 30 to 150 parts by weight of AlN per 100 parts by weight of YAG is mixed, calcined, and pulverized to obtain a powder having a particle diameter of 100 μm or less. Since the porosity is 10% or less, the porosity is 5% or less, and the joining strength is 100 to 200 MPa, it can be seen that the joining of the AlN sintered bodies can be performed well.

【0013】なお、上述した実施の形態においては、A
lN焼結体同士の接合に際し、ペースト状の接合剤を接
合部に塗布する場合について説明したが、これに限定さ
れるものではなく、例えばペースト状の接合剤をシート
状に成形し、これをAlN焼結体の接合部間に介装する
ようにしてもよく、同様の作用効果が得られる。
In the above-described embodiment, A
In the case of bonding 1N sintered bodies, a case in which a paste-like bonding agent is applied to a bonding portion has been described. However, the present invention is not limited to this. For example, a paste-like bonding agent is formed into a sheet, and It may be interposed between the joints of the AlN sintered body, and the same operation and effect can be obtained.

【0014】[0014]

【発明の効果】以上説明したように、本発明のAlN焼
結体用接合剤、その製造方法及びそれを用いたAlN焼
結体の接合方法によれば、接合剤が予め体積収縮されて
いるので、AlN焼結体の接合部に隙間を生じることな
く、接合部の気密性と接合強度を大幅に高めることがで
きる。
As described above, according to the bonding agent for an AlN sintered body of the present invention, the method of manufacturing the same, and the method of bonding an AlN sintered body using the same, the bonding agent is previously contracted in volume. Therefore, the airtightness and the joint strength of the joint can be greatly increased without generating a gap in the joint of the AlN sintered body.

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成9年11月21日[Submission date] November 21, 1997

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】特許請求の範囲[Correction target item name] Claims

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【特許請求の範囲】[Claims]

【手続補正2】[Procedure amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0004[Correction target item name] 0004

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0004】[0004]

【課題を解決するための手段】前記課題を解決するた
め、本発明のA1N焼結体用接合剤は、YAG粉末1
0重量部とA1N粉末30〜150重量部とを混合・仮
焼・粉砕した粒子径100μm以下の粉粒体からなるこ
とを特徴とする。又、A1N焼結体用接合剤の製造方法
は、YAG粉末100重量部とA1N粉末30〜150
重量部とに溶媒を加え混合・乾燥造粒し、これを窒素ガ
ス雰囲気中において1500〜1850℃の温度で仮焼
した後、粒子径100μm以下に粉砕することを特徴と
する。更に、A1N焼結体の接合方法は、前記A1N焼
結体用接合剤に有機溶剤を添加してペースト状とし、こ
れをA1N焼結体の接合部に塗布し又はこれをシート状
に成形してA1N焼結体の接合部間に介装し、窒素ガス
雰囲気において1850℃を超える温度で熱処理するこ
とを特徴とする。
Means for Solving the Problems] To solve the above problems, A1N sintered body for bonding agent of the present invention, YAG Powder 1 0
0 parts by weight and 30 to 150 parts by weight of A1N powder are mixed, calcined, and pulverized to form a powder having a particle diameter of 100 μm or less. The manufacturing method of A1N sintered body for bonding agents, YAG Powder 1 00 parts by weight and the A1N powder 30-150
The mixture is dried, granulated, and calcined at a temperature of 1500 to 1850 ° C. in a nitrogen gas atmosphere, and then pulverized to a particle diameter of 100 μm or less. Further, the joining method of the A1N sintered body is as follows. An organic solvent is added to the joining agent for the A1N sintered body to form a paste, which is applied to the joint of the A1N sintered body or formed into a sheet. And a heat treatment at a temperature exceeding 1850 ° C. in a nitrogen gas atmosphere.

【手続補正3】[Procedure amendment 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0005[Correction target item name] 0005

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0005】A1N焼結体用接合剤において、YAG
(YAl12)粉末100重量部に対し、A1N
粉末が30重量部未満であると、焼結による体積収縮率
が10%を超え、接合部に隙間が生じたり、又、A1N
焼結体接合体の寸法制御(焼結後の接合剤部の肉厚寸法
制御)が困難となる。一方、150重量部を超えると、
焼結後の接合剤部の気孔率が5%を超え、開気孔を生じ
て気密性が劣り、かつ接合強度も十分なものとならな
い。A1N粉末のより好ましい添加量は、YAG粉末1
00重量部に対し80〜100重量部である。又、YA
G粉末とA1N粉末とを順次混合・仮焼・粉砕したもの
であることが重要であり、特に、接合剤の焼結収縮量を
制御する上で、仮焼処理が不可欠なものである。更に、
粉粒体の粒子径が100μmを超えると、接合剤部の気
密性が低下し、接合強度も低下すると共に、その塗布性
が悪くなる。より好ましい粒子径は、10μm以下であ
る。なお、上記A1N焼結体用接合剤によれば、焼結時
の体積収縮率10%以下、焼結後の該接合剤部の気孔率
5%以下、及び接合強度50MPa以上となる。一方、
YAG粉末の粒子径は、平均粒径で50μm以下である
ことが好ましい。平均粒径が50μmを超えると、スラ
リー調製が困難となる。より好ましい平均粒径は、1μ
mである。又、A1N粉末の粒子径は、平均粒径で10
μm以下であることが好ましい。平均粒径が10μmを
超えると、同様にスラリー調製が困難となる。より好ま
しい平均粒径は、1μmである。
[0005] In the bonding agent for A1N sintered body, YAG
To (Y 3 Al 5 O 12) powder powder 1 00 parts by weight, A1N
When the amount of the powder is less than 30 parts by weight, the volume shrinkage due to sintering exceeds 10%, a gap is formed in the joint, and A1N
It is difficult to control the dimensions of the joined body of the sintered bodies (control of the thickness of the bonding agent after sintering). On the other hand, if it exceeds 150 parts by weight,
The porosity of the bonding material after sintering exceeds 5%, and open pores are generated, resulting in poor airtightness and insufficient bonding strength. More preferred amount of A1N powder, YAG Powder 1
It is 80 to 100 parts by weight with respect to 00 parts by weight. Also, YA
It is important is obtained by successively mixing, calcining and pulverizing the G Powder and A1N powder, in particular, in controlling the sintering shrinkage of the bonding agent, calcination process is indispensable. Furthermore,
When the particle diameter of the powder exceeds 100 μm, the airtightness of the bonding agent portion is reduced, the bonding strength is reduced, and the coating property is deteriorated. A more preferred particle size is 10 μm or less. According to the bonding agent for A1N sintered body, the volume shrinkage at the time of sintering is 10% or less, the porosity of the bonding agent portion after sintering is 5% or less, and the bonding strength is 50 MPa or more. on the other hand,
Particle size of YAG Powder is preferably an average particle diameter is 50μm or less. If the average particle size exceeds 50 μm, slurry preparation becomes difficult. A more preferred average particle size is 1 μm.
m. The particle size of the A1N powder is 10
It is preferably not more than μm. When the average particle size exceeds 10 μm, it is similarly difficult to prepare a slurry. A more preferred average particle size is 1 μm.

【手続補正4】[Procedure amendment 4]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0008[Correction target item name] 0008

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0008】[0008]

【発明の実施の形態】以下、本発明の実施の形態につい
て具体的な実施例及び比較例を参照して説明する。 実施例1〜4、比較例1〜8 先ず、YAG粉末(高純度化学製、アルミン酸イットリ
ウム、平均粒径50μm)100重量部に対し、A1N
粉末(三井東圧化学製、平均粒径1μm)又はY
とAl YAG組成の重量比で混合した混合粉末
比較例8、表1においてはYO+AOと記す。)を表
1に示す割合でそれぞれ添加し、混合器(4リットルマ
ロン樹脂ポット、直径5mmのA1Nボール250g使
用)を用いて混合すると共に、これに溶媒(メタノール
1級)を添加(A1N原料500gに対して450cc
添加)し、130rpmの回転台で15時間かけて混合
してスラリーを調製した。次に、各スラリーを乾燥装置
(エバポレーター(減圧加熱乾燥装置))を用いて造粒
した後、篩い分けして粒径100μm以下の造粒粉を得
た。次いで、各造粒粉(比較例1、4、8を除く)をA
1N製の蓋付き匣鉢に収容し、大気圧の窒素ガス雰囲気
中においてそれぞれ仮焼した。仮焼時の最高温度は、後
述する接合温度未満であり、接合温度が1900℃の場
合の加熱条件は、下記の通りである。 室温〜1100℃:550℃/h 1100〜1500℃:400℃/h 1500〜1850℃:200℃ 1850℃×3h 1850〜1500℃:100℃/h 次に、各仮焼体を粉砕器(A1N製乳鉢、A1N製乳
棒)を用いて粉砕した後、篩い分けして粒径50μm以
下の粉粒体の接合剤を得た。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to specific examples and comparative examples. Examples 1 to 4 and Comparative Examples 1 to 8 First, 100 parts by weight of YAG powder (manufactured by Kojundo Chemical Co., Ltd., yttrium aluminate, average particle size: 50 μm) was mixed with 100 parts by weight of A1N.
Powder (manufactured by Mitsui Toatsu Chemicals, flat Hitoshitsubu径1 [mu] m) or Y 2 O 3
And Al 2 O 3 were mixed at a weight ratio of the YAG composition ( Comparative Example 8, described as YO + AO in Table 1) in the proportions shown in Table 1, respectively, and a mixer (4 liter malon resin pot, Mixing was performed using 250 g of A1N balls having a diameter of 5 mm, and a solvent (methanol first grade) was added thereto (450 cc for 500 g of A1N raw material).
) And mixed on a rotating table at 130 rpm for 15 hours to prepare a slurry. Next, each slurry was granulated by using a drying device (evaporator (heat-drying device under reduced pressure)), and then sieved to obtain granulated powder having a particle size of 100 μm or less. Next, each granulated powder (except for Comparative Examples 1, 4, and 8) was A
Each was housed in a 1N lid sagger and calcined in an atmosphere of nitrogen gas at atmospheric pressure. The maximum temperature during calcination is lower than the bonding temperature described below, and the heating conditions when the bonding temperature is 1900 ° C. are as follows. Room temperature to 1100 ° C .: 550 ° C./h 1100 to 1500 ° C .: 400 ° C./h 1500 to 1850 ° C .: 200 ° C. 1850 ° C. × 3 h 1850 to 1500 ° C .: 100 ° C./h Next, each calcined body is crushed (A1N). After crushing using a mortar and an A1N pestle), the mixture was sieved to obtain a powdery binder having a particle size of 50 μm or less.

フロントページの続き (72)発明者 藤田 光広 神奈川県秦野市曽屋30番地 東芝セラミッ クス株式会社開発研究所内Continued on the front page (72) Inventor Mitsuhiro Fujita 30 Soya, Hadano-shi, Kanagawa Prefecture Toshiba Ceramics Co., Ltd.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 YAG粉末又はYAG組成となるY2
3 とAl2 3 の混合粉末100重量部とAlN粉末3
0〜150重量部とを混合・仮焼・粉砕した粒子径10
0μm以下の粉粒体からなることを特徴とするAlN焼
結体用接合剤。
1. YAG powder or Y 2 O having a YAG composition
100 parts by weight of mixed powder of Al 3 and Al 2 O 3 and AlN powder 3
0 to 150 parts by weight of mixed, calcined and pulverized particle diameter 10
A bonding agent for an AlN sintered body, comprising a powder having a particle size of 0 μm or less.
【請求項2】 YAG粉末又はYAG組成となるY2
3 とAl2 3 の混合粉末100重量部とAlN粉末3
0〜150重量部とに溶媒を加え混合・乾燥造粒し、こ
れを窒素ガス雰囲気中において1500〜1850℃の
温度で仮焼した後、粒子径100μm以下に粉砕するこ
とを特徴とするAlN焼結体用接合剤の製造方法。
2. Y 2 O to be YAG powder or YAG composition
100 parts by weight of mixed powder of Al 3 and Al 2 O 3 and AlN powder 3
A solvent is added to 0 to 150 parts by weight, mixed, dried and granulated, calcined in a nitrogen gas atmosphere at a temperature of 1500 to 1850 ° C., and then pulverized to a particle diameter of 100 μm or less. A method for producing a bonding agent for binding.
【請求項3】 請求項1記載の接合剤に有機溶剤を添加
してペースト状とし、これをAlN焼結体の接合部に塗
布し又はこれをシート状に成形してAlN焼結体の接合
部間に介装し、窒素ガス雰囲気において1850℃を超
える温度で熱処理することを特徴とするAlN焼結体の
接合方法。
3. An AlN additive is added to the bonding agent according to claim 1 to form a paste, which is applied to a bonding portion of the AlN sintered body or formed into a sheet to bond the AlN sintered body. A method for joining AlN sintered bodies, wherein a heat treatment is performed in a nitrogen gas atmosphere at a temperature exceeding 1850 ° C.
JP24207797A 1997-08-22 1997-08-22 Bonding agent for AlN sintered body, method for producing the same, and method for bonding AlN sintered body using the same Expired - Fee Related JP3513736B2 (en)

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JPH1171184A true JPH1171184A (en) 1999-03-16
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1433764A2 (en) * 2002-12-25 2004-06-30 Ngk Insulators, Ltd. Sintered bodies of yttrium-aluminium garnet, a method of producing the same and sintering aid therefor
US7211153B2 (en) * 2001-04-13 2007-05-01 Sumitomo Electric Industries, Ltd. Ceramic joined body, substrate holding structure and substrate processing apparatus
WO2016002852A1 (en) * 2014-07-01 2016-01-07 京セラ株式会社 Ceramic structure, flow passage body, and electrode internal plate

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4920370B1 (en) * 1970-12-28 1974-05-24
JPS62138370A (en) * 1985-12-10 1987-06-22 黒崎窯業株式会社 Method of joining ceramic bodies
JPH02107570A (en) * 1988-10-15 1990-04-19 Murata Mfg Co Ltd Production of aluminum nitride sintered body
JPH0333066A (en) * 1989-06-30 1991-02-13 Toshiba Corp Aluminum nitride structure and production thereof
JPH0524930A (en) * 1991-07-16 1993-02-02 Showa Denko Kk Aln sintered compact and production thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4920370B1 (en) * 1970-12-28 1974-05-24
JPS62138370A (en) * 1985-12-10 1987-06-22 黒崎窯業株式会社 Method of joining ceramic bodies
JPH02107570A (en) * 1988-10-15 1990-04-19 Murata Mfg Co Ltd Production of aluminum nitride sintered body
JPH0333066A (en) * 1989-06-30 1991-02-13 Toshiba Corp Aluminum nitride structure and production thereof
JPH0524930A (en) * 1991-07-16 1993-02-02 Showa Denko Kk Aln sintered compact and production thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7211153B2 (en) * 2001-04-13 2007-05-01 Sumitomo Electric Industries, Ltd. Ceramic joined body, substrate holding structure and substrate processing apparatus
EP1433764A2 (en) * 2002-12-25 2004-06-30 Ngk Insulators, Ltd. Sintered bodies of yttrium-aluminium garnet, a method of producing the same and sintering aid therefor
EP1433764A3 (en) * 2002-12-25 2004-09-22 Ngk Insulators, Ltd. Sintered bodies of yttrium-aluminium garnet, a method of producing the same and sintering aid therefor
US7371704B2 (en) 2002-12-25 2008-05-13 Ngk Insulators, Ltd. Sintered bodies of yttrium-aluminum garnet, a method of producing the same and sintering aid therefor
WO2016002852A1 (en) * 2014-07-01 2016-01-07 京セラ株式会社 Ceramic structure, flow passage body, and electrode internal plate

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