JPH1167798A - Resin sealing/molding method and metal mold - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity of a product (mold package) by easily removing unnecessary resin and resin flash cured in a resin passage such as a gate, etc., when a sheet member to which an electronic component is fitted is resin- sealed/molded. SOLUTION: A thin covering member 12 is stretched and moved between a fixing die 1 and a set part 5 of a movable die 2 onto which a sheet member 4 is supplied/set, using a moving mechanism 13. Furthermore, when both dies 1 and 2 are mold-clamped, the thin covering member 12 covers the sheet member 4 and is fixed to it except a resin sealing range for resin sealing/molding, and after resin sealing/ molding, the thin covering member 12 is removed from the sheet member 4 in the set part 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of molding an electronic component such as an IC mounted on a sheet member such as a lead frame with a resin material. Regarding improvement.

[0002]

2. Description of the Related Art Conventionally, it has been known that an electronic component mounted on a metal lead frame is molded with a resin using a so-called transfer molding method.

Further, as a plastic sheet member used in the same manner as the above-mentioned lead frame,
A so-called printed circuit board or PC board (Printed Cir
cuitBoard) is known. The sheet member such as the PC board has a required flexibility because it is molded using plastic or the like as a material,
An electronic component such as an electronic circuit or an IC is mounted on the surface of the electronic component, and the electronic component is formed by resin molding using the transfer molding method described above.

In the transfer molding method described above, for example, a set portion (set recess) provided on a mold surface of the lower die is firstly used using a resin molding die including a fixed upper die and a movable lower die. Then, a sheet member such as the metal lead frame is fitted and set, the molds are clamped, and the electronic component is fitted in a resin molding cavity provided on the mold surface of the upper mold. A mold for molding the electronic component on the sheet member in accordance with the cavity shape by injecting and filling the cavity with the molten resin material through a resin passage (runner, gate, etc.) for transferring the molten resin material. It is to be molded in a package (resin-sealed molded body).

Further, as described above, when an electronic component mounted on the above-mentioned sheet member is molded with resin, unnecessary resin as a product cured in a resin passage such as the above-mentioned gate adheres to the above-mentioned sheet member. As well as being integrated, the molten resin material enters between the two mold surfaces from inside the cavity or the like and is hardened, so that resin flash is easily formed on the surface of the sheet member.

That is, the unnecessary resin hardened in the resin passage such as the gate and the resin burrs generated on the outer periphery of the cavity adhere to the surface of the sheet member. It is very difficult to remove the unnecessary cured resin or the resin burrs from the surface of the sheet member at the time of cutting the cured resin (so-called gate cutting) or at the time of removing the resin burrs. In addition, since the unnecessary cured resin and resin burrs are attached to the sheet member, the surface of the sheet member is easily damaged at the time of cutting the gate or removing the resin burrs. In addition, a required electronic circuit provided on the surface of the sheet member is easily disconnected. Further, at the time of cutting the gate, cracks and breakage are likely to occur in the package connected to the unnecessary resin cured in the gate, and after the gate is cut, the package is engaged by the crack and breakage. Transport may be difficult.

Therefore, in order to make it easier to remove the unnecessary cured resin and the resin burrs from the surface of the sheet member, for example, the surface of the sheet member is subjected to a surface treatment such as Au plating which has a low adhesive strength to the resin. In the configuration, or in a configuration in which a film for curing resin release is applied to the sheet member by polymerizing and bonding, the unnecessary cured resin and resin burrs are easily removed from the sheet member. It is considered to be.

[0008]

However, the aforementioned A
Since the surface treatment of the u-plate requires a step of surface-treating the expensive Au plating on the surface of the sheet member in advance, the structure using the film-integrated sheet member requires the following steps. Further, since a step of polymerizing and adhering the film is required, there is a problem that the overall productivity of the product (mold package) is significantly reduced.

That is, according to the present invention, when a sheet member on which an electronic component is mounted is molded with a resin, unnecessary resin and resin burrs hardened in a resin passage such as a gate can be easily removed, and a product ( It is an object of the present invention to provide a resin sealing molding method of an electronic component capable of improving the productivity of a mold package) and a mold therefor.

[0010]

SUMMARY OF THE INVENTION In order to solve the above-mentioned technical problems, a resin sealing molding method for an electronic component according to the present invention is directed to a resin sealing molding method in which a fixed mold and a movable mold are arranged to face each other. A sheet member on which an electronic component is mounted is supplied and set to a set portion of a sheet member provided in one of the two dies using a mold, and the two dies are clamped to form an electronic component on the sheet member. The parts are fitted in the resin molding cavities provided in the other of the two dies, and in this state, the molten resin material is injected and filled into the cavities through the resin passages provided in the two dies. A resin sealing molding method for an electronic component, wherein the electronic component on the sheet member is resin-encapsulated and molded, wherein the sheet member is supplied to the set portion and then set between the two dies. Electronic part of member A thin covering member of a cured resin peeling forming a hole in the corresponding place as resin sealing range performs the step of tensioning the, then, is characterized by a step of clamping said dies.

According to another aspect of the present invention, there is provided a resin-molding mold for an electronic component, which includes a fixed mold, a movable mold opposed to the fixed mold, and a movable mold. A setting portion for supplying and setting a sheet member provided with an electronic component provided on one mold, and a resin molding cavity for fitting and setting the electronic component provided on the other die opposite to the setting portion; A pot for supplying a resin material provided in at least one of the molds, and a resin passage for transferring a molten resin material for injecting and filling the cavity with the resin material heated and melted in the pot. A mold for resin-sealing molding of an electronic component, wherein a hole is formed at a position corresponding to the resin-sealing range of the electronic component in the sheet member, and the cured resin stretched between the two dies. And a thin covering member for Characterized in that a movement mechanism for moving the thin covering member in the mold opening and closing direction of the dies.

Further, the resin sealing molding die for an electronic component according to the present invention is configured such that an exchange body in which the thin covering member is stretched is detachably attached to a moving mechanism for moving the thin covering member. It is characterized by the following.

[0013]

According to the present invention, when an electronic component mounted on a sheet member is resin-molded using a resin-molding mold composed of a fixed die and a movable die, the above-described sheet member is molded. After being supplied and set to the set portion provided in one of the two dies, a cured resin having a hole formed between the two dies at a position corresponding to the resin sealing range of the electronic component in the sheet member. A step of stretching a thin covering member for peeling is performed, and then a step of clamping the two molds is performed.Therefore, when clamping both molds, the thin covering member is removed except for the hole. Can be coated and fastened to the sheet member in the set section. At this time, the electronic components on the sheet member are fitted and set through the holes in the cavities provided in the other of the two dies.
In addition, after the electronic components on the sheet member are molded with resin, unnecessary resin and resin burrs hardened as a product cured in a resin passage such as a gate provided in the two dies are passed through the thin covering member. Will come into contact, not directly, but indirectly. That is, since the unnecessary resin and the resin burrs do not adhere (directly contact) to the surface of the sheet member, the unnecessary resin and the resin burrs can be easily removed from the surface of the sheet member. Can be. Therefore, in the configuration using the thin covering member, the unnecessary resin and resin burrs can be easily removed, so that the overall productivity of the product (mold package) can be improved.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1 to 5 show a mold for resin sealing molding according to the present invention. 6 to 8 show another embodiment.

That is, as shown in FIGS. 1 to 5, the above-mentioned mold is constituted by a fixed upper mold 1 and a movable lower mold 2 arranged opposite to the fixed upper mold 1. The fixed die 1 is mounted on a fixed mounting base 20, and the movable die 2 is mounted on a movable mounting base 21. In addition, the movable die 2 is provided with a set unit 5 (set recess) for supplying and setting the sheet member 4 on which the electronic component 3 is mounted.
The fixed mold 1 is provided with a fixed mold cavity 6 for resin molding in which the electronic component 3 on the sheet member 4 supplied and set to the set section 5 is fitted and set. A fixed resin passage 7 (runner 8, gate 9, etc.) for transferring the molten resin material for injecting and filling the molten resin material is provided in 6. Although not shown, the movable mold 2 is provided with a pot for supplying a resin material, and a plunger for pressurizing the resin is fitted and set in the pot. That is, the movable mold 2 is moved upward to clamp both molds (1 and 2), and the resin material heated and melted in the pot is pressed by the plunger, thereby forming the runner. 8 and gate 9
The cavity 6 is configured to be capable of being injected and filled through the resin passage 7. Therefore, the above-described electronic component 3 can be sealed and molded in a mold package 10 (resin-sealed molded body) corresponding to the shape of the cavity 6.

The sheet member 4 is made of plastic such as a PC board. The body of the sheet member 4 has a required flexibility, and the surface of the sheet member 4 has electronic parts such as electronic circuits and ICs. 3 is attached. The surface of the sheet member 4 on the side where the electronic component 3 is mounted (the upper surface of the sheet member in the illustrated example) includes the electronic component 3 and is substantially the same as the opening edge of the fixed mold cavity 6. Resin sealing area 11 of the electronic component at the position and substantially the same size 11
Is set. Therefore, at the time of resin sealing molding by the two dies (1 and 2), the resin sealing area 11 of the sheet member 4 is sealed and molded with resin.
The electronic component 3 is sealed in the mold package 10 (in the resin sealing area 11).

As shown in FIGS. 1 and 2, the fixed type mounting base 20 has a moving mechanism 13 for moving a moving rod 15 provided with a clamping portion 14 at the distal end side in a mold opening / closing direction.
Is provided. A thin covering member 12 for peeling the cured resin is sandwiched between the holding portions 14 provided on the moving mechanism 13 (see FIG. 8), and the thin covering member 12
12 is configured to be stretched and arranged by the moving mechanism 13 (the holding portion 14) between the mold surfaces of the two molds (1 and 2) so as to be parallel to the mold surfaces. That is, by moving the moving rod 15 provided on the moving mechanism 13 in the mold opening and closing direction (moving up and down in the illustrated example), the thin mold member 12 is stretched in the state where the thin covering member 12 is stretched. Since it is configured to be able to be moved to the mold surface side or to the mold surface side of the movable mold 2, the thin covering member 12 described above is attached to the mold surface of the fixed mold 1 or the mold surface of the movable mold 2. Can be brought into contact with and fixed to the cover.

The thin covering member 12 has a resin sealing area 11 of the electronic component in the sheet member 4.
A hole 18 is formed at a position corresponding to the (cavity 6), and the sheet member 4 supplied and set in the setting section 5 is provided with the above-described resin sealing area 11 (the hole 18) except for the resin sealing area 11 (the hole 18). It is configured such that the thin covering member 12 can be covered and fastened. That is, it is configured such that the hole portion 18 can surely correspond to the resin sealing area 11 of the sheet member 4 (see FIG. 5). Therefore, after the sheet member 4 is supplied and set to the set portion 5 of the movable mold 2, the thin covering member 12 is applied to the sheet member 4 in the set portion 5 when the molds (1 and 2) are clamped. By covering the surface with the thin covering member 12, the thin covering member 12 can be fixed to the sheet member 4 by polymerization. At this time, the electronic component 3 on the sheet member 4 can be fitted and set in the cavity 6 through the hole 18 (see FIGS. 2, 4, and 5).

The thin covering member 12 is attached to the sheet member 4 supplied and set to the setting section 5 of the movable mold 2.
The positioning pilot pin 16 is used for positioning when the cover is fixed. That is, a required number of positioning pilot pins 16 for determining the setting position of the thin covering member 12 are provided on the mold surface of the movable mold 2, and holes 17 corresponding to the pilot pins 16 are provided in the thin covering member 12. (See FIG. 5). Therefore, by fitting and setting the hole 17 of the thin covering member 12 to the pilot pin 16, the thin covering member 12 can be securely fixed to a predetermined position on the mold surface of the movable mold 2. The thin covering member 12 can be securely fixed to the sheet member 4 by polymerization. Further, the thin covering member 12 fixed to the sheet member 4 supplied and set to the setting portion 5 of the movable mold 2 is separated from the sheet member 4 and can be easily removed. . In the example shown in FIG. 5, on the mold surface of the movable mold 2, the covering area covered by the thin covering member 12 is the entire surface of the sheet member 4 supplied and set to the setting section 5 (the resin At least the entire surface of the setting section 5 including the sealing area 11).

Further, after the molten resin material is injected and filled into the cavity 6 and the mold package 10 is molded with the resin in the cavity 6, the thin covering member 12 is fixed to the sheet member 4. Therefore, the resin 19 unnecessary as a product cured in the resin passage 7 (the runner 8 and the gate 9) is indirectly applied to the surface of the sheet member 4 via the thin covering member 12. Will come into contact with. That is, since the cured resin 19 in the resin passage 7 does not directly contact (adhere) to the surface of the sheet member 4, after the resin sealing molding, the cured resin 19 is connected to the mold package 10. Unnecessary cured resin 19 in the resin passage 7 can be removed from the portion corresponding to the gate 9 of the unnecessary cured resin 19 in the resin passage 7.

Further, when the two molds (1 and 2) are clamped and molded with a resin, the resin flash formed by the infiltration of the molten resin material between the two mold surfaces is not required as described above. Like the cured resin 19, the thin resin member 12 is indirectly in contact with the surface of the sheet member 4 via the thin covering member 12 fixed to the sheet member 4. That is, the resin burr can be removed from the sheet member 4 by removing the thin covering member 12 away from the sheet member 4.

Next, a case will be described in which the electronic component 3 on the sheet member 4 is molded with a resin as shown in FIGS. That is, first, the sheet member 4 is supplied and set to the setting section 5 of the movable mold 2, and the resin material is supplied into the pot. Next, the movable mold 2 is moved upward to clamp both molds (1 and 2), and the moving mechanism 13 is operated to supply and set the movable mold 2 to the setting section 5 of the movable mold 2. The thin covering member 12 is covered and fastened to the surface of the sheet member 4 except for the holes 18. Next, the resin material heated and melted in the pot is pressurized by the plunger, thereby forming the resin passage 7.
The electronic component 3 is resin-molded into a mold package 10 corresponding to the shape of the cavity 6 in the cavity 6.

After the molten resin material is cured, the molds (1 and 2) are opened, and at the same time, the package 10 is protruded from the cavity 6 with an ejector pin and released. At this time, the unnecessary cured resin 19 and the resin burrs indirectly come into contact with the surface of the sheet member 4 via the thin covering member 12. Next, the unnecessary resin 19 cured in the gate 9 and the like is removed, and the unnecessary cured resin 19 and the package 10 are separated. Also,
The thin covering member 12 is moved by the moving mechanism 13 into the two types (1.
2) The thin covering member 12 is removed away from the sheet member 4 by moving the resin member between the members, and the resin flash is removed from the sheet member 4.

That is, unnecessary resin 19 hardened in the resin passage 7 such as the gate 9 and resin flash generated around the outer periphery of the cavity 6 are indirectly applied to the sheet through the thin covering member 12. Since it can be brought into contact with the member 4,
When cutting the unnecessary cured resin 19, the unnecessary cured resin
Alternatively, at the time of removing the resin burrs, the resin burrs can be easily removed from the surface of the sheet member 4. Further, since the above-mentioned unnecessary cured resin 19 and resin burrs can be easily removed, it is possible to efficiently prevent the adverse effect of disconnecting a required electronic circuit provided on the surface of the sheet member 4 described above. it can. Further, at the time of cutting the gate, since the unnecessary cured resin 19 can be easily removed, cracks and breakage of the package 10 connected to the unnecessary cured resin 19 can be efficiently prevented. At the same time, the package 10 can be efficiently transported after the gate is cut.

Therefore, at the time of the resin sealing molding using the two molds (1 and 2), the resin sealing area 11 (that is, the hole 18) is formed.
Since the configuration is such that the thin covering member 12 is covered and fastened to the sheet member 4 except for the above, a step of previously performing a surface treatment of expensive Au plating on the surface of the sheet member 4 becomes unnecessary, and Since the step of polymerizing and attaching the thin covering member 12 in advance is not required, the overall product productivity can be improved.

The thin covering member 12 for peeling the cured resin may be a thin film material having heat resistance at least at a resin molding temperature or higher, durability and shape retention. For example, as a thin covering member 12 for peeling the cured resin described above,
Examples thereof include a plastic film such as a Teflon film, a paper material, and a metal thin plate. Further, as the thin covering member, a material having a low adhesive strength with a cured resin, for example,
A configuration in which a Teflon material is formed on a thin film plate (Teflon plate) can be employed.

In the above-described embodiment, the thickness of the thin covering member 12 is set so as not to affect the clamping of the two halves (1 and 2). For example, a configuration in which the thickness of the thin covering member 12 is set to 0.05 mm to 0.1 mm can be adopted. That is, the thickness of the thin covering member 12 is
If the thickness is less than 0.05 mm, the thin covering member 12 is liable to wear or break, causing a problem in durability, and if the thickness of the thin covering member 12 exceeds 0.1 mm, the cavity 6 The thickness of the package 10 formed therein becomes larger than a predetermined thickness, and a quality assurance problem occurs that the thickness of the package 10 (product) deviates from a predetermined standard value.

Further, at least a portion of the surface of the metal thin-film plate which is in contact with the molten resin material is subjected to a surface treatment with a material having a low adhesive strength to a cured resin, for example, a Teflon layer (that is, a Teflon processing is performed) Applied metal thin film plate).

In the above embodiment, the plastic sheet member such as the PC board has been mainly described as an example. However, according to the gist of the present invention, in addition to the metal lead frame, various other members are used. A sheet member formed of a material can be employed.

The present invention is not limited to the above-described embodiment, but may be arbitrarily and appropriately changed and selected as necessary without departing from the spirit of the present invention. It is.

Next, another embodiment shown in FIGS. 6, 7, and 8 will be described. The basic components of the mold for resin encapsulation used in the embodiment shown in FIGS. 6, 7, and 8 are the same as the basic components of the mold used in the above-described embodiment. In addition, similarly to the above-described embodiment, the configuration using the thin covering member for peeling the cured resin is configured to improve the overall productivity of the product.

That is, similarly to the above embodiment, FIGS.
The mold used in the embodiment shown in FIG.
A movable lower mold is provided, and a movable mechanism 34 capable of moving a movable rod 33 provided with a detachable portion 32 at a tip thereof in a mold opening / closing direction is provided on a fixed mold mounting base provided with the fixed mold. (See FIGS. 1 and 2). Further, an exchange body 31 in which a thin covering member 30 for peeling the cured resin is stretched over an attaching / detaching portion 32 provided on the moving mechanism 34.
Are detachably provided. That is, in the above-mentioned exchange body 31, the thin covering member 30, a clamping portion 35 provided on the outer periphery of the thin covering member 30 and clamping and stretching the outer periphery of the thin covering member 30; The holding part 35
The attachment / detachment rod 36 is provided upright, and the attachment / detachment rod 37 is provided in the attachment / detachment portion 32 so that the attachment / detachment rod 36 is detachably provided. 6, 7, and 8).

That is, as shown in FIG. 8, in order to mount a detachable rod 36 on the detachable portion 32 at a predetermined position of the fitting hole 37, an engaging ball 39 and the ball 39 Hole 37
An elastic member 40 such as a compression spring for elastically projecting inward is provided.
An engaging portion 41 (recess) that engages with 39 is provided. According to such a configuration, the attachment / detachment rod 36 can be easily attached to / detached from the fitting hole 37 of the attachment / detachment portion 32, so that the exchange body 31 is attached to the mold side. The thin covering member 30 can be easily replaced. Therefore, for example, when molding a wide variety of products, the thin covering member 30 can be easily replaced by using the replacement body 31, so that the overall product productivity can be improved. In the same manner as in the above embodiment, the thin covering member 30 has a hole 42 corresponding to the resin sealing area of the sheet member, and a hole for fitting and setting a pilot pin provided on the movable die. A part 43 is provided.

In each of the above embodiments, the pilot pin (16) is connected to the hole (1) of the thin covering member (12/30).
When the thin covering member (12.30) is coated and fastened to the sheet member (4) supplied and set in the setting section (5) by positioning by fitting the The thin covering member (12, 30) is slightly moved in the horizontal plane direction.
May be loosely (slowly) mounted on the moving mechanism (34), and the position of the thin covering member (30) may be finely adjusted to secure the covering.

[0035]

According to the present invention, unnecessary resin cured in a resin passage such as a gate and resin burrs generated around the outer periphery of a cavity are indirectly applied to the sheet through the thin covering member. Since it can be brought into contact with a member, the unnecessary hardened resin is removed when the unnecessary hardened resin in the gate or the like is cut (so-called gate cutting), or the resin flash is removed when the resin flash is removed. This has an excellent effect that it can be easily removed from the surface of the sheet member.

Further, according to the present invention, the above-mentioned unnecessary cured resin and resin burrs can be easily removed, so that it is efficient to disconnect a required electronic circuit provided on the surface of the above-mentioned sheet member. It has an excellent effect that it can be prevented well.

Further, according to the present invention, when the gate is cut, unnecessary resin hardened in the gate can be easily removed. It is possible to efficiently prevent cracks and breakage of the package and to efficiently carry out the engagement and transportation of the package after the gate is cut.

According to the present invention, when a sheet member on which an electronic component is mounted is molded with a resin, unnecessary resin and resin burrs cured in a resin passage such as a gate can be easily removed. The present invention has an excellent effect of being able to provide a resin sealing molding method of an electronic component capable of improving the productivity of a product and a mold therefor.

[Brief description of the drawings]

FIG. 1 is a schematic longitudinal sectional view showing a mold for resin sealing molding according to the present invention, showing the mold open state.

FIG. 2 is a schematic longitudinal sectional view of a mold corresponding to FIG. 1,
This shows the mold clamping state.

FIG. 3 is an enlarged schematic longitudinal sectional view showing a main part of the mold corresponding to FIG. 1 in an enlarged manner, and shows a mold opened state.

FIG. 4 is an enlarged schematic longitudinal sectional view showing a main part of the mold corresponding to FIG. 2 in an enlarged manner, and shows a mold clamping state;

5 is a schematic plan view of the mold shown in FIG. 1, showing a lower mold surface thereof.

FIG. 6 is a schematic longitudinal sectional view showing a main part of a mold according to another embodiment of the present invention.

FIG. 7 is a schematic plan view of a main part of the mold shown in FIG. 6;

FIG. 8 is an enlarged schematic vertical sectional view showing a main part of the mold shown in FIG. 6 in an enlarged manner.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Fixed upper mold 2 Movable lower mold 3 Electronic component 4 Sheet member 5 Set part (recess for setting) 6 Cavity 7 Resin passage 8 Runner 9 Gate 10 Mold package (Resin molding) 11 Resin sealing area 12 Thin coating Member 13 Moving mechanism 14 Nipping part 15 Moving rod 16 Pilot pin 17 Hole 18 Hole 19 Hardened resin 20 Fixed mounting base 21 Movable mounting base 30 Thin covering member 31 Exchanger 32 Detachable part 33 Moving rod 34 Moving mechanism 35 Holder 36 Removable rod 37 Removable fitting hole 39 Ball for engagement 40 Elastic member 41 Engagement part 42 Hole 43 Hole

──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. ⁶ Identification code FI // B29L 31:34

Claims (3)

[Claims] An electronic component is mounted on a set portion of a sheet member provided on one of the two dies using a mold for resin sealing molding in which a fixed mold and a movable mold are arranged to face each other. While supplying and setting the sheet member, the two dies are clamped to fit the electronic components on the sheet member into the resin molding cavity provided in the other one of the two dies, and in this state, A resin encapsulation method of an electronic component, wherein an electronic component on the sheet member is resin encapsulation molded by injecting and filling a molten resin material into the cavity through a resin passage provided in the both dies. After supplying the set sheet member to the set portion, a thin covering member for peeling the cured resin having a hole formed between the two dies at a position corresponding to the resin sealing range of the electronic component in the sheet member. Stretching process There, then, the resin encapsulation molding method of an electronic component which is characterized in that both mold clamping to process. 2. A set unit for supplying and setting a fixed member, a movable member opposed to the fixed member, and a sheet member mounted with an electronic component provided on one of the two members. A cavity for resin molding, which is provided in the other mold facing the part, for fitting the electronic component therein, a resin material supply pot provided in at least one of the two dies, and heating in the pot. A resin passage for electronic component having a resin passage for transferring a molten resin material for injecting and filling the molten resin material into the cavity, wherein the resin sealing of the electronic component in the sheet member is performed. A thin covering member formed with holes at positions corresponding to the stop range and stretched between the two dies, and a moving mechanism for moving the thin covering member in the mold opening and closing direction of the two dies; It is characterized by having For resin encapsulation of electronic components. 3. The resin-sealing molding of an electronic component according to claim 2, wherein an exchange body in which the thin covering member is stretched is detachably attached to a moving mechanism for moving the thin covering member. Mold.