JPH1167519A - Wire wound electronic component - Google Patents

Wire wound electronic component

Info

Publication number
JPH1167519A
JPH1167519A JP9237688A JP23768897A JPH1167519A JP H1167519 A JPH1167519 A JP H1167519A JP 9237688 A JP9237688 A JP 9237688A JP 23768897 A JP23768897 A JP 23768897A JP H1167519 A JPH1167519 A JP H1167519A
Authority
JP
Japan
Prior art keywords
material
resin
electronic component
ferrite
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9237688A
Other languages
Japanese (ja)
Inventor
Hideo Aoba
Hideyuki Karasawa
Hideki Ogawa
Kazuhiko Otsuka
Kazuyuki Shibuya
Takayuki Uehara
孝行 上原
秀幸 唐澤
一彦 大塚
秀樹 小川
和行 渋谷
秀夫 青葉
Original Assignee
Taiyo Yuden Co Ltd
太陽誘電株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd, 太陽誘電株式会社 filed Critical Taiyo Yuden Co Ltd
Priority to JP9237688A priority Critical patent/JPH1167519A/en
Priority claimed from US09/131,392 external-priority patent/US6198373B1/en
Priority claimed from GB0008557A external-priority patent/GB2345801B/en
Publication of JPH1167519A publication Critical patent/JPH1167519A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To improve the heat radiation properety, water resistance and electrostatic resistance of a wire wound electronic component by adding power as a pyrogenetic conductive material to the sealing resin of the electronic component. SOLUTION: One or both powders out of an inorganic material or a metallic material in higher thermal conductivity than that of a resin materials is added as a filler to the resin material. Otherwise, the mixture of the powder with another powder of a magnetic shielding ferrite is added as the filler to the resin material. At this time, the quantity of the powder of the magnetic shielding ferrite is adjusted or the shape thereof is devised so that the thermal expansion ratio (or coefficient) of the sealing resin may be adjusted to be approached to the thermal expansion ratio of the ferrite material comprising the winding core. Furthermore, the additive to the magnetic shielding ferrite or a pyrogenetic conductive material, etc., is hydrophobic surface processed so as to form a hydrophobic film on the surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wound type electronic component such as an inductor, a transformer, a choke coil and the like, and a sealing resin therefor, and more specifically to an improvement in the reliability thereof.

[0002]

BACKGROUND ART A wound electronic component has a structure as shown in FIG. 5A, for example. In the figure, square pillars (or square thick plates) are provided on both ends of a cylindrical (or elliptical, prismatic, etc.) core 10 around which a coil conductor is wound. The core 10 and the flanges 12 and 14 are formed of a magnetic material such as ferrite, and the core 10 and the flanges 12 and 14 are made of these materials.
6 are constituted. Electrodes 18 and 20 are formed on the outer side surfaces and end surfaces of the flanges 12 and 14, respectively.

[0003] A conductor 22 is wound around the center core 10 of the winding core 16, and lead wires 24 and 26 at both ends thereof are connected to the flange 1.
2 and 14 are joined to the electrodes 18 and 20 at the side portions, respectively. A sealing resin 28 is applied to the recess between the flanges 12 and 14 so as to cover the conductor 22. The electrodes 18, 20 to which the leads 24, 26 are connected are further plated 30, 32, respectively.

The sealing resin 28 includes, for example,
No. 2,236,305 discloses an epoxy resin containing ferrite powder. By the addition of such ferrite powder, the magnetic flux 34 passes through the sealing resin 28 to improve the magnetic shielding property, reduce the magnetic influence on adjacent components, as shown by an example with a dotted line, The inductance value of the component itself can be improved.

[0005]

By the way, when electricity is supplied to the conductor 22 of the wound type electronic component having the above structure, heat is generated. However, the ferrite of the core 16 and the ferrite which is a filler of the sealing resin 28 are used. In the powder, the magnetic permeability (μ) indicating its magnetic property changes depending on the temperature. Therefore, good heat dissipation is required as in general electronic components. From the viewpoint of mounting, it is also important to take measures against static electricity in order to prevent connection between components.

Further, if the adhesion between the core 16 and the sealing resin 28 is poor, as shown by an arrow FA in FIG.
There is an inconvenience that moisture penetrates into the inside from the joint between the (or 14) and the sealing resin 28, and the reliability as a component is reduced. In addition, the passage of the magnetic flux 34 is cut off at the joint between the flange 12 and the sealing resin 28, so that the magnetic shielding effect is reduced or the inductance value is reduced.
Also in the case where the pinhole 36 exists in the sealing resin 28, there is a possibility that moisture may enter the inside of the component as shown by the arrow FB.

If the inductance value is increased by increasing the ferrite content, the ferrite powder particles 38 are connected from the surface of the sealing resin 28 to the core 16 or the conductor 22. In such a case, as shown by the arrow FC, there is a possibility that moisture may penetrate inside the component along the surface of the ferrite particles 38. A similar possibility exists when the surface of the ferrite particles 38 does not have wettability to the resin material.

The present invention focuses on these points.
It is an object of the present invention to provide a highly reliable wire-wound electronic component with improved heat dissipation, water resistance, and static electricity resistance.

[0009]

In order to achieve the above object, a wire-type electronic component according to the present invention is characterized in that (1) a powder that is a high thermal conductive material is added to a resin material with respect to a sealing resin.
(2) Add at least one powder of a high thermal conductive material, such as a metal material or an inorganic material, to a resin material together with a powder of a ferrite material for magnetic shielding. (1) adjusting the coefficient of thermal expansion of the sealing resin with a ferrite material for a magnetic shield; (4) moving a ferrite material in the resin to form a first layer mainly composed of a ferrite material for a magnetic shield; (5) Applying a hydrophobic surface treatment to the surface of the additive added to the resin material or a hydrophobic and wettability to the resin material. It is characterized by the following.

The above and other objects, features and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings.

[0011]

Embodiments of the present invention will be described below in detail. (1) Mode 1 This mode is intended to improve the thermal conductivity and to suppress the generation of static electricity to improve the reliability, as shown in FIG. That is, a, one or both powders of an inorganic material or a metal material having higher thermal conductivity than the resin material are added to the resin material as a filler (see FIGS. 1A to 1C), b, Of the inorganic material or the metal material, one or both powders, a mixed powder of the magnetic shield ferrite material powder,
Added to resin material as filler (see (D)-(F) in the same figure),
One of the configurations.

When a sealing resin obtained by adding such a high thermal conductive material to a resin material is used, heat generated inside the component due to energization of the coil conductor is effectively released to the outside of the component through the high thermal conductive material. And good heat dissipation can be obtained. In particular, when metal powder is used as an additive to the resin material, the metal powder also prevents charging, and suppresses generation of static electricity. For this reason, inconveniences such as parts adhering to each other at the time of mounting are eliminated, and the mountability of the parts is improved. Also, depending on the high heat conductive material mixed, the magnetic permeability of the sealing resin changes, and the inductance value of the component also changes. Therefore, it is possible to adjust the inductance value by controlling the mixed amount of the high heat conductive material.

Next, examples of the present embodiment will be described. As the resin material, for example, a thermosetting resin or a thermoplastic resin is used. For example, an epoxy resin is a preferred example. As the inorganic material having high thermal conductivity, for example, ferrite, aluminum nitride, and diamond are used. Since a metal material generally has high thermal conductivity, any material can be used.

The filling ratio of the high thermal conductive material to the resin material is as follows:
For example, in the case of FIG. 1A, the high thermal conductive inorganic material is 90 wt% with respect to the resin material 10 wt%. The reason is that filling as much of the high thermal conductive inorganic material as possible increases the effect,
As a result, the reinforcing effect of the resin decreases. From such a viewpoint, at least 10% of the resin material is required. In the case of FIGS. 1B to 1F, for example, the weight ratio is as shown in the drawing.

Regarding the particle size of the high thermal conductive material, if the particle size is too small, the thermal conductivity will not be improved. There are inconveniences such as. From such a viewpoint, for example, in the case of FIG.
It is preferable that the average particle diameter be about 0 μm and about 10 μm. FIG.
The same applies to (B) to (F).

Further, in the case of FIGS. 1 (D) to 1 (F), the ferrite material for magnetic shielding is filled in the sealing resin. It is determined by the balance between the magnetic shielding effect of the ferrite material and the heat radiation effect (contributing to the improvement of reliability) of the high thermal conductive material. In particular, when the ferrite material is used as a high thermal conductive inorganic material, the particle size distribution of the ferrite powder is 1 to
When the thickness is 100 μm, the fine particles move when the mixed sealing resin is cured, so that the internal stress is reduced.

(2) Form 2 In this form, the reliability is improved from the viewpoint of the adhesion between the core and the sealing resin. As shown by the arrow FA in FIG. 5B, when the adhesion between the core 16 and the sealing resin 28 is poor, moisture enters through the gap and the water resistance decreases. Therefore,
In the present embodiment, the coefficient of thermal expansion (or the coefficient of thermal expansion) of the sealing resin 28 is adjusted by increasing or decreasing the amount of ferrite powder for the magnetic shield, or by devising its shape. Thereby, the coefficient of thermal expansion of the sealing resin 28 is
When the coefficient of thermal expansion of the ferrite material constituting 6 approaches, the peeling of the sealing resin 28 due to a heat cycle or the like is prevented. For this reason, the adhesion between the core 16 and the sealing resin 28 is improved, and the intrusion of moisture from the joint between the flanges 12 and 14 and the sealing resin 28 is prevented.

In the embodiment of the present invention, the mixing ratio of the ferrite material and the resin material is, for example, 70% by weight of ferrite powder.
% And a resin material of 30 wt% are preferable. Further, the particle size of the ferrite material is preferably 1 to 100 μm. Also, by using a spherical ferrite powder, the coefficient of thermal expansion can be adjusted for reasons such as improved dispersibility.

(3) Mode 3 This mode is to improve the reduction in water resistance due to the pinhole of the sealing resin. As shown by the arrow FB in FIG. 5B, when the pinhole 36 exists in the sealing resin 28,
Moisture may enter. Therefore, in this embodiment, FIG.
As shown in FIG. 7, a resin layer 50 is impregnated on the sealing resin 28. Thereby, the pinhole 3 of the sealing resin 28 is formed.
6 is buried in the resin layer 50 to prevent the intrusion of moisture and improve the water resistance. In addition, as the resin layer 50, a material having low viscosity and high fluidity may be used. Further, this also improves the formability of the sealing resin surface.

(4) Form 4 This form is an improvement in the reduction in water resistance due to additives in the sealing resin. As shown by an arrow FC in FIG. 5B, when the ferrite particles 38 are connected or when the surface of the ferrite particles 38 has no wettability to the resin material, the water resistance Decrease.

Therefore, in this embodiment, first, an additive 60 such as a ferrite material for a magnetic shield or a high thermal conductive material is subjected to a hydrophobic surface treatment (microencapsulation), and as shown in FIG. Then, a hydrophobic film 62 is formed. When the ferrite content in the sealing resin is increased, the additive 60 is connected from the surface of the resin 64 to the core 16 or the conductor 22 as shown in FIG. However, according to the present embodiment, the action of the hydrophobic film 62 prevents the intrusion of moisture indicated by the arrow FC in FIG. 5B, and improves the water resistance.

Further, in this embodiment, if the hydrophobic film 62 is used so that the wettability of the hydrophobic film 62 with respect to the resin 64 is improved, the adhesion at the interface between the hydrophobic film 62 and the resin 64 is improved, and the water resistance is improved. And water resistance are improved. When the resin is filled with a ferrite powder not subjected to a surface treatment, the ferrite powder is made to have good wettability to the resin.

Next, examples of the present embodiment will be described.
As a specific method of the surface treatment with hydrophobicity to 0, for example, there is a hydrophobic treatment using a fluorine-based surfactant or a silicon-based surfactant. In addition, as a specific method for improving the wettability to a resin, for example, there are a silane coupling treatment and a titanium coupling treatment.

(5) Embodiment 5 This embodiment also improves reliability from the viewpoints of water resistance and waterproofness, as in the above embodiment. FIG. 4 shows a state of the sealing resin in the present embodiment. First, FIG. 7A shows that only the resin component is selectively located on the front surface side, that is, the interface with the outside air when the sealing resin 70 is applied and cured. By applying a centrifugal force or an external magnetic field when the sealing resin 70 is cured, various additives 72 are moved to the coil conductor 22 side, and as a result, the surface side becomes the resin layer 70A. It is advantageous to use a relatively low viscosity, high flow resin. Additive 72 described above
Penetration of water due to intervening water (see arrow FC in FIG. 5)
Is better prevented by the presence of the resin layer 70A.

FIG. 4B shows that the additive 72 is added to the sealing resin 70.
The resin layer 70B is formed on the coil conductor 22 side. FIG. 4C illustrates a combination of (A) and (B), in which a resin layer 70 </ b> C is formed at the center of the sealing resin 70. Such a structure
For example, a method of applying the above-described centrifugal force or an external magnetic field,
This can be realized by forming the sealing resin 70 into a multilayer structure.

The present invention has many embodiments and can be variously modified based on the above disclosure.
For example, the following is also included. (1) The structure of the wire-wound electronic component shown in FIG. 5 is an example, and can be applied to various structures. For example, the present invention can be applied to a winding component having a vertical structure as disclosed in Japanese Patent Application Laid-Open No. 4-338613. In addition, the present invention is also applicable to winding components such as a common mode choke coil in which a core is wound by bifilar winding. (2) The above-described materials and conditions are also examples, and the present invention is not limited thereto. Furthermore, you may make it combine the said form.

[0027]

As described above, according to the present invention,
The following effects are obtained. (1) Since a high thermal conductive material is added to the sealing resin, good heat dissipation can be obtained and reliability is improved. In particular, when metal powder is used, inconvenience due to static electricity is reduced. (2) Since the coefficient of thermal expansion between the core and the sealing resin is adjusted, the adhesion between the core and the sealing resin is improved. The resin layer is formed in multiple layers. By applying a water-resistant surface treatment, reliability is improved in terms of water resistance and waterproofness.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of an additive according to the first embodiment of the present invention.

FIG. 2 is a diagram showing a state of a sealing resin portion according to Embodiment 3 of the present invention.

FIG. 3 is a diagram showing a state of a sealing resin portion according to Embodiment 4 of the present invention.

FIG. 4 is a diagram showing a state of a sealing resin portion according to a fifth embodiment of the present invention.

FIG. 5 is a diagram illustrating a basic configuration of an example of a wound electronic component and a state of a sealing resin portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Core 12, 14 ... Flange 16 ... Winding core 18, 20 ... Electrode 22 ... Conductor 24, 26 ... Lead wire 28, 70 ... Sealing resin 30, 32 ... Plating 34 ... Magnetic flux 36 ... Pinhole 38 ... Ferrite particle 50 , 70A, 70B, 70C ... resin layer 60, 72 ... additive 62 ... hydrophobic film 64 ... resin

Continuation of the front page (51) Int.Cl. 6 Identification symbol FI H01F 37/00 H01F 37/00 N 1/37 (72) Inventor Hideyuki Karasawa 6-16-20 Ueno Taito-ku, Tokyo Taiyo Denki Stock Inside the company (72) Inventor Hideo Aoba 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Kazuyuki Shibuya 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. Inside

Claims (8)

[Claims]
1. A wire-wound electronic component in which a conductor wound around a core is sealed with a resin material, wherein a powder of a high thermal conductive material is added to the resin material.
2. The wound electronic component according to claim 1, wherein a ferrite material for magnetic shielding is added to the resin material.
3. The wire-wound electronic component according to claim 2, wherein the ferrite material adjusts the coefficient of thermal expansion of the sealing resin to a value close to the coefficient of thermal expansion of the core.
4. The wire-wound electronic component according to claim 1, wherein the high thermal conductive material includes at least one of a metal material and an inorganic material.
5. A wire-wound electronic component in which a conductor wound around a core is sealed with a sealing resin, wherein the sealing resin comprises: a first layer mainly composed of a ferrite material for magnetic shielding; A wound-type electronic component formed by laminating a second layer mainly composed of a resin material.
6. The method according to claim 5, wherein the first and second layers are formed by moving a ferrite material in the resin.
A wound electronic component as described.
7. A wound electronic component in which a conductor wound around a core is sealed with a resin material containing an additive, wherein a surface of the additive is subjected to a hydrophobic surface treatment. Wire-wound electronic components.
8. The wire-wound electronic component according to claim 7, wherein the additive is subjected to a surface treatment in consideration of wettability to a resin material.
JP9237688A 1997-08-19 1997-08-19 Wire wound electronic component Pending JPH1167519A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9237688A JPH1167519A (en) 1997-08-19 1997-08-19 Wire wound electronic component

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
JP9237688A JPH1167519A (en) 1997-08-19 1997-08-19 Wire wound electronic component
US09/131,392 US6198373B1 (en) 1997-08-19 1998-08-07 Wire wound electronic component
GB0008557A GB2345801B (en) 1997-08-19 1998-08-17 Wire wound electronic component
GB0008556A GB2345800A (en) 1997-08-19 1998-08-17 Method of manufacture for a wire wound electronic component
GB0008555A GB2345799A (en) 1997-08-19 1998-08-17 Filler material for a wire wound electronic component
GB0008559A GB2345803B (en) 1997-08-19 1998-08-17 Wire wound electronic component
GB9817928A GB2329762B (en) 1997-08-19 1998-08-17 Wire wound electronic component
GB0008558A GB2345802B (en) 1997-08-19 1998-08-17 Wire wound electronic component
MYPI9803726 MY121005A (en) 1997-08-19 1998-08-17 Wire wound electronic component
SG1998003126A SG65782A1 (en) 1997-08-19 1998-08-18 Wire wound electronic component
SG200205778A SG102695A1 (en) 1997-08-19 1998-08-18 Wire wound electronic component
CN 98118456 CN1210345A (en) 1997-08-19 1998-08-19 Wire wound electronic component
CNA031328415A CN1495812A (en) 1997-08-19 1998-08-19 Wound electronic component
CN 03132843 CN1277281C (en) 1997-08-19 1998-08-19 Wound electronic component
HK04107008A HK1064504A1 (en) 1997-08-19 2004-09-14 Wire wound electronic component

Publications (1)

Publication Number Publication Date
JPH1167519A true JPH1167519A (en) 1999-03-09

Family

ID=17019045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9237688A Pending JPH1167519A (en) 1997-08-19 1997-08-19 Wire wound electronic component

Country Status (1)

Country Link
JP (1) JPH1167519A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009004670A (en) * 2007-06-25 2009-01-08 Nec Tokin Corp Drum-type inductor and its manufacturing method
WO2011104975A1 (en) * 2010-02-25 2011-09-01 住友電気工業株式会社 Reactor and method for manufacturing reactor
JP2012019087A (en) * 2010-07-08 2012-01-26 Denso Corp Reactor device
WO2012035940A1 (en) * 2010-09-13 2012-03-22 住友電気工業株式会社 Reactor and manufacturing method for reactor
WO2014202238A1 (en) * 2013-06-21 2014-12-24 Siemens Aktiengesellschaft Converter unit, particularly a combination converter
JP2015226009A (en) * 2014-05-29 2015-12-14 株式会社デンソー Reactor
JP2016039331A (en) * 2014-08-08 2016-03-22 株式会社タムラ製作所 Soft magnetic composite material, manufacturing method thereof, magnetic core arranged by use of soft magnetic composite material, reactor, and manufacturing method of reactor

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009004670A (en) * 2007-06-25 2009-01-08 Nec Tokin Corp Drum-type inductor and its manufacturing method
WO2011104975A1 (en) * 2010-02-25 2011-09-01 住友電気工業株式会社 Reactor and method for manufacturing reactor
JP2011199257A (en) * 2010-02-25 2011-10-06 Sumitomo Electric Ind Ltd Method for manufacturing reactor
US8830022B2 (en) 2010-02-25 2014-09-09 Sumitomo Electric Industries, Ltd. Reactor and method for manufacturing reactor
JP2012019087A (en) * 2010-07-08 2012-01-26 Denso Corp Reactor device
WO2012035940A1 (en) * 2010-09-13 2012-03-22 住友電気工業株式会社 Reactor and manufacturing method for reactor
JP2012060053A (en) * 2010-09-13 2012-03-22 Sumitomo Electric Ind Ltd Reactor and method for manufacturing the same
US8922327B2 (en) 2010-09-13 2014-12-30 Sumitomo Electric Industries, Ltd. Reactor and manufacturing method for reactor
WO2014202238A1 (en) * 2013-06-21 2014-12-24 Siemens Aktiengesellschaft Converter unit, particularly a combination converter
US9478345B2 (en) 2013-06-21 2016-10-25 Siemens Aktiengesellschaft Converter unit, particularly a combination converter
JP2015226009A (en) * 2014-05-29 2015-12-14 株式会社デンソー Reactor
JP2016039331A (en) * 2014-08-08 2016-03-22 株式会社タムラ製作所 Soft magnetic composite material, manufacturing method thereof, magnetic core arranged by use of soft magnetic composite material, reactor, and manufacturing method of reactor

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