JPH1154880A5 - - Google Patents

Info

Publication number
JPH1154880A5
JPH1154880A5 JP1997211031A JP21103197A JPH1154880A5 JP H1154880 A5 JPH1154880 A5 JP H1154880A5 JP 1997211031 A JP1997211031 A JP 1997211031A JP 21103197 A JP21103197 A JP 21103197A JP H1154880 A5 JPH1154880 A5 JP H1154880A5
Authority
JP
Japan
Prior art keywords
electronic component
conductive adhesive
mounting land
substrate
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997211031A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1154880A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP21103197A priority Critical patent/JPH1154880A/ja
Priority claimed from JP21103197A external-priority patent/JPH1154880A/ja
Publication of JPH1154880A publication Critical patent/JPH1154880A/ja
Publication of JPH1154880A5 publication Critical patent/JPH1154880A5/ja
Pending legal-status Critical Current

Links

JP21103197A 1997-08-05 1997-08-05 電子部品の構造及び電子部品の実装構造 Pending JPH1154880A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21103197A JPH1154880A (ja) 1997-08-05 1997-08-05 電子部品の構造及び電子部品の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21103197A JPH1154880A (ja) 1997-08-05 1997-08-05 電子部品の構造及び電子部品の実装構造

Publications (2)

Publication Number Publication Date
JPH1154880A JPH1154880A (ja) 1999-02-26
JPH1154880A5 true JPH1154880A5 (en:Method) 2005-05-26

Family

ID=16599226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21103197A Pending JPH1154880A (ja) 1997-08-05 1997-08-05 電子部品の構造及び電子部品の実装構造

Country Status (1)

Country Link
JP (1) JPH1154880A (en:Method)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6524721B2 (en) 2000-08-31 2003-02-25 Matsushita Electric Industrial Co., Ltd. Conductive adhesive and packaging structure using the same
JP4814639B2 (ja) 2006-01-24 2011-11-16 富士通セミコンダクター株式会社 半導体装置および半導体装置の製造方法
JP2009212255A (ja) * 2008-03-04 2009-09-17 Tdk Corp コイル部品及びその製造方法

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