JPH1147964A - Laser beam processing device - Google Patents

Laser beam processing device

Info

Publication number
JPH1147964A
JPH1147964A JP9210674A JP21067497A JPH1147964A JP H1147964 A JPH1147964 A JP H1147964A JP 9210674 A JP9210674 A JP 9210674A JP 21067497 A JP21067497 A JP 21067497A JP H1147964 A JPH1147964 A JP H1147964A
Authority
JP
Japan
Prior art keywords
temperature
workpiece
temperature sensor
assist gas
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9210674A
Other languages
Japanese (ja)
Inventor
Satoshi Eguchi
Hiroyuki Hayashikawa
Takayuki Yamashita
隆之 山下
洋之 林川
聡 江口
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP9210674A priority Critical patent/JPH1147964A/en
Publication of JPH1147964A publication Critical patent/JPH1147964A/en
Application status is Pending legal-status Critical

Links

Abstract

PROBLEM TO BE SOLVED: To perform the stable laser beam processing with excellent quality without being affected by the temperature of a workpiece by detecting the temperature of the work by a temperature sensor, and controlling the laser beam output, the assist gas pressure and the moving speed of a matching head and a work loading table to optimum value according to the detected temperature during the machining. SOLUTION: A numerical value control device 9 receives in advance the values of the optimum laser beam output, the assist gas pressure, the moving speed of a machining head 4 and a table 8, etc., according to the temperature of a workpiece 6. The temperature of the workpiece 6 is detected by a temperature sensor 13, the detected signal is received by the numerical value control device 9 to respectively control the laser beam output by a power supply device 10, the assist gas pressure by an assist gas controller 11, and the moving speed of the machining head 4 and the table 8 by a servo controller 12 according to the corresponding values. The temperature sensor 13 is brought into contact with or close to the workpiece 6, and a thermocouple or a thermister can be used therefor.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、レーザ光により被加工物を加工するレーザ加工装置に関し、特に、被加工物の温度に影響されずに、安定した加工を行うことができるレーザ加工装置に関するものである。 BACKGROUND OF THE INVENTION The present invention relates to a laser machining apparatus for machining a workpiece by the laser beam, in particular, without being affected by the temperature of the workpiece, a laser machining apparatus capable of performing stable cutting it is intended.

【0002】 [0002]

【従来の技術】図3は、従来のレーザ加工装置の構成を示したもので、1はレーザ光を発生するレーザ発振器、 BACKGROUND ART FIG. 3 shows the structure of a conventional laser processing apparatus, 1 is a laser oscillator for generating a laser beam,
2はレーザ発振器1より出力されたレーザ光であり、反射鏡3により光路変更され、加工ヘッド4内に配設されたレンズ5により集光され、加工ヘッド4内に導入されたアシストガス7とともに、テーブル8に積載された被加工物6に照射される。 2 is a laser beam outputted from the laser oscillator 1, optical path is changed by the reflecting mirror 3 is condensed by the lens 5 disposed in the processing head 4, together with the assist gas 7 introduced into the processing head 4 It is irradiated to the workpiece 6 stacked on the table 8. 9は数値制御装置であり、予め設定された値に応じて電源装置10を介してレーザ発振器1の出力を、アシストガスコントローラ11を介してアシストガス7の圧力を、サーボコントローラ12を介して加工ヘッド4とテーブル8の移動速度をそれぞれ制御し、 9 is a numerical control device, the output of the laser oscillator 1 through the power device 10 according to a preset value, the pressure of the assist gas 7 through the assist gas controller 11, via the servo controller 12 processing the moving speed of the head 4 and the table 8 is controlled respectively,
被加工物6を任意の形に加工する。 Machining the workpiece 6 on any form.

【0003】このように、従来のレーザ加工装置は、被加工物6に対して、最適と思われる加工条件、すなわちレーザ出力、アシストガス圧力、加工ヘッドとテーブルの移動速度を、予め数値制御装置9に設定しておき、この設定値と実際の値とを比較して、実際の値が予め設定されている値になるように数値制御装置9によって電源装置10、アシストガスコントローラ11、サーボコントローラ12を制御するものである。 [0003] Thus, the conventional laser machining apparatus, the workpiece 6, processing conditions seem optimal, i.e. the laser output, the assist gas pressure, the moving speed of the processing head and the table, pre-numerical controller may be set to 9, by comparing the actual values ​​with the set value, the power supply device 10 by the numerical controller 9 so that the actual value is the value that is set in advance, the assist gas controller 11, a servo controller it is intended to control the 12.

【0004】 [0004]

【発明が解決しようとする課題】しかしながら、一般にレーザ加工では、加工を行っていくに従い、被加工物6 [SUMMARY OF THE INVENTION However, in the general laser processing, in accordance with intended to make machining, the workpiece 6
は発熱して温度が上昇し、特に厚板の微細加工を行う場合、加工開始時と加工終了時とでは被加工物6の温度は大きく異なってくる。 The heating and the temperature rises, when performing particular microfabrication plank in the time of processing the start and end processing temperature of the workpiece 6 is greatly differs. 厚板加工においては被加工物の温度により最適な加工条件も異なるため、加工開始時と加工終了時とでは加工面の状態に大きな差が生じるという問題があった。 For the planks processing that differs optimal processing conditions the temperature of the workpiece, at the time of processing at the start and end processing has a problem that a large difference in the state of the processing surface occurs.

【0005】図4(a),(b)は従来のレーザ加工装置により厚板の微細形状加工を行った場合の加工面の仕上がり状態の一例を示したものであり、図4(a)は加工開始時、図4(b)は加工終了時の加工面である。 [0005] FIG. 4 (a), (b), is shown an example of a finished state of the processing surface in the case of performing fine shape working of thick plate by a conventional laser processing apparatus, FIG. 4 (a) at the machining start, FIG. 4 (b) is a processed surface at the processing end. 加工開始時は被加工物6の温度が低いため、レーザ光2、アシストガス7、および被加工物6の間の酸化反応が抑制され、 Machining start because the temperature of the workpiece 6 is low, the laser beam 2, the oxidation reaction between the assist gas 7, and the workpiece 6 is suppressed,
条痕14は細かくなり、加工面上部の面精度は向上するが、加工面下部にドロス15が付着し、加工面全体としての品質は低下する。 Striations 14 finer, but the surface accuracy of the machined surface top is improved, dross 15 is adhered to the working surface lower, the overall quality of the processed surface is reduced. 一方、加工終了時は被加工物6の温度が高いため、レーザ光2、アシストガス7、および被加工物6の間の酸化反応は過剰に進行し、条痕14は粗くなり面精度が低下する。 On the other hand, at the processing end of the temperature of the workpiece 6 is high, the oxidation reaction between the laser beam 2, the assist gas 7, and the workpiece 6 is excessively proceeded, striations 14 decreases rough becomes surface accuracy to.

【0006】本発明は、かかる問題点を解決するためになされたもので、加工中に被加工物の温度を検出し、被加工物の温度に応じて加工条件を制御することにより安定したレーザ加工を行うことができるレーザ加工装置を提供することを目的とする。 [0006] The present invention has been made to solve the above problems, it detects the temperature of the workpiece during machining, stable laser by controlling the processing conditions according to the temperature of the workpiece performing the processing and to provide a laser machining apparatus capable.

【0007】 [0007]

【課題を解決するための手段】上記目的を達成するために、本発明のレーザ加工装置は、被加工物の温度を検出する温度センサと、前記温度センサからの温度検出信号に基づいて、レーザ出力、アシストガス圧および加工ヘッドと被加工物積載テーブルの移動速度をそれぞれ制御する数値制御装置とを備えたことを特徴とするものである。 To achieve the above object, according to the Invention The laser processing apparatus of the present invention, a temperature sensor for detecting the temperature of the workpiece, based on the temperature detection signal from the temperature sensor, a laser output, is characterized in that a numerical controller for controlling the assist gas pressure and the processing head and the moving speed of the workpiece loading table respectively.

【0008】上記構成によれば、加工中に、温度センサにより被加工物の温度を検出し、その検出温度に応じてレーザ出力、アシストガス圧、加工ヘッドとテーブルの移動速度を最適な値に制御するので、被加工物の温度に影響されず安定したレーザ加工を行うことができる。 With the above arrangement, during processing, to detect the temperature of the workpiece by the temperature sensor, a laser output according to the detected temperature, the assist gas pressure, the optimum value the moving speed of the processing head and the table since the control, it is possible to perform stable laser machining was not affected by the temperature of the workpiece.

【0009】また、温度センサとしては、熱電対あるいはサーミスタが使用でき、その温度センサと被加工物とが接触若しくは近接することで温度の検出を行うことができる。 [0011] The temperature sensor, a thermocouple or thermistor can be used, it is possible to detect the temperature by the temperature sensor and the workpiece are in contact or close.

【0010】さらに、倣い機能と、倣い機能実行時に被加工物と接触する倣いセンサを備え、その倣いセンサに温度センサを設置した構成とする。 Furthermore, the copying function, comprising a scanning sensor in contact with the workpiece during the scanning function execution, a configuration in which was installed a temperature sensor on the scanning sensor.

【0011】 [0011]

【発明の実施の形態】以下、本発明の実施の形態について、図面を参照しながら詳細に説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 図1は、本発明の一実施形態におけるレーザ加工装置の構成を示したものである。 Figure 1 is a diagram showing the configuration of a laser machining apparatus in an embodiment of the present invention. 図1において、図3中の構成要素と同一のものには同一符号を付している。 1 are denoted by the same reference numerals that are the same as those in FIG. 即ち、1はレーザ発振器で、レーザ光2を出力する。 That is, 1 is a laser oscillator outputs a laser beam 2. 3は反射鏡であり、レーザ光2の光路を変更する。 3 is a reflective mirror to change the optical path of the laser beam 2. 4は加工ヘッドで、レンズ5 4 is a processing head, a lens 5
を備え、レンズ5はレーザ光2を集光してテーブル8上に積載した被加工物6に焦点を結ばせる。 The provided, the lens 5 which focuses the workpiece 6 stacked on a table 8 condenses the laser beam 2. 7は加工ヘッド4に導入するアシストガスである。 7 is a assist gas introduced into the processing head 4. 9は数値制御装置で、レーザ発振器1を駆動する電源装置10、アシストガス7の圧力を制御するアシストガスコントローラ11、加工ヘッド4およびテーブル8を駆動制御するサーボコントローラ12をそれぞれ制御する。 9 is a numerical controller, for controlling power supply 10 for driving the laser oscillator 1, the assist gas controller 11 for controlling the pressure of the assist gas 7, the machining head 4 and the servo controller 12 for driving and controlling the table 8, respectively. また、13は被加工物と接触するかあるいは近接するように配設された温度センサである。 Further, 13 is a temperature sensor disposed to or close contact with the workpiece. 温度センサ13としては、熱電対あるいはサーミスタを使用することができる。 The temperature sensor 13 may be a thermocouple or thermistor.

【0012】数値制御装置9には、被加工物の温度に応じた最適なレーザ出力、アシストガス圧、加工ヘッドとテーブルの移動速度などの値が予め入力されている。 [0012] The numerical control device 9, the optimum laser power in accordance with the temperature of the workpiece, the assist gas pressure, the value of the moving speed of the processing head and the table are entered in advance. 温度センサ13により被加工物6の温度を検出し、検出信号は数値制御装置9に取り込まれ、その値に応じて電源装置10によりレーザ出力を、アシストガスコントローラ11 The temperature sensor 13 detects the temperature of the workpiece 6, the detection signal is taken into the numerical controller 9, the laser output by the power supply device 10 according to the value, the assist gas controller 11
によりアシストガス圧を、サーボコントローラ12により加工ヘッド4とテーブル8の移動速度をそれぞれ制御する。 The assist gas pressure, respectively control the moving speed of the processing head 4 and the table 8 by a servo controller 12.

【0013】図2(a),(b)は、本発明によるレーザ加工装置で厚板の微細形状加工を行った場合の加工面仕上がりの一例を示したものであり、図2(a)は加工開始時、 [0013] FIG. 2 (a), (b) is an illustration of an example of the processing surface finish in the case of performing fine shape processing planks in the laser processing apparatus according to the present invention, FIG. 2 (a) during the machining start,
図2(b)は加工終了時の加工面である。 Figure 2 (b) is a processed surface at the processing end. いずれも細かい条痕14の高品質な加工面が得られている。 Both high-quality machined surface of the fine striations 14 is obtained.

【0014】なお、レーザ加工装置に倣い機能を持たせ、倣い機能実行時に被加工物と接触する倣いセンサを設けて、その倣いセンサに温度センサを設置するようにしてもよい。 [0014] Incidentally, to have the copying function to the laser machining apparatus, provided with a scanning sensor in contact with the workpiece during the scanning function execution, it may be installed a temperature sensor on the scanning sensor.

【0015】 [0015]

【発明の効果】以上のように、加工中に被加工物の温度を温度センサにより検出し、その値に応じてレーザ出力、アシストガス圧、加工ヘッドとテーブルの移動速度を最適な値に制御することにより、特に厚板加工の微細形状加工において、被加工物の温度に影響されず安定した高品質なレーザ加工を行うことができる効果がある。 As is evident from the foregoing description, the temperature of the workpiece detected by the temperature sensor during machining, laser output according to the value, the assist gas pressure, controlled to an optimum value the moving speed of the processing head and the table by, in particular in the fine shaping of the plank processing, there is an effect that it is possible to perform stable and high-quality laser processing without being affected by the temperature of the workpiece.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施の形態におけるレーザ加工装置の構成図である。 1 is a configuration diagram of a laser processing apparatus according to an embodiment of the present invention.

【図2】本発明の実施の形態における加工面仕上がりの一例を示す図である。 It is a diagram illustrating an example of the processing surface finish in the embodiment of the present invention; FIG.

【図3】従来例におけるレーザ加工装置の構成図である。 3 is a configuration diagram of a laser processing apparatus in a conventional example.

【図4】従来例における加工面仕上がりの一例を示す図である。 4 is a diagram showing an example of the processing surface finishing in a conventional example.

【符号の説明】 DESCRIPTION OF SYMBOLS

1…レーザ発振器、 2…レーザ光、 3…反射鏡、 1 ... laser oscillator, 2 ... laser light, 3 ... reflector,
4…加工ヘッド、 5…レンズ、 6…被加工物、 7 4 ... machining head, 5 ... lens, 6 ... workpiece, 7
…アシストガス、 8…テーブル、 9…数値制御装置、 10…電源装置、 11…アシストガスコントローラ、 12…サーボコントローラ、 13…温度センサ。 ... assist gas, 8 ... table, 9 ... numerical controller, 10 ... power unit, 11 ... assist gas controller, 12 ... servo controller, 13 ... temperature sensor.

Claims (3)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 被加工物の温度を検出する温度センサと、前記温度センサからの温度検出信号に基づいて、レーザ出力、アシストガス圧および加工ヘッドと被加工物積載テーブルの移動速度をそれぞれ制御する数値制御装置とを備えていることを特徴とするレーザ加工装置。 A temperature sensor for detecting a temperature according to claim 1] workpiece, based on the temperature detection signal from the temperature sensor, control the laser output, the assist gas pressure and the processing head and the moving speed of the workpiece loading table respectively laser processing apparatus characterized by and a numerical controller for.
  2. 【請求項2】 温度センサとして、熱電対またはサーミスタを使用し、前記温度センサと被加工物とが接触または近接することで温度の検出を行うことを特徴とする請求項1記載のレーザ加工装置。 As wherein the temperature sensor, using a thermocouple or a thermistor, a laser machining apparatus according to claim 1, characterized in that the detection of temperature by said temperature sensor and the workpiece are in contact with or close .
  3. 【請求項3】 倣い機能と、倣い機能実行時に被加工物と接触する倣いセンサを備えており、前記倣いセンサに温度センサを設置したことを特徴とする請求項1記載のレーザ加工装置。 3. A copying function, provided with a scanning sensor in contact with the workpiece during the scanning function execution, a laser machining apparatus according to claim 1, characterized in that the temperature sensor installed in the copying sensor.
JP9210674A 1997-08-05 1997-08-05 Laser beam processing device Pending JPH1147964A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9210674A JPH1147964A (en) 1997-08-05 1997-08-05 Laser beam processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9210674A JPH1147964A (en) 1997-08-05 1997-08-05 Laser beam processing device

Publications (1)

Publication Number Publication Date
JPH1147964A true JPH1147964A (en) 1999-02-23

Family

ID=16593241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9210674A Pending JPH1147964A (en) 1997-08-05 1997-08-05 Laser beam processing device

Country Status (1)

Country Link
JP (1) JPH1147964A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423360B (en) * 2006-06-05 2014-01-11 Gsi Group Corp Method and system for adaptively controlling a laser-based material processing process and method and system for qualifying same
US9919383B2 (en) 2014-10-17 2018-03-20 Mitsubishi Electric Corporation Laser machining method and laser machining apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423360B (en) * 2006-06-05 2014-01-11 Gsi Group Corp Method and system for adaptively controlling a laser-based material processing process and method and system for qualifying same
US9919383B2 (en) 2014-10-17 2018-03-20 Mitsubishi Electric Corporation Laser machining method and laser machining apparatus

Similar Documents

Publication Publication Date Title
CN1078510C (en) Laser working method and device
US6729526B2 (en) Friction stir welding apparatus and method and processing apparatus and method
US5373135A (en) Process and an arrangement for treating workpiece by means of laser radiation
US6392192B1 (en) Real time control of laser beam characteristics in a laser-equipped machine tool
EP0929376B2 (en) A method of processing a material by means of a laser beam
RU2155654C2 (en) Method and apparatus for monitoring position of beam for working blanks
JP3315556B2 (en) The laser processing apparatus
JP4814792B2 (en) Composite thermal cutting device and combined thermal cutting method
TW262419B (en) Laser processing machine
JP2650138B2 (en) It means for improving the laser processing efficiency of metal
US6870130B2 (en) Laser machining method and apparatus therefor
KR970010888B1 (en) Laser machining apparatus
JP2000117467A (en) Device for controlling welding parameter in laser beam welding
JPH0328704A (en) Method and system for controlling quality of beads
JP2603873B2 (en) Les - The machine and record - The processing method
US5560843A (en) Frame construction and a machining device provided with it
EP0358771B1 (en) Power control system for cnc laser-beam machine tool
US5061839A (en) Laser beam machining apparatus
US5607606A (en) Laser beam machine for performing piercing and cutting via focus change
US5196672A (en) Laser processing arrangement
JP2008546540A (en) Using a laser spot diameter of 50~200010-3Mm, article, in particular a method and apparatus for laser treatment of catamenial and its components
US6215094B1 (en) Process for determining the instantaneous penetration depth and a machining laser beam into a workpiece, and device for implementing this process
US5138490A (en) Arrangement for changing the geometrical form of a light beam
JPS63229888A (en) Laser wavelength controlling device
KR940024711A (en) Focusing servo system and a focus on how to capture