JPH11337968A - Liquid crystal display device - Google Patents

Liquid crystal display device

Info

Publication number
JPH11337968A
JPH11337968A JP11363399A JP11363399A JPH11337968A JP H11337968 A JPH11337968 A JP H11337968A JP 11363399 A JP11363399 A JP 11363399A JP 11363399 A JP11363399 A JP 11363399A JP H11337968 A JPH11337968 A JP H11337968A
Authority
JP
Japan
Prior art keywords
liquid crystal
driver circuit
wiring layer
insulating film
interlayer insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11363399A
Other languages
Japanese (ja)
Inventor
Hideyuki Akanuma
英幸 赤沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP11363399A priority Critical patent/JPH11337968A/en
Publication of JPH11337968A publication Critical patent/JPH11337968A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain a liquid crystal display device with a driver circuit in one body having a small size, a large aperture ratio and high reliability by forming signal lines and pixel electrodes as separated layers by using a polyimide as an interlayer insulating film. SOLUTION: A pixel driving transistor 209, pixel electrode 210, scanning lines included in a first wiring layer 211 with the pixel driving transistor 209 and a gate electrode of a driver circuit 203, and signal lines included in a second wiring layer 212 are formed in a display region 202. The first wiring layer 211 and the second wiring layer 212 are insulated from each other by a first interlayer insulating film 213, and the second wiring layer 212 and the pixel electrode 210 are insulated by a second interlayer insulating film 214. The second interlayer insulating film 214 is removed in the area on the driver circuit 203 and the area under the seal 206. Therefore, the aperture rate can be increased. Since a polyimide can be formed by a spin coating method, the surface of the element substrate can be formed flat, which prevents disturbance in the alignment of a liquid crystal. Thus, a display of high quality can be obtd.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は2枚の基板間に封入
された液晶を用いて表示を行う、ドライバー回路一体形
成のアクティブマトリクス型液晶表示装置の構造に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an active matrix type liquid crystal display device in which a driver circuit is integrally formed, in which display is performed using liquid crystal sealed between two substrates.

【0002】[0002]

【従来の技術】従来のドライバー回路内蔵アクティブマ
トリクス型液晶表示装置(以下、単に液晶表示装置とす
る)の一例を図1を用いて説明する。図1(a)は従来
の液晶表示装置の概略の外観図であり、図1(b)は図
1(a)のA−Aにおける縦断面図、図1(c)は図1
(a)のB−B縦断面図である。素子基板101上には
表示領域102、走査線及び信号線のドライバー回路1
03及び104、外部接続端子105が形成され、対向
基板106がシール107で素子基板101に接合さ
れ、素子基板101と対向基板106の間に液晶108
が封入されている。
2. Description of the Related Art An example of a conventional active matrix type liquid crystal display device with a built-in driver circuit (hereinafter simply referred to as a liquid crystal display device) will be described with reference to FIG. FIG. 1A is a schematic external view of a conventional liquid crystal display device, FIG. 1B is a longitudinal sectional view taken along line AA of FIG. 1A, and FIG.
It is a BB longitudinal sectional view of (a). A driver circuit 1 for a display area 102, scanning lines and signal lines is provided on an element substrate 101.
03 and 104, and external connection terminals 105 are formed, the opposing substrate 106 is bonded to the element substrate 101 with a seal 107, and a liquid crystal 108 is interposed between the element substrate 101 and the opposing substrate 106.
Is enclosed.

【0003】対向基板106上には共通電極109が設
けられ、この共通電極109は素子基板101上のコモ
ン端子110に導通剤111で接続されている。また、
対向基板106上には遮光層112が設けられている。
素子基板101の表示領域102には、画素駆動トラン
ジスタ113が設けられ、画素電極114が画素駆動ト
ランジスタ113に接続されている。画素駆動トランジ
スタ113及びドライバー回路103(104)のゲー
ト電極と走査線を含む第1の配線層115は層間絶縁膜
116で第2の配線層117と隔てられ、必要な箇所で
第2の配線層117と接続されている。第2の配線層1
17は表示領域の信号線を含み、画素電極114と同層
に設けられている。第2の配線層117の上層は液晶保
護絶縁膜118で第2の配線層117の信号が液晶に直
接漏れるのを防ぐために設けられる。液晶保護絶縁膜1
18は画素電極114上は通常取り除いておく。素子基
板101上と対向基板106上には更に配向膜119が
ある。
[0005] A common electrode 109 is provided on the counter substrate 106, and the common electrode 109 is connected to a common terminal 110 on the element substrate 101 by a conductive agent 111. Also,
A light-blocking layer 112 is provided on the counter substrate 106.
A pixel driving transistor 113 is provided in the display region 102 of the element substrate 101, and a pixel electrode 114 is connected to the pixel driving transistor 113. The first wiring layer 115 including the pixel driving transistor 113, the gate electrode of the driver circuit 103 (104), and the scanning line is separated from the second wiring layer 117 by an interlayer insulating film 116, and the second wiring layer 117 is provided at a necessary place. 117 is connected. Second wiring layer 1
Reference numeral 17 includes a signal line in the display area, and is provided in the same layer as the pixel electrode 114. The upper layer of the second wiring layer 117 is provided with a liquid crystal protective insulating film 118 in order to prevent the signal of the second wiring layer 117 from leaking directly to the liquid crystal. LCD protective insulation film 1
Reference numeral 18 is usually removed from the pixel electrode 114. An alignment film 119 is further provided on the element substrate 101 and the counter substrate 106.

【0004】図1の液晶表示装置では画素電極114と
信号線(第2の配線層117)が同層にあり、短絡を避
けるため有る程度の間隔を確保する必要があり、その間
隔の部分は表示に寄与しない。これは液晶表示装置の高
開口率化や高精細化の妨げとなる。この問題を解決する
ため、信号線上に更に層間絶縁膜を設け、この上層に画
素電極を設ける事で画素電極と信号線を絶縁し、画素電
極と信号線の距離を小さくする、あるいは信号線と画素
電極を重ねるといった方法がとられる場合がある。上記
の信号線上の層間絶縁膜はSiO2あるいはポリイミド
等の有機薄膜が用いられる。信号線上の層間絶縁膜は、
その形成方法の簡便さ、誘電率の小ささ(信号線と画素
電極の結合容量を小さくするため)、ストレスが小さい
事による厚膜化の容易さ(誘電率と同じ理由による)、
さらには膜表面の平坦性をSiO2よりも良くしやすい
ので表示品質が良い等の観点からポリイミドを用いるの
が有利である。
In the liquid crystal display device shown in FIG. 1, the pixel electrode 114 and the signal line (second wiring layer 117) are in the same layer, and it is necessary to secure a certain gap to avoid a short circuit. Does not contribute to display. This hinders an increase in the aperture ratio and definition of the liquid crystal display device. In order to solve this problem, an interlayer insulating film is further provided on the signal line, and a pixel electrode is provided thereon to insulate the pixel electrode and the signal line, thereby reducing a distance between the pixel electrode and the signal line, or In some cases, a method such as overlapping pixel electrodes is used. As the interlayer insulating film on the signal line, an organic thin film such as SiO2 or polyimide is used. The interlayer insulating film on the signal line
The simplicity of the formation method, the small dielectric constant (to reduce the coupling capacitance between the signal line and the pixel electrode), the ease of thickening due to small stress (for the same reason as the dielectric constant),
Furthermore, since the flatness of the film surface is easily improved as compared with SiO2, it is advantageous to use polyimide from the viewpoint of good display quality.

【0005】[0005]

【発明が解決しようとする課題】図1のような従来の液
晶表示装置では、ドライバー回路がシールよりも外側に
あるため装置自体が大きくなってしまい、また、素子基
板と対向基板の接合後の製造途上における取扱い中にド
ライバー回路を傷つけ易く故障を招き易いという問題が
あった。また、ドライバー回路がシールよりも外側にあ
るため、シールを横切る配線(信号線と走査線)が多
く、ドライバー回路から表示領域につながる配線とシー
ルの界面を通じて水分が液晶中に浸入し、液晶を劣化さ
せるという問題があった。
In the conventional liquid crystal display device as shown in FIG. 1, the driver itself is located outside the seal, so that the device itself becomes large. There has been a problem that the driver circuit is easily damaged during handling in the course of manufacturing and a failure is easily caused. In addition, since the driver circuit is outside the seal, there are many wires (signal lines and scanning lines) that cross the seal, and moisture penetrates into the liquid crystal through the interface between the driver circuit and the wire that connects to the display area and the seal. There was a problem of deterioration.

【0006】[0006]

【課題を解決するための手段】本発明の液晶表示装置
は、素子基板上に形成された素子駆動薄膜トランジス
タ、信号線及び走査線を有機膜で覆い、前記有機膜上に
画素電極を設ける事で信号線と画素電極を絶縁し、ドラ
イバー回路を素子基板と対向基板を接合するシールより
画素電極側に形成し、ドライバー回路上には有機膜を設
けず、かつドライバー回路に対向する部分の対向基板上
の共通電極が無いことを特徴とする。
According to the liquid crystal display device of the present invention, an element driving thin film transistor, a signal line and a scanning line formed on an element substrate are covered with an organic film, and a pixel electrode is provided on the organic film. The signal line and the pixel electrode are insulated, and the driver circuit is formed on the pixel electrode side from the seal that joins the element substrate and the counter substrate. The organic circuit is not provided on the driver circuit, and the opposing substrate faces the driver circuit. It is characterized in that there is no upper common electrode.

【0007】[0007]

【実施例】以下に、本発明のドライバー回路内蔵アクテ
ィブマトリクス型液晶表示装置とその製造工程について
実施例に基づき詳しく説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an active matrix type liquid crystal display device with a built-in driver circuit according to the present invention and a manufacturing process thereof will be described in detail based on embodiments.

【0008】図2に本実施例の液晶表示装置の構造を示
す。図2(a)は本実施例の液晶表示装置の平面図であ
り、図2(b)、図2(c)はそれぞれ図2(a)のA
−A、B−Bにおける縦断面図である。透明な素子基板
201上には表示領域202、ドライバー回路203、
外部接続端子204、コモン端子205およびこれらを
接続する配線等が形成されており、シール206によっ
て素子基板201と対向基板207が接合され、両基板
間に液晶208が封入されている。ドライバー回路20
3はシール206と表示領域202の間に設けてある。
こうすることでドライバー回路203が表示領域202
より外側にある場合に比べ液晶表示装置を小型にでき
る。表示領域202には画素駆動トランジスタ209、
画素電極210、画素駆動トランジスタ209及びドラ
イバー回路203のゲート電極と共に第1の配線層21
1に含まれる走査線、第2の配線層212に含まれる信
号線が形成され、第1の配線層211と第2の配線層2
12は第1の層間絶縁膜213で、また、第2の配線層
212と画素電極210は第2の層間絶縁膜214で絶
縁されている。第2の層間絶縁膜214は、ドライバー
回路203上とシール206の下の部分を取り除いてお
く。これは、主にポリイミドが用いられる第2の層間絶
縁膜214がドライバー回路203の配線の電界によっ
て恒常的な分極を起こし、長期的には大きな面積に及ん
で液晶の配向を乱すことによる表示品質の劣化を防ぐこ
とが目的であると共に、ポリイミドを通じて水分や不純
物が液晶中に浸入するのをふせぐ。素子基板201上に
は、さらに液晶を配向するための配向膜215が形成さ
れている。コモン端子205と対向基板207上の共通
電極216は導通剤217で電気的に接続され共通電極
216の電位が制御される。対向基板207上には共通
電極216の他に配向膜215と必要に応じて遮光膜2
18及びカラーフィルターが予め形成されている。(本
実施例ではカラーフィルターは省略してある。)対向基
板207上の共通電極216は、シール206と重なる
部分とドライバー回路203に対向する部分を取り除い
ておく。こうすることで素子基板201上のコモン端子
205以外の配線と共通電極216が、シール206中
やドライバー回路203上のごみ等により短絡すること
を防ぐ。
FIG. 2 shows the structure of the liquid crystal display device of this embodiment. FIG. 2A is a plan view of the liquid crystal display device of the present embodiment, and FIGS. 2B and 2C respectively show A in FIG. 2A.
It is a longitudinal section in -A and BB. On a transparent element substrate 201, a display area 202, a driver circuit 203,
An external connection terminal 204, a common terminal 205, wiring for connecting these, and the like are formed. A seal 206 joins the element substrate 201 and the counter substrate 207, and a liquid crystal 208 is sealed between the two substrates. Driver circuit 20
3 is provided between the seal 206 and the display area 202.
By doing so, the driver circuit 203 is moved to the display area 202.
The size of the liquid crystal display device can be reduced as compared with the case where it is located further outside. The display area 202 includes a pixel driving transistor 209,
The first wiring layer 21 together with the pixel electrode 210, the pixel driving transistor 209, and the gate electrode of the driver circuit 203
1 and the signal lines included in the second wiring layer 212 are formed, and the first wiring layer 211 and the second wiring layer 2 are formed.
Reference numeral 12 denotes a first interlayer insulating film 213, and the second wiring layer 212 and the pixel electrode 210 are insulated by a second interlayer insulating film 214. The portion of the second interlayer insulating film 214 above the driver circuit 203 and below the seal 206 is removed. This is because the second interlayer insulating film 214 mainly made of polyimide causes permanent polarization due to the electric field of the wiring of the driver circuit 203 and disturbs the orientation of the liquid crystal over a large area in the long term. The purpose is to prevent the deterioration of the liquid crystal and to prevent moisture and impurities from entering the liquid crystal through the polyimide. On the element substrate 201, an alignment film 215 for further aligning the liquid crystal is formed. The common terminal 205 and the common electrode 216 on the counter substrate 207 are electrically connected by a conductive agent 217, and the potential of the common electrode 216 is controlled. On the counter substrate 207, in addition to the common electrode 216, an alignment film 215 and a light-shielding film 2 if necessary.
18 and a color filter are formed in advance. (The color filter is omitted in this embodiment.) The portion of the common electrode 216 on the counter substrate 207 that overlaps the seal 206 and the portion that faces the driver circuit 203 are removed. This prevents the wiring other than the common terminal 205 on the element substrate 201 and the common electrode 216 from being short-circuited due to dust or the like in the seal 206 or the driver circuit 203.

【0009】次に、本実施例の液晶表示装置の製造工程
を図3を用いて説明する。図3は本実施例の液晶表示装
置の構造を説明した図2(b)に相当する部分の縦断面
で製造工程を説明する図である。
Next, a manufacturing process of the liquid crystal display device of the present embodiment will be described with reference to FIG. FIG. 3 is a view for explaining a manufacturing process in a longitudinal section of a portion corresponding to FIG. 2B illustrating the structure of the liquid crystal display device of the present embodiment.

【0010】まず、素子基板301上に画素駆動トラン
ジスタ302、ドライバー回路303を形成する。走査
線及び画素駆動トランジスタ302とドライバー回路3
03のゲート電極を含む第1の配線層304、第1の層
間絶縁膜305、信号線を含む第2の配線層306をこ
の時形成する(図3(a))。本実施例では画素トラン
ジスタ302とドライバー回路303は多結晶シリコン
薄膜トランジスタで構成される。第1の配線層304に
は多結晶シリコンを用いるが、金属シリサイドあるいは
金属を用いても良く、第1の層間絶縁膜305はシリコ
ン酸化膜(SiO2)かシリコン窒化膜(Si34)、
あるいはそれらの多層膜である。第2の配線層306に
は通常アルミニウム(Al)合金(銅とシリコンを含
む)を用いる。
First, a pixel driving transistor 302 and a driver circuit 303 are formed on an element substrate 301. Scan line and pixel drive transistor 302 and driver circuit 3
At this time, a first wiring layer 304 including a gate electrode 03, a first interlayer insulating film 305, and a second wiring layer 306 including a signal line are formed at this time (FIG. 3A). In this embodiment, the pixel transistor 302 and the driver circuit 303 are composed of polycrystalline silicon thin film transistors. Although polycrystalline silicon is used for the first wiring layer 304, metal silicide or metal may be used, and the first interlayer insulating film 305 is made of a silicon oxide film (SiO 2 ) or a silicon nitride film (Si 3 N 4 ). ,
Or a multilayer film thereof. Normally, an aluminum (Al) alloy (including copper and silicon) is used for the second wiring layer 306.

【0011】次に、素子基板301上に第2の層間絶縁
膜307を形成し、その上に画素電極308を形成し、
画素駆動トランジスタ302に第2の層間絶縁膜307
に開けたコンタクト孔を通じて接続する。さらに配向膜
309を形成する(図3(b))。図3(b)の工程を
より詳しく説明すると、本実施例では第2の層間絶縁膜
307(ここではポリイミドである)をスピンコートで
塗布成膜した後、画素電極308と画素トランジスタ3
02とを接続するコンタクト孔をフォトリソグラフ法で
形成するが、この時第2の配線層306が露出しない様
にする。即ちドライバー回路303の上やシールの下に
なる部分にはこの時点ではまだ第2の層間絶縁膜307
が残っている。次に画素電極308を形成し、その後ド
ライバー回路303の上とシールの下になる部分の第2
の層間絶縁膜307を取り除く。
Next, a second interlayer insulating film 307 is formed on the element substrate 301, and a pixel electrode 308 is formed thereon.
A second interlayer insulating film 307 for the pixel driving transistor 302
Connect through the contact hole opened in the above. Further, an alignment film 309 is formed (FIG. 3B). The process of FIG. 3B will be described in more detail. In the present embodiment, after the second interlayer insulating film 307 (here, polyimide) is formed by spin coating, the pixel electrode 308 and the pixel transistor 3 are formed.
02 is formed by photolithography, but the second wiring layer 306 is not exposed at this time. In other words, at this point, the second interlayer insulating film 307 is still over the driver circuit 303 and under the seal.
Remains. Next, a pixel electrode 308 is formed, and then a second portion of the portion below the driver circuit 303 and below the seal is formed.
The interlayer insulating film 307 is removed.

【0012】これは画素電極308に酸化インジウムス
ズ(ITO)を用い、そのエッチング成形に王水系のエ
ッチング剤(硝酸と塩酸を含む水溶液)を用いる場合、
第2の配線層306即ちAlが露出しているとITOの
エッチング剤にAlが侵されるためである。ITO(即
ち画素電極308)を例えば水素やメタンを含むプラズ
マ中でエッチング成形する場合には第2の配線層306
は露出していてもかまわないので、第2の層間絶縁膜3
07成形工程を1回にすることもできる。第2の層間絶
縁膜307はここではポリイミド薄膜であるが、他の樹
脂薄膜でも比較的耐熱性が高く、透明であれば用いる事
が出来る。また、第2の層間絶縁膜307はポリイミド
とSiO2あるいはSi34との多層膜でも良い。この
場合にはドライバー回路303上及びシール下となる第
2の層間絶縁膜307のうち必ず取り除く必要のあるの
はポリイミドで他は残しても取り去っても良い。また配
向膜309もポリイミド薄膜であり、形成は印刷技術
(フレキソ印刷等)を用いて行い、液晶を配向するため
に必要な部分にのみ形成する。配向膜309の形成はス
ピンコート法で行うこともある。
This is because when indium tin oxide (ITO) is used for the pixel electrode 308 and an aqua regia-based etchant (aqueous solution containing nitric acid and hydrochloric acid) is used for the etching,
This is because when the second wiring layer 306, that is, Al is exposed, Al is attacked by the etching agent of ITO. When the ITO (that is, the pixel electrode 308) is formed by etching in a plasma containing, for example, hydrogen or methane, the second wiring layer 306 is formed.
May be exposed, so that the second interlayer insulating film 3
The 07 molding step can be performed once. The second interlayer insulating film 307 is a polyimide thin film here, but other resin thin films can be used as long as they have relatively high heat resistance and are transparent. Further, the second interlayer insulating film 307 may be a multilayer film of polyimide and SiO 2 or Si 3 N 4 . In this case, the polyimide must be removed from the second interlayer insulating film 307 on the driver circuit 303 and under the seal, and polyimide may be left or removed. The alignment film 309 is also a polyimide thin film, and is formed using a printing technique (flexographic printing or the like), and is formed only on a portion necessary for aligning the liquid crystal. The formation of the alignment film 309 may be performed by a spin coating method.

【0013】配向膜309を形成した素子基板301は
シール310で対向基板311と接合し、液晶312を
封入する(図3(c))。さらに外部回路を外部接続端
子に接続して液晶表示装置を完成する。
The element substrate 301 on which the alignment film 309 is formed is bonded to the counter substrate 311 by a seal 310, and the liquid crystal 312 is sealed (FIG. 3C). Further, an external circuit is connected to an external connection terminal to complete a liquid crystal display device.

【0014】[0014]

【発明の効果】本発明の液晶表示装置では、信号線と画
素電極がポリイミドを層間絶縁膜として別層に形成され
ることで開口率を大きくすることが可能な上に、ポリイ
ミドはスピンコート法で形成されるので、素子基板表面
が平坦なため液晶の配向の乱れが無く高品質な表示が得
られる。さらに素子基板上のドライバー回路がシールよ
り表示領域側にあるためドライバー回路から画素領域に
延びる延べ数百本に及ぶ信号線や走査線がシールを横切
ることがなく、シールを横切る配線を外部接続端子から
ドライバー回路につながる電源線、クロック線、ビデオ
信号線など高々数十本と従来比べ格段に少なくできるの
で、シールを横切る配線とシール界面から浸入する水分
を格段に少なくでき、信頼性が高い。また、ドライバー
回路がシールの内側にあるのでドライバー回路がシール
の外にある場合に比べて装置を小型にできる効果があ
り、また素子基板と対向基板を接合した後の取扱い(例
えばダイシング工程)でドライバー回路を傷つけるよう
なこともない。
In the liquid crystal display device of the present invention, the aperture ratio can be increased by forming the signal line and the pixel electrode in separate layers using polyimide as an interlayer insulating film, and the polyimide is formed by a spin coating method. Since the surface of the element substrate is flat, there is no disturbance in the alignment of the liquid crystal, and a high-quality display can be obtained. Furthermore, since the driver circuit on the element substrate is closer to the display area than the seal, hundreds of signal lines and scanning lines extending from the driver circuit to the pixel area do not cross the seal, and the wiring that crosses the seal from the external connection terminal The power supply line, clock line, video signal line, etc. connected to the driver circuit can be reduced to at most several tens of lines, which is much lower than before, so that the amount of water entering from the wiring that crosses the seal and the seal interface can be significantly reduced, and the reliability is high. In addition, since the driver circuit is inside the seal, the device can be made smaller than when the driver circuit is outside the seal. In addition, in the handling after the element substrate and the opposing substrate are joined (for example, in a dicing process). There is no damage to the driver circuit.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来のドライバー回路内蔵のアクティブマトリ
クス型液晶表示装置の構造図。
FIG. 1 is a structural diagram of a conventional active matrix type liquid crystal display device with a built-in driver circuit.

【図2】本発明のドライバー回路内蔵のアクティブマト
リクス型液晶表示装置の構造図。
FIG. 2 is a structural diagram of an active matrix liquid crystal display device having a driver circuit according to the present invention.

【図3】本発明のドライバー回路内蔵のアクティブマト
リクス型液晶表示装置の製造方法を説明する工程図。
FIG. 3 is a process chart illustrating a method for manufacturing an active matrix liquid crystal display device with a built-in driver circuit according to the present invention.

【符号の説明】 101、201、301 …素子基板 102、202 …表示領域 103、104、203、303…ドライバー回路 105、204 …外部接続端子 106、207、311 …対向基板 107、206、310 …シール 108、208、312 …液晶 109、216 …共通電極 110、205 …コモン端子 111、217 …導通剤 112、218 …遮光層 113、209、302 …画素駆動トランジス
タ 114、210、308 …画素電極 115、211、304 …第1の配線層 116 …層間絶縁膜 117、212、306 …第2の配線層 118 …液晶保護絶縁膜 119、215、309 …配向膜 213、305 …第1の層間絶縁膜 214、307 …第2の層間絶縁膜
[Description of References] 101, 201, 301 ... Element substrates 102, 202 ... Display areas 103, 104, 203, 303 ... Driver circuits 105, 204 ... External connection terminals 106, 207, 311 ... Counter substrates 107, 206, 310 ... Seals 108, 208, 312 Liquid crystal 109, 216 Common electrode 110, 205 Common terminal 111, 217 Conductive agent 112, 218 Light-shielding layer 113, 209, 302 Pixel drive transistor 114, 210, 308 Pixel electrode 115 , 211, 304 ... first wiring layer 116 ... interlayer insulating film 117, 212, 306 ... second wiring layer 118 ... liquid crystal protective insulating film 119, 215, 309 ... alignment film 213, 305 ... first interlayer insulating film 214, 307... Second interlayer insulating film

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】少なくともマトリクス状に配置された画素
電極、前記画素電極のそれぞれに接続された画素駆動薄
膜トランジスタ、前記画素駆動薄膜トランジスタに接続
された一組の信号配線と一組の走査配線、さらに前記信
号配線及び走査配線をそれぞれ駆動するドライバー回路
を有する素子基板と、共通電極を有し前記素子基板に対
向する対向基板と、前記素子基板と前記対向基板の間に
封止した液晶からなるアクティブマトリクス型液晶表示
装置において、前記素子基板上の画素駆動用薄膜トラン
ジスタ上、前記信号配線上及び前記走査配線上に有機膜
があり、前記有機膜上に前記画素電極があり、前記ドラ
イバー回路が前記素子基板と前記対向電極とを接合する
と同時に液晶を封止するシール部より画素電極側にあ
り、前記ドライバー回路上及び前記シール部には前記有
機膜が無く、前記ドライバー回路に対向する部分には前
記対向基板上の前記共通電極が無いことを特徴とする液
晶表示装置。
1. A pixel electrode arranged at least in a matrix, a pixel driving thin film transistor connected to each of said pixel electrodes, a set of signal wiring and a set of scanning wiring connected to said pixel driving thin film transistor, An element substrate having a driver circuit for driving signal lines and scanning lines, an opposing substrate having a common electrode, opposing the element substrate, and an active matrix comprising liquid crystal sealed between the element substrate and the opposing substrate In the liquid crystal display device, an organic film is provided on the pixel driving thin film transistor on the element substrate, on the signal wiring and on the scanning wiring, the pixel electrode is provided on the organic film, and the driver circuit is provided on the element substrate. And the opposing electrode are joined to the pixel electrode side with respect to the sealing portion for sealing the liquid crystal at the same time. The liquid crystal display device which is the road and the sealing portion and the organic film is not, the portion opposed to the driver circuit, characterized in that there is no said common electrode on the counter substrate.
【請求項2】前記有機膜がポリイミド膜である事を特徴
とする請求項1の液晶表示装置。
2. The liquid crystal display device according to claim 1, wherein said organic film is a polyimide film.
JP11363399A 1999-04-21 1999-04-21 Liquid crystal display device Pending JPH11337968A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11363399A JPH11337968A (en) 1999-04-21 1999-04-21 Liquid crystal display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11363399A JPH11337968A (en) 1999-04-21 1999-04-21 Liquid crystal display device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP07986593A Division JP3413239B2 (en) 1993-04-06 1993-04-06 Liquid crystal display

Publications (1)

Publication Number Publication Date
JPH11337968A true JPH11337968A (en) 1999-12-10

Family

ID=14617191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11363399A Pending JPH11337968A (en) 1999-04-21 1999-04-21 Liquid crystal display device

Country Status (1)

Country Link
JP (1) JPH11337968A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013012483A (en) * 2000-04-19 2013-01-17 Semiconductor Energy Lab Co Ltd Light-emitting device and electronic appliance

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013012483A (en) * 2000-04-19 2013-01-17 Semiconductor Energy Lab Co Ltd Light-emitting device and electronic appliance
US9443461B2 (en) 2000-04-19 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Electronic device and method of driving the same

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