JPH11314224A - Uniformly heating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve an unconvenience wherein although it is necessary to change temp. from the initial set temp. to a set temp. of the next process by using only one uniformly heating apparatus, as there exists no cooling function, cooling only depends on natural heat dissipation from the surface to require long time until the temp. reaches a reset temp. SOLUTION: In a uniformly heating apparatus wherein communication paths 4 are formed in a platen 10 on which an article to be molded is placed and a heat source for heating the article to be molded through the platen 10 is provided, one side of a radiator 11 is communicated with the communication paths 4 formed in the platen 10 and another side of the radiator 11 is extended radially to the outside of the platen 10. The platen 10 is cooled by communicating the radiator 11 with the communication paths 4 formed inside of the platen 10 like this.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat equalizing apparatus for equalizing the temperature of a molded product such as a resin molded product, a semiconductor wafer, a liquid crystal panel and the like on a surface plate to be processed.

[0002]

2. Description of the Related Art As a conventional heat equalizer, for example, there is one disclosed in Japanese Patent Application No. 8-263171 filed by the same applicant, and its outline will be described with reference to FIGS. In each of these drawings, reference numeral 1 denotes a first plate-like member having a plurality of annular grooves 2 formed concentrically on a lower surface thereof.
A plurality of objects (not shown) are placed on the upper surface. 3
On the lower surface of the first plate-shaped member 1 so as to cover each annular groove 2,
For example, a second plate-like member joined by brazing or the like,
A platen 10 is formed together with the plate-like member 1 of FIG.
Is formed. Reference numeral 5 denotes a plurality of liquid reservoirs formed so as to protrude downward from the second plate-shaped member 3 and communicating with the flow passages 4 in the surface plate 10. The member 3 is formed by deep drawing or the like. Reference numeral 6 denotes a hydraulic fluid stored in the liquid reservoir 5, and 7 is immersed in one side in the hydraulic liquid in the liquid reservoir 5, and a terminal on the other side penetrates a side wall of the liquid reservoir 5 and protrudes to the outside. The heat source is, for example, a heater or the like.

Next, the operation will be described. In the case where the object to be molded is placed on the surface plate 10 to perform heat molding, the working fluid 6 is directly heated by the heat source 7 immersed in the working fluid 6 stored in the liquid reservoir 5. The heated hydraulic fluid 6 evaporates and evaporates, spreads over the entire surface plate 10 through the flow passage 4, and transmits the latent heat to the surface plate 10 on the wall of the annular groove 2 as the flow passage 4 to heat the molded object. Do. The vapor of the working fluid 6 from which the latent heat has been removed is condensed and liquefied on the wall of the annular groove 2 which is the flow passage 4, and is returned into the reservoir 5. By repeating such a series of operations naturally, the molded object placed on the surface plate 10 is uniformly heated.

[0004]

The conventional heat equalizing apparatus is constructed as described above, and can heat-treat a molded object at a certain set temperature. In some cases, it may be desirable to perform soaking at a lower temperature.
When using one heat equalizer, it is necessary to change the temperature of the heat equalizer from the initial set temperature to the set temperature of the next process. However, since there is no cooling function, it depends on natural heat radiation from the surface. However, it takes a long time to reach the reset temperature. As a result, there is a problem that the time of the entire production process is extended. Also, in order to reduce this loss time, the 2
If two units are used, the cost for two units and two
There is a problem that requires space for each vehicle.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a heat equalizer capable of uniformly heating a surface of a surface plate with a heat source and cooling the surface of the surface plate. It is assumed that.

[0006]

According to a first aspect of the present invention, there is provided a heat equalizing apparatus, wherein a flow passage is formed inside a surface plate on which the object is placed, and the object is passed through the surface plate. In a heat equalizer provided with a heat source to be heated, one side is provided with a radiator which communicates with a flow passage formed inside a surface plate and the other side extends outside the surface plate.

A heat equalizer according to a second aspect of the present invention is provided with a heat source having a flow passage formed inside a surface plate on which the object is placed, and heating the object through the surface plate. In the heat equalizer, one side is provided with a radiator communicating with a flow passage formed inside the surface plate, and the other side extends outside the surface plate, and an on-off valve disposed on the surface plate side of the heat radiator. Things.

A heat equalizer according to a third aspect of the present invention is provided with a heat source that has a flow passage formed inside a surface plate on which the object is placed and heats the object through the surface plate. In the heat equalizer, one side communicates with a flow passage formed inside the surface plate, and the other side includes a radiator extending outward from the surface plate, and a flexible body provided on the surface plate side of the radiator. It is a thing.

A heat equalizer according to a fourth aspect of the present invention is provided with a heat source having a flow passage formed inside a surface plate on which the object is placed, and for heating the object through the surface plate. In the heat equalizer, one side is provided with a radiator that communicates with a flow passage formed inside the surface plate, and the other side extends outside the surface plate, and a blower disposed near the heat radiator. .

A heat equalizer according to a fifth aspect of the present invention is provided with a heat source having a flow passage formed inside a surface plate on which the object is placed, and heating the object through the surface plate. In the heat equalizer, one side communicates with a flow passage formed inside the surface plate, and the other side extends a heat radiator outside the surface plate, a blower disposed near the heat radiator, and adjusts a flow rate of the blower. And a flow rate adjusting member that performs the adjustment.

A heat equalizer according to a sixth aspect of the present invention is provided with a heat source having a flow passage formed inside a surface plate on which the object is placed, and for heating the object via the surface plate. In the heat equalizer, one side communicates with the flow passage formed inside the surface plate, and the other side is a radiator extending outside the surface plate, and a variable blower arranged near the heat radiator and capable of changing the air volume. Is provided.

A heat equalizer according to a seventh aspect of the present invention is provided with a heat source having a flow passage formed inside a surface plate on which the object is placed, and for heating the object through the surface plate. In the heat equalizer, one side is provided with a heat radiator which communicates with a flow passage formed inside the surface plate, and the other side extends along the outer periphery of the surface plate.

The heat equalizing apparatus according to claim 8 of the present invention includes a heat source that has a flow passage formed inside the surface plate on which the object is placed, and heats the object through the surface plate. In the heat equalizer, an annular heat radiator disposed on the outer peripheral side of the surface plate, and a communication pipe having one side communicating with a flow passage formed inside the surface plate and the other side communicating with the annular heat radiator. It is provided.

According to a ninth aspect of the present invention, there is provided a heat equalizing apparatus, wherein a flow path is formed inside a surface plate on which the object is placed, and a heat source for heating the object through the surface plate. In the heat equalizer, an annular heat radiator disposed on the outer peripheral side of the surface plate, a communication pipe having one side communicating with a flow passage formed inside the surface plate, and the other side communicating with the annular heat radiator, It is provided with a blower duct installed to blow air to the annular heat radiator, and a blower installed in the blower duct.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 1 and 2 are a main part plan view and a sectional view showing a configuration of a heat equalizer according to Embodiment 1 of the present invention. In these figures, reference numeral 1 denotes a first plate-like member having a plurality of annular grooves 2 formed concentrically on a lower surface, and a plurality of molded articles (not shown) are placed on an upper surface. . Reference numeral 3 denotes a second plate-like member which is joined to the lower surface of the first plate-like member 1 by, for example, brazing so as to cover each annular groove 2, and constitutes a surface plate 10 together with the first plate-like member 1. And the flow passage 4 is formed. Reference numeral 5 denotes a plurality of liquid reservoirs which are formed to protrude downward from the second plate-shaped member 3 and communicate with the flow passages 4 in the surface plate 10. The member 3 is formed by deep drawing or the like. 6 is a hydraulic fluid stored in the liquid reservoir 5, 7 is immersed in one side of the hydraulic fluid in the liquid reservoir 5,
The terminal on the other side is a heat source composed of, for example, a heater or the like, which penetrates the side wall of the liquid reservoir 5 and projects to the outside. Reference numeral 11 denotes a case in which one side communicates with the flow passage 4 formed inside the surface plate 10, and the other side is a radiator extending radially outward from the surface plate 10, for example, and includes a tube 12 and heat radiation fins 13. ing. In this way, the flow path 4 of the surface plate 10, the liquid reservoir 5, and the inside of the tube 12 of the radiator 11 communicate with each other to form one closed container.

In the heat equalizing apparatus according to the first embodiment configured as described above, when the object to be molded is placed on the surface plate 10 to perform the heat molding, the hydraulic fluid stored in the liquid reservoir 5 is formed. The working fluid 6 is directly heated by a heat source 7 immersed in the working fluid 6. The heated hydraulic fluid 6 evaporates and evaporates, spreads over the entire surface plate 10 through the flow passage 4, and transmits the latent heat to the surface plate 10 on the wall of the annular groove 2 as the flow passage 4 to heat the molded object. Do. The vapor of the working fluid 6 from which the latent heat has been removed is condensed and liquefied on the wall of the annular groove 2 which is the flow passage 4, and is returned into the reservoir 5. By repeating such a series of operations naturally, the molded object placed on the surface plate 10 is uniformly heated.

As described above, the heat of the heat source 7 is diffused by the vapor of the working fluid 6 into the inside of the closed container constituted by the liquid reservoir 5, the flow passage 4 and the radiator 11, and the inner wall surface of the flow passage 4 Since the heat is transported by the condensation in the platen 10, the surface of the platen 10 can be uniformly heated, and the workpiece 6 placed on the upper surface of the platen 10 can be uniformly heated.

When the entire surface of the platen 10 is heated by the above-described operation, a certain amount of heat is accumulated in the platen 10 itself. However, in order to lower the temperature of the platen 10, the accumulated heat is used. It is necessary to radiate heat. Since the heat radiation area is only the surface area of the platen 10 itself, it takes time to lower the temperature. However, by providing the heat radiator 11 according to the first embodiment of the present invention, a large heat radiating area can be secured, and the heat accumulated in the platen 10 is radiated by the tube 12 communicating with the flow passage 4 as a heat source. The operation of evaporating and vaporizing and condensing and liquefying the working fluid 6 is naturally repeated using the inner wall surface of the tube 12 of the body 11 as a working fluid condensing portion, and the heat accumulated in the surface plate 10 is efficiently transferred to the radiator 11 and radiated. Therefore, it is possible to lower the temperature while keeping the temperature of the platen 10 part uniform, and it is possible to obtain a heat equalizer with high temperature controllability. Moreover, although the case where the heat radiator 11 is arranged at one place around the surface plate 10 is shown, a plurality of heat radiators 11 may be arranged around the surface plate 10.

Embodiment 2 FIG. 3 is a cross-sectional view illustrating a configuration of a heat equalizer according to Embodiment 2 of the present invention. In the figure, 1 to 7 and 10 to 13 are the same as the configuration of the first embodiment. Reference numeral 14 denotes an on-off valve arranged on the side of the platen 10 of the tube 12 of the radiator 11.

In the heat equalizer in the second embodiment configured as described above, the on-off valve 14 is arranged on the side of the platen 10 of the tube 12 of the radiator 11 so that, for example, the heat radiation at the time of heating / heating can be achieved. Unnecessary heat radiation from the body 11 can be reduced, and a heat equalizer with high thermal efficiency can be obtained. Moreover, although the case where the heat radiator 11 is arranged at one place around the surface plate 10 is shown, a plurality of heat radiators 11 may be arranged around the surface plate 10.

Embodiment 3 FIG. 4 is a cross-sectional view illustrating a configuration of a heat equalizing apparatus according to Embodiment 3 of the present invention. In the figure, 1 to 7 and 10 to 13 are the same as the configuration of the first embodiment. Reference numeral 15 denotes a flexible body provided on the surface plate 10 side of the tube 12 of the radiator 11.

As described above, according to the third embodiment, since the flexible body 15 is provided on the side of the platen 10 of the tube 12 of the radiator 11, unnecessary heat from the radiator 11 can be obtained, for example, at the time of heating / heating. If you want to reduce heat dissipation,
By setting the radiator fin 13 side of the radiator 11 below the surface plate 10, the condensed and liquefied working fluid accumulates in the tube 12, so that heat radiation can be suppressed. In addition, cooling
By setting the radiator fin 13 side of the radiator 11 above the surface plate 10 at the time of cooling, the cycle of evaporation / condensation and liquefaction is performed normally, and the heat accumulated in the surface plate 10 is efficiently radiated. Can be. Moreover, although the case where the heat radiator 11 is arranged at one place around the surface plate 10 is shown, a plurality of heat radiators 11 may be arranged around the surface plate 10.

Embodiment 4 FIG. 5 is a cross-sectional view illustrating a configuration of a heat equalizing apparatus according to Embodiment 4 of the present invention. In the figure, 1 to 7 and 10 to 13 are the same as the configuration of the first embodiment. 16 is a radiation fin 13 of the radiator 11
It is a blower arranged in the vicinity.

In the fourth embodiment configured as described above, by disposing the blower 16 in the vicinity of the radiating fins 13 of the radiator 11, heat transfer of the radiator 11 to the radiator 11 can be promoted, and the time can be shortened. , And a temperature equalizing device with high temperature controllability can be obtained. In addition, when installing the blower 16, always operating always means
For example, in the case of heating and raising the temperature of the surface plate 10, the time required for the surface plate 10 to reach the set temperature is prolonged due to wasteful heat radiation. By operating the blower 16 only when necessary, more efficient operation is possible. Moreover, although the case where the heat radiator 11 is arranged at one place around the surface plate 10 is shown, a plurality of heat radiators 11 may be arranged around the surface plate 10.

Embodiment 5 FIG. FIG. 6 is a cross-sectional view illustrating a configuration of a heat equalizing apparatus according to Embodiment 5 of the present invention. In the drawing, reference numerals 1 to 7, 10 to 13, and 16 are the same as those of the above-described fourth embodiment. Reference numeral 17 denotes a flow rate adjuster for adjusting the flow rate of the blower 16.

In the fifth embodiment configured as described above, the blower 16 is arranged near the radiating fins 13 of the radiator 11, and the flow adjuster 17 for adjusting the flow rate of the blower 16 is provided.
Is provided, the flow rate of the blower 16 can be adjusted, so that the temperature rise / fall time of the temperature of the surface plate 10 can be adjusted. For example, it is possible to obtain a heat equalizing apparatus that can cope with a case where heating and cooling are required to be performed rapidly according to a molded object or a case where heating and cooling are desired with a certain temperature gradient. Moreover, although the case where the heat radiator 11 is arranged at one place around the surface plate 10 is shown, a plurality of heat radiators 11 may be arranged around the surface plate 10.

Embodiment 6 FIG. FIG. 7 is a cross-sectional view illustrating a configuration of a heat equalizer according to Embodiment 6 of the present invention. In the figure, 1 to 7 and 10 to 13 are the same as the configuration of the first embodiment. 18 is a radiating fin 13 of the radiator 11
It is a variable blower that is arranged in the vicinity and can change the amount of air blow.

As described above, according to the sixth embodiment, the same effect as that of the fifth embodiment can be obtained by arranging the variable blower 18 in the vicinity of the radiation fin 13 of the radiator 11. Furthermore, we can cope with minute air volume adjustment,
A high-precision heat equalizer can be obtained. Further, the number of parts can be reduced as compared with the fifth embodiment, and the embodiment is excellent in economy. Moreover, although the case where the heat radiator 11 is arranged at one place around the surface plate 10 is shown, a plurality of heat radiators 11 may be arranged around the surface plate 10.

Embodiment 7 FIG. 8 is a plan view showing a configuration of a heat equalizing apparatus according to Embodiment 7 of the present invention. In the drawing, reference numeral 10 denotes a platen, 19 denotes a radiator that communicates on one side with the flow passage 4 formed inside the platen 10, and extends on the other side along the outer periphery of the platen 10. 21 is shown. Thus, the flow path 4 of the surface plate 10, the liquid reservoir 5, and the tube 2 of the radiator 19
The inside of the container communicates with the inside of the container to form one closed container.

According to the seventh embodiment, since the other side of the heat radiator 19 extends along the outer periphery of the platen 10, the installation space of the entire apparatus can be greatly reduced. It is possible to reduce the size of a semiconductor manufacturing apparatus or other system into which the apparatus is incorporated.

Embodiment 8 FIG. 9 and 10 are a plan view and a cross-sectional view illustrating a configuration of a heat equalizer according to Embodiment 8 of the present invention. In these figures, 1 to 7, 10 to 10
Reference numeral 13 is the same as the configuration of the first embodiment. 22
Is an annular heat radiator disposed on the outer peripheral side of the surface plate 10, 23 communicates with a flow passage 4 formed on one side inside the surface plate 10,
A communication pipe having the other side communicating with the annular radiator 22, and a radiating fin 24 attached to the annular radiator 22. Thus, the flow path 4 of the surface plate 10, the liquid reservoir 5, the communication pipe 23,
The inside of the heat dissipating body 22 communicates to form one closed container.

In each of the above-described embodiments, the case where the heat radiator has a short tube configuration is shown. In this case, the operating fluid rapidly rises due to the heat of the platen 10 at the time of heat radiation. There is a possibility that the hydraulic fluid is pushed to the tip of the platen 10 and the hydraulic fluid is not returned to the platen 10, causing a heat transport limit phenomenon. However, according to the eighth embodiment, the annular heat radiator 22 is provided on the outer peripheral side of the surface plate 10, and the communication passage 23 forms the annular heat radiator 22 with the flow passage 4 formed inside the surface plate 10. By communicating with the body 22, the entire heat dissipating body 22 can have a loop structure, so that it is possible to suppress the occurrence of the heat transport limit phenomenon, and to obtain a stable heat equalizing device.

Embodiment 9 FIG. 11 is a cross-sectional view illustrating a configuration of a heat equalizing apparatus according to Embodiment 9 of the present invention. In the figure, reference numerals 1 to 7, 10 to 13, and 22 to 24 are the same as those in the configuration of the eighth embodiment. Reference numeral 25 denotes a blower duct installed to blow air to the annular heat radiator 22, and reference numeral 26 denotes a blower installed in the blower duct 25.

As described above, according to the ninth embodiment, the blower duct 26 for blowing the annular radiator 22
By passing the cooling air from above, the annular heat radiator 22 is cooled by the cooling air, so that rapid cooling is possible while maintaining the surface of the platen 10 more uniformly.

[0035]

As described above, in the heat equalizing apparatus according to the first aspect of the present invention, the flow passage is formed inside the surface plate on which the object is mounted, and the object is formed through the surface plate. In the heat equalizer provided with a heat source for heating the platen, one side communicates with a flow passage formed inside the platen, and the other side is provided with a radiator extending outside the platen. Can be lowered while keeping the temperature uniform, and a heat equalizer with high temperature controllability can be obtained.

Further, the heat equalizer according to a second aspect of the present invention is provided with a heat source having a flow passage formed inside the surface plate on which the object is placed, and for heating the object via the surface plate. In the heat equalizer, one side is provided with a radiator communicating with a flow passage formed inside the surface plate, and the other side extends outside the surface plate, and an on-off valve disposed on the surface plate side of the heat radiator. This makes it possible to reduce unnecessary heat radiation from the radiator at the time of heating / heating, and to obtain a heat equalizer with high thermal efficiency.

The heat equalizer according to a third aspect of the present invention is provided with a heat source having a flow passage formed inside the surface plate on which the object is placed, and for heating the object through the surface plate. In the heat equalizer, one side communicates with a flow passage formed inside the surface plate, and the other side includes a radiator extending outward from the surface plate, and a flexible body provided on the surface plate side of the radiator. As a result, unnecessary heat radiation from the radiator at the time of heating / heating can be reduced, and a heat equalizer with high thermal efficiency can be obtained.

The heat equalizer according to a fourth aspect of the present invention is provided with a heat source having a flow passage formed inside the surface plate on which the object is placed, and for heating the object via the surface plate. In the heat equalizer, one side communicates with the flow passage formed inside the surface plate, the other side is provided with a radiator extending outside the surface plate, and a blower disposed near the radiator, The heat transfer of the heat radiating body 11 can be promoted, the temperature can be lowered in a shorter time, and a heat equalizer with higher temperature control can be obtained.

A heat equalizer according to a fifth aspect of the present invention is provided with a heat source having a flow passage formed inside a surface plate on which the object is placed, and for heating the object through the surface plate. In the heat equalizer, one side communicates with a flow passage formed inside the surface plate, and the other side extends a heat radiator outside the surface plate, a blower disposed near the heat radiator, and adjusts a flow rate of the blower. The flow rate of the blower can be adjusted by providing the flow rate adjusting member that performs the temperature control, so that the temperature rise / fall time of the temperature of the surface plate 10 can be adjusted.

The heat equalizer according to a sixth aspect of the present invention is provided with a heat source having a flow passage formed inside the surface plate on which the object is placed and heating the object through the surface plate. In the heat equalizer, one side communicates with a flow passage formed inside the surface plate, and the other side extends to the outside of the surface plate, and a radiator that is disposed near the radiator, and a variable blower that can vary the amount of air blown. Is provided, the same effect as that of the fifth embodiment can be obtained. Furthermore, we can cope with minute air volume adjustment,
A high-precision heat equalizer can be obtained.

A heat equalizer according to a seventh aspect of the present invention is provided with a heat source having a flow passage formed inside a surface plate on which the object is placed, and for heating the object through the surface plate. In the heat equalizer, one side is connected to the flow passage formed inside the surface plate, and the other side is provided with a radiator extending along the outer circumference of the surface plate. Therefore, it is possible to reduce the size of a device in which the present device is incorporated and other systems.

Further, the heat equalizer according to claim 8 of the present invention is provided with a heat source having a flow passage formed inside the surface plate on which the object is placed, and for heating the object through the surface plate. In the heat equalizer, an annular heat radiator disposed on the outer peripheral side of the surface plate, and a communication pipe having one side communicating with a flow passage formed inside the surface plate and the other side communicating with the annular heat radiator. With the provision, the entire radiator can have a loop structure, so that it is possible to suppress the occurrence of the heat transport limit phenomenon,
A stable soaking device can be obtained.

A heat equalizer according to a ninth aspect of the present invention is provided with a heat source having a flow passage formed inside a surface plate on which the object is placed, and heating the object through the surface plate. In the heat equalizer, an annular heat radiator disposed on the outer peripheral side of the surface plate, a communication pipe having one side communicating with a flow passage formed inside the surface plate, and the other side communicating with the annular heat radiator, By providing a blower duct installed to blow air to the annular radiator and a blower installed in the blower duct, the annular radiator is cooled by the cooling air, so the surface of the surface plate can be made more uniform. Rapid cooling is possible while holding.

[Brief description of the drawings]

FIG. 1 is a main part plan view showing a configuration of a heat equalizing apparatus according to Embodiment 1 of the present invention.

FIG. 2 is a side sectional view showing a configuration of a heat equalizing apparatus according to Embodiment 1 of the present invention.

FIG. 3 is a cross-sectional view illustrating a configuration of a heat equalizer according to Embodiment 2 of the present invention.

FIG. 4 is a cross-sectional view illustrating a configuration of a heat equalizer according to Embodiment 3 of the present invention.

FIG. 5 is a cross-sectional view illustrating a configuration of a heat equalizer according to Embodiment 4 of the present invention.

FIG. 6 is a cross-sectional view illustrating a configuration of a heat equalizer according to Embodiment 5 of the present invention.

FIG. 7 is a plan view showing a configuration of a heat equalizer according to Embodiment 6 of the present invention.

FIG. 8 is a plan view showing a configuration of a heat equalizer according to Embodiment 7 of the present invention.

FIG. 9 is a plan view showing a configuration of a heat equalizing apparatus according to Embodiment 8 of the present invention.

FIG. 10 is a cross-sectional view illustrating a configuration of a heat equalizer according to Embodiment 8 of the present invention.

FIG. 11 is a cross-sectional view illustrating a configuration of a heat equalizing apparatus according to Embodiment 9 of the present invention.

FIG. 12 is a plan view of a main part showing an example of a conventional heat equalizer.

FIG. 13 is a cross-sectional view illustrating an example of a conventional heat equalizer.

[Explanation of symbols]

4 flow passage, 7 heat source, 10 platen, 11 heat sink, 1
4 On-off valve, 15 Flexible body, 16 Blower, 1
7 flow rate adjuster, 18 variable blower, 19 radiator, 2
2 heat radiator, 23 communication pipe, 25 air duct, 26
Blower.

Claims (9)

[Claims] 1. A heat equalizer provided with a heat source for forming a flow path inside a surface plate on which a molding object is placed and for heating the molding material through the surface plate, wherein one side of the temperature equalizer is the surface plate. A heat equalizer, comprising: a radiator communicating with a flow passage formed therein and having the other side extending outward from the surface plate. 2. A heat equalizer provided with a heat source for forming a flow passage inside a surface plate on which a molded object is placed and heating the molded object through the surface plate, wherein one side of the heat equalizer is the surface plate. A heat equalizer, comprising: a radiator communicating with a flow passage formed therein and having the other side extending outward from the platen; and an on-off valve disposed on the platen side of the radiator. apparatus. 3. A heat equalizer having a heat source for forming a flow path inside a surface plate on which a molded object is placed and heating the molded object through the surface plate, wherein one side of the temperature equalizer is the surface plate. A heat equalizer comprising: a radiator communicating with a flow passage formed therein and having the other side extending outward from the platen; and a flexible body provided on the platen side of the radiator. apparatus. 4. A heat equalizer having a heat source for forming a flow path inside a surface plate on which a molded object is placed and heating the molded object through the surface plate, wherein one side of the heat equalizer is the surface plate. A heat equalizer, comprising: a heat radiator communicating with a flow passage formed therein and having the other side extending outside the surface plate; and a blower disposed near the heat radiator. 5. A heat equalizer provided with a heat source for forming a flow path inside a surface plate on which a molded object is placed and heating the molded object via the surface plate, wherein one side of the heat equalizer is the surface plate. A radiator communicating with a flow passage formed therein and extending on the other side to the outside of the surface plate, a blower arranged near the radiator, and a flow regulator for adjusting a flow rate of the blower are provided. A soaking device. 6. A heat equalizer provided with a heat source for heating a molding object through the surface plate through a flow passage inside the surface plate on which the molding object is placed, wherein one side is inside the surface plate. A radiator that communicates with the flow passage formed on the other side and extends on the other side to the outside of the platen; and a variable blower that is disposed near the radiator and that can vary the amount of air blown. Thermal equipment. 7. A heat equalizing apparatus having a heat source for forming a flow path inside a surface plate on which a molded object is placed and heating the molded object through the surface plate, wherein one side of the heat equalizer is the surface plate. A heat equalizer, comprising: a heat radiator that communicates with a flow passage formed therein and has the other side extending along the outer periphery of the surface plate. 8. A heat equalizer provided with a heat source for forming a flow passage inside a surface plate on which a molded object is placed and heating the molded object through the surface plate, wherein an outer periphery of the surface plate is provided. An annular heat radiator disposed on one side of the platen, and a communication pipe communicating on one side with a flow passage formed inside the surface plate and communicating with the annular heat radiator on the other side. apparatus. 9. A heat equalizer having a heat source for forming a flow path inside a surface plate on which a molded object is placed and heating the molded object through the surface plate, wherein an outer periphery of the surface plate is provided. The annular radiator disposed on the side, one side communicates with the flow passage formed inside the surface plate, and the other side communicates with the annular radiator, and for blowing air to the annular radiator. A heat equalizer, comprising: a blower duct installed in the blower duct; and a blower installed in the blower duct.