JPH11298197A - Method and apparatus for mounting chip components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a method and apparatus for mounting chip components, capable of quickly and surely provisionally mounting microchips such as optical chips at specified position on a substrate. SOLUTION: On the occasion of positioning and mounting a chip component 30 to be mounted on substrate 40 at a given mounting position on the substrate 40, after mounting the chip component 30 near at the given mounting position on the substrate 40, the chip component 30 is pushed to slide on the substrate 40 by the inner edge of an opening 21 of a positioning jig 20, thereby mounting the chip 30 at the given mounting position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a hybrid I
More particularly, the present invention relates to a method and an apparatus for mounting a chip component capable of securely temporarily placing the chip component at a mounting position on a substrate surface.

[0002]

2. Description of the Related Art An optical module used for optical communication or the like usually has a large number of components, and requires a costly operation because of the necessity of precise work for light emission, alignment of an optical axis between a light receiving element and an optical fiber, and the like. There is a problem of becoming high.

On the other hand, a planar mounting type optical module in which an optical chip such as a semiconductor laser or a photodiode and an optical fiber are mounted on the surface of a silicon substrate or the like as a reference plane to simplify the optical axis adjustment is low in cost. It is considered the most influential method and has been actively developed in recent years. By the way, in mounting this planar mounting type optical module, it is an important element to surely position and bond an optical chip such as a semiconductor laser or a photodiode at a predetermined position on a substrate.

For this purpose, NEC Technical Report, Vol. 47, N
o.12, pp.27-32 (1994) discloses a chip component mounter. FIG. 6A shows this chip component mounter.
The chip component mounter 100 is a device for mounting a semiconductor laser 101 on a silicon substrate 102. The silicon substrate 102 is placed on a heater stage 105 on an XYZ stage 104, and the semiconductor laser 101 is held by a vacuum chuck 106 movable in the Z-axis direction (vertical direction). Markers (not shown) provided for each of them are recognized by image processing, the positions are automatically adjusted to predetermined mounting positions by the XYZ stage 104, and the semiconductor laser 101 is positioned at predetermined positions on the silicon substrate 102. next,
The semiconductor laser 101 is attached to the substrate 1 by the vacuum chuck 106.
02 while the substrate 102 is pressed against the heater stage 1
05, the substrate 102 and the semiconductor laser 101
The semiconductor laser 101 is bonded to the silicon substrate 102 by melting the solder layer 107 provided between the semiconductor laser 101 and the semiconductor laser 101.

The optical fiber 110 is positioned and fixed by a V-groove 111 provided on the substrate 102, as shown in FIGS. 6 (b-1) and 6 (b-2). According to this method, the semiconductor laser 101 emits light and is coupled to the optical fiber 110 as in the prior art, and the semiconductor laser 101 is monitored in a short time and with sufficient accuracy without adjusting the position while monitoring the output light from the fiber 110. 101 and optical fiber 110
Can be aligned and fixed, so that mass production of modules and cost reduction can be achieved.

However, in this method, one chip is bonded in one operation. Therefore, when a large number of chips are mounted on one substrate, the solder layer fixing the first attached chip is not used. Melting and solidification are repeated, and there is a concern about problems such as deterioration of the chip and displacement of the bonding position. In addition, the time required for assembly increases. For this reason, in order to join a plurality of chips with high precision, it is necessary to join them all at once, and further devising is required.

Therefore, for example, T. Hayashi, IEEE Trans. C
omponents, Hybrids, and Manufacturing Technology, vo
l.15, No2, pp.225-230 (1992) discloses a method for automatically and accurately positioning an optical chip and a substrate by self-alignment using surface tension generated during reflow of solder bumps. I have.

FIG. 7 shows the steps of this method. In this method, first, as shown in FIG.
The solder bump 203 is formed on the bump base pad 202 formed on the substrate 205, and the solder bump 203 is formed on the substrate 205 side.
A solder bonding pad 206 is provided at a position corresponding to 03. Here, the solder bump 203 is formed on the bump base pad 202, and when the solder bump is melted later, the solder is formed on the bump base pad and the solder bonding pad 2.
The material is selected so as to be selectively wetted only at 06. Next, as shown in FIG.
When the photodiode 201 is temporarily placed on the bumps so that the solder bumps 203 come into contact with the solder bumps 203 and the solder bumps 203 are melted, as shown in FIG. And automatically joins with high precision as shown in FIG. 7 (d).

With this technique, it is not necessary to adjust the positions of chips one by one, and even if a plurality of chips are temporarily placed on a substrate with relatively coarse precision, high-precision positioning can be performed collectively by melting the solder. This is effective for mass production of optical modules.

[0010]

However, when chip components are mounted by the self-alignment method using the surface tension of the solder, a conventional chip mounting apparatus is used in the process of temporarily placing an optical chip. With the method, there is a new problem that it is difficult to temporarily place the lens at a predetermined position.

That is, at the stage where the optical chip is temporarily placed on the bump, the small optical chip is gripped by the arm, the chip is moved to a predetermined position on the substrate, and after temporarily mounted, the gripped chip is released. There is a need. At this time,
In most cases, the optical chip is a small part of about 300 μm square, and at the time of temporary mounting, the solder bump and the solder bonding pad do not have an adhesive property. It is recognized that problems such as the suction arm not releasing the chip due to the influence of a foreign substance or the like or the position of the chip being displaced at the moment of release are generated. If the degree of the displacement exceeds the size of the bump, self-alignment does not work.
In addition, even if the bump is melted while holding the chip with the suction arm, the optical chip cannot move freely, so that self-alignment is not performed.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a mounting method and a mounting method of a chip component capable of quickly and reliably temporarily placing a small chip component such as an optical chip at a predetermined position on a substrate. To provide.

[0013]

According to a first aspect of the present invention, there is provided a chip component mounting method for positioning a chip component to be mounted on a substrate at a predetermined mounting position on the substrate. A method of mounting a chip component, wherein the chip component is placed near a predetermined mounting position on the substrate, and then the chip component is pushed and slid on the substrate to move the chip. Place on the mounting position.

According to the invention, since the chip component is placed near the temporary placement position of the substrate and then pushed to move to a desired position, it is not necessary to apply a strong force to the chip during the temporary placement. Therefore, when the chip component is transported and placed on the substrate, coarse accuracy is sufficient, and thereafter, the influence of the adhesive agent that is attached can be eliminated and the chip component can be reliably placed at the temporary placement position.

According to a second aspect of the present invention, there is provided a method for mounting a chip component.
2. The method for mounting a chip component according to claim 1, wherein after mounting the chip component at a predetermined position on the substrate, solder reflow is performed to join the chip component and the substrate.

According to the invention, it is possible to bond the chip component to an accurate position in the solder reflow after the temporary placement by utilizing the self-alignment utilizing the surface tension of the solder.

According to a third aspect of the present invention, there is provided an apparatus for mounting a chip component.
A chip component mounting apparatus for positioning and mounting a chip component to be mounted on a substrate at a predetermined mounting position on the substrate, wherein the chip component mounted near the predetermined mounting position on the substrate A positioning jig for pushing the side surface of the substrate and sliding on the substrate to move to the predetermined mounting position, and a driving means for moving the positioning jig.

According to the invention having such a configuration, the positioning jig is moved by the driving means, and the side surface of the chip component is pushed and moved to a predetermined position to temporarily place the chip component. Therefore, the chip component can be reliably placed at the temporary placement position by eliminating the influence of the adhesive agent attached.

According to a fourth aspect of the present invention, there is provided an apparatus for mounting a chip component.
The chip component mounting apparatus according to claim 3, wherein the positioning jig is a frame-shaped member having an opening surrounding a periphery of a side surface of the chip component.

According to the invention having such a configuration, the chip component can be pushed and moved while the chip component is placed in the opening by the frame-shaped member.

According to a fifth aspect of the present invention, there is provided a chip component mounting apparatus, comprising:
The chip component mounting apparatus according to claim 3, wherein
The side surface of the opening of the positioning jig has a tapered shape that gradually widens from the lower side to the upper side.

According to the invention having such a configuration, since the side surface of the opening is tapered so as to expand upward, it is easy to insert a chip component into the opening, and the tip of the inner edge of the opening can be formed into an acute angle. It is possible to reduce the contact area with the chip component and eliminate the influence of the adhered adhesive.

According to a sixth aspect of the present invention, there is provided a chip component mounting apparatus.
The chip component mounting apparatus according to any one of claims 3 to 5, wherein a plurality of projections having acute angles are formed on the inner edge of the opening of the positioning jig.

According to the invention having such a configuration, since the acute-angled convex portion is formed at the inner edge of the opening, the contact area with the chip component is reduced, and the influence of the adhered adhesive is eliminated. It is possible.

According to a seventh aspect of the present invention, there is provided a chip component mounting apparatus.
The mounting device for a chip component according to any one of claims 3 to 6, wherein the positioning jig includes a plurality of pins projecting below a member thereof.

According to the invention having such a configuration, the chip component can be pushed by the pin protruding from the lower portion of the member, so that the contact area with the chip component is reduced, and the influence of the adhered adhesive is reduced. It is possible to eliminate.

[0027] A chip component mounting apparatus according to claim 8 is
The chip component mounting apparatus according to any one of claims 3 to 7, wherein a plurality of the openings of the positioning jig are provided corresponding to a mounting position of the chip component.

According to the invention having such a configuration, when a plurality of chip components are mounted on one board, a plurality of chip components can be collectively positioned by one positioning, thereby improving productivity. Good.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention and is a diagram for explaining an apparatus and a method for flip-chip mounting a semiconductor laser on a substrate by solder bumps. FIG. 1 (a) is a plan view and FIG. 1 (b). Is a side view.

In this chip component mounting apparatus 1, a positioning arm 11 is fixed to an XYZ stage 10, and a frame-like member 20 as a positioning jig whose inner peripheral surface surrounds the semiconductor laser is provided at the tip of the positioning arm 11. Installed. An opening 21 slightly larger than the outer diameter of the semiconductor laser is provided inside the frame member 20.

The XYZ stage 10 transports the frame member 20 to a position surrounding the semiconductor laser 30,
0 is finely oscillated back and forth and right and left, so that the frame-shaped member 2
The side of the semiconductor laser 30 is pushed by the inner edge of the opening 21 so that the semiconductor laser 30 can be moved to a predetermined mounting position. Solder bonding pads (not shown) are formed on the mounting surface of the semiconductor laser 30.

A substrate 40 on which the semiconductor laser 30 is flip-chip mounted is mounted on the heater stage 13. On the surface of the substrate 40, a solder bump 50 facing the solder bonding pad of the semiconductor laser 30 for flip-chip mounting is formed, and further a V groove 41 for positioning an optical fiber is formed.

FIG. 1 shows that the frame member 20 is arranged above the solder bumps 50 of the substrate 40 mounted on the heater stage 13 at a distance smaller than the height of the semiconductor laser 30 from the substrate 40. The state where the semiconductor laser 30 is put into the opening 21 of 20 and temporarily placed is shown. The semiconductor laser 30 may be temporarily placed on the substrate 40 first, and then the frame member 20 may be moved to surround the semiconductor laser 30. The size of the opening 21 of the frame member 20 is, for example, three
In the case of a 00 μm square, by setting the thickness to about 400 μm, the semiconductor laser 30 can be easily put into the frame member 20 with relatively low accuracy.

The frame-shaped member 20 can be manufactured, for example, by etching a single crystal silicon plate using photolithography. By using photolithography, it is possible to form the frame-shaped member 20 with higher precision than ordinary machining.

FIG. 2 shows an example of a method of forming solder bumps. As shown in FIG. 2A, a solder sheet 63 on the die 61 is punched out by a punching process using a combination of a die 61 and a minute punch 62. Then, as shown in FIG. 2B, the punched solder bumps 50 are thermocompression bonded to the bump base pads 42 formed at predetermined positions on the substrate surface, so that the solder bumps 5 are formed.
0 is formed. As shown in FIG. 2C, the solder bump 50 has a structure in which the solder is selectively wetted only on the bump base pad 42 when the solder bump 50 is later melted, and the surface tension of the melted solder is used. The semiconductor laser can be positioned by self-alignment. (See Patent No. 2629435). The solder bumps 50 can be formed by, for example, vapor deposition, sputtering, plating, or the like, in addition to the punching method.

As a material of the solder bump 50, a highly reliable fluxless solder bonding is possible, and Au8 is unlikely to be displaced by a solder creep phenomenon after the bonding.
It is desirable to use a 0%, Sn20% eutectic alloy. Further, by selecting the shape of the solder bumps to be 50 μm in diameter of the solder base pad 42 and about 40 μm in height after bump bonding, a high positional accuracy within ± 1 μm can be obtained.
Furthermore, the material of the solder joint pads and bump pads 42, is preferably a Au-rich wettability AuSn solder, solder base pads 42 and regions other than the bump bonding pads without solder wettability such as SiO ₂ material You need to choose from.

Next, the operation of the chip component mounting apparatus shown in FIG. 1 will be described with reference to FIG. The positional deviation allowed for the temporary placement of the semiconductor laser 30 is less than half the diameter of the solder bump 50. Move the semiconductor laser 30 to the XYZ stage 10
To move the frame member 20 back and forth and left and right, push the side surface of the semiconductor laser 30 at the periphery of the opening 21 of the frame member 20, and slide the semiconductor laser 30 on the substrate surface to move it to a predetermined temporary placement position. .

For example, the plan view of FIG.
As shown in the side view of (b-1), when the semiconductor laser 30 is moved to the right in the drawing, the frame member 20 is moved to the right, and the semiconductor laser 30 is moved at the left peripheral edge of the opening 21 of the frame member 20. The semiconductor laser 30 is slid and moved by pressing the left side surface. Conversely, the plan view of FIG. 3A-2 and the plan view of FIG.
As shown in the side view of -2), when the semiconductor laser 30 is moved to the left, the frame member 20 is moved to the left and the right side of the semiconductor laser 30 is pushed by the right peripheral edge of the opening 21 of the frame member. The laser 30 is slid and moved. The same applies to the vertical movement in the drawing.

In this case, since the solder bumps 50 are not visible from the upper surface, the solder bumps 5 are directly
1 cannot be aligned. Therefore, FIG.
As shown in (a), alignment markers 14a are formed on both the back surface of the semiconductor laser 30, that is, the surface opposite to the solder bonding surface, and the surface of the substrate 40, and these markers 14a are aligned within the above accuracy. It is efficient to perform position adjustment by image processing or the like. Further, since the silicon constituting the semiconductor laser 30 transmits infrared light, the semiconductor laser 30
A positioning marker is provided on the surface of
The positioning may be performed by recognizing the marker by fluoroscopy with an infrared camera or the like. The temporary placement accuracy in this case is
Half the diameter of the bump in both X and Y directions, ie, 50 μm in diameter
About 25 μm or less, preferably 10 μm
Good self-alignment can be obtained by adjusting to the extent.

After the positioning of the semiconductor laser 30 is completed by the operation described above, the solder bumps 50 are melted in a gas atmosphere having a low oxidizing effect on the substrate 40 on which the semiconductor laser 30 is mounted. In this case, the melting of the bump is performed in a nitrogen atmosphere having an oxygen concentration of 100 ppm or less by about 33 ° C.
It is appropriate to carry out at 0 ° C. If the oxygen concentration in the melting atmosphere is high, an oxide film is generated on the surface of the melted solder, and sufficient self-alignment may not be performed. In this solder reflow, as shown in FIG. 7C, a self-alignment action caused by the surface tension of the molten solder works, and the semiconductor laser 30 is automatically drawn to a predetermined position.

As a result, FIGS. 3 (c-1) and 3 (c-
As shown in 2), the semiconductor laser 30 is bonded to a predetermined mounting position on the substrate 40 via the solder bump 50.
By performing the formation of the V-groove 41 and the patterning of the under bump pad 42 by a series of photolithography, the position of the V-groove 41 and the under bump pad 42 can be relatively easily adjusted with high precision. Therefore, when the optical fiber 16 is mounted in the V-groove 41, the semiconductor laser 30 and the optical fiber 16 can be fixed on the substrate 40 with the optical axis aligned.

The chip component mounting apparatus described above does not directly transport the chip component to the mounting position by grasping or suctioning, but places the chip component near a predetermined mounting position and then mounts the chip component on the substrate. Fine adjustment to the temporary placement position while sliding on the top does not give a strong force to the chip parts, so problems when using suction tools etc., for example, the gripped or sucked chips can not be released or the chips are released at the moment of release Problems such as displacement of parts do not occur.

Further, since a frame-shaped member is used as a jig for positioning the chip components, and only a portion for pressing the chip components is used, when a plurality of chip components are mounted on one substrate, the chip components need to be mounted. When positioning one by one,
After positioning one chip component, when positioning the second and subsequent chip components, the frame-shaped member does not come into contact with the chip components that have already been positioned. This is effective when mounted on a substrate.

Further, by using a frame-shaped member, care is taken not to cover the substrate. Therefore, when positioning while confirming the position of the chip component from above with eyes, workability is good because visibility is good. This visibility can be further improved if, for example, the frame member is made of a transparent material.

The device for mounting chip components shown in FIG. 1 is a device suitable for mounting one optical chip at a time. FIG. 4 shows a second device suitable for positioning a large number of chips collectively. 1 shows a chip component mounting apparatus according to an embodiment. FIG. 4A is a plan view, and FIG. 4B is a side view.

In the mounting apparatus 2, a positioning template 20a is attached as a positioning jig to the XYZ stage 10, and the positioning template 20a can be moved in the XYZ directions by driving the XYZ stage 10. This positioning template 20
a has a plurality of (four in the drawing) quadrangular openings 21;
Are formed at positions where each chip component can be positioned at a predetermined mounting position, and each functions as a frame-shaped member of the first embodiment.

The positioning template 20a is made of a single-crystal silicon plate, and the opening 21 is formed with high precision by anisotropic etching using an alkaline solution such as KOH in accordance with the position where the chip component is to be mounted. Also,
As shown in FIG. 2B, the peripheral wall 22 of the opening 21 has a tapered shape that gradually widens upward, and has an angle of 45 °. Therefore, the peripheral edge of the opening 21 has an acute angle. Such a tapered peripheral wall 22 is
For example, it can be formed by anisotropically etching a single crystal silicon plate having a thickness of about 0.4 mm with an Aluri solution such as KOH using photolithography. The size of the opening 21 must be larger than the outer diameter of the chip component. For example, when the size of the semiconductor optical amplifier 60 is approximately 1 mm square, the lower surface of the positioning template 21a is approximately 1.3 mm square. The upper surface is preferably about 2 mm square, and the semiconductor optical amplifier 60 can be easily slid into the opening 21 with loose accuracy.

Next, regarding the operation of the chip component mounting apparatus 2 shown in FIG. 4, a plurality of semiconductor optical amplifiers 6 are mounted on a substrate 70 on which a planar optical waveguide T having an optical branching / merging circuit is formed.
The following describes an example of a mounting method in the case of manufacturing a matrix optical switch module by mounting and mounting all 0s at once and mounting them by self-alignment using the solder bumps 50.

First, the substrate 7 having the solder bumps 50 formed on the heater stage 13 fixed to the rotary stage 16
Place 0. Next, the position of the positioning template 20a provided with the plurality of openings 21 is adjusted using the XYZ stage 10 and the rotary stage 16, and the respective openings 21 are adjusted.
Move the semiconductor optical amplifier 60 so as to match all positions to be mounted. The gap between the lower surface of the positioning template 20a and the surface of the substrate 70 is set close to the thickness of the semiconductor optical amplifier 60 so as to be smaller than or equal to the thickness of the semiconductor optical amplifier 60, and is kept out of contact with the surface of the substrate 70. Next, the semiconductor optical amplifiers 60 are respectively inserted into the openings 21 of the positioning template 20a.
Solder bonding pads are formed on the semiconductor optical amplifier 60 at positions corresponding to the solder bumps as in the first embodiment.

Next, the position of the semiconductor optical amplifier 60 is adjusted by sliding the semiconductor optical amplifier 60 over the solder bumps 50 while pressing the periphery of the opening 21 against the four sides of the semiconductor optical amplifier 60 using the XYZ stage 10. After the position adjustment, as in the first embodiment,
The heater stage 13 is heated to melt the solder bumps 50, and the semiconductor optical amplifier 60 is moved to an accurate mounting position by self-alignment using the surface tension of the melted solder.

A planar optical waveguide formed on the substrate 70,
The relative positioning accuracy of the fiber positioning V-groove 71 and the bump base pad is relatively easily achieved by performing a series of photolithography.
Thereby, the optical axes of the optical fiber and the optical waveguide and the optical axis of the optical waveguide and the semiconductor optical amplifier can be collectively and automatically performed.

In the second embodiment, the case where the chip component is a semiconductor optical amplifier has been described as an example.
The present invention can be applied to any element mounted on a substrate such as a photodiode or a light emitting diode.

According to such a chip component mounting apparatus, a plurality of chip components can be temporarily and simultaneously placed on one substrate with high accuracy. Further, since the inner peripheral edge of the opening is at an acute angle, the contact area between the peripheral edge of the opening and the semiconductor optical amplifier can be reduced, so that even if sticky foreign matter adheres to the semiconductor optical amplifier. The effect can be minimized. Furthermore, since the opening of the positioning template is formed using photolithography, the position and size of the opening are extremely accurate, and positioning can be performed with high accuracy.

FIG. 5 shows another embodiment of the frame-shaped member. FIG. 5 (a) shows a third embodiment in which a plurality of projections 23 each having a sharp end are provided on the inner edge of the opening of the frame-shaped member 20b. Fig. 3 shows an alignment jig in the form. Thereby, since the contact area between the inner edge of the opening 21 and the chip component 30 can be reduced,
The effects of sticky objects can be minimized.

FIG. 5B shows a positioning jig according to a fourth embodiment in which a plurality of slightly projecting pins 25 are provided below the frame-shaped member 20c, and the chip components 30 are pushed by these pins. Is shown. Also according to this structure, since the pins 25 press the chip components, the contact area can be reduced, so that the influence of the presence of the sticky object can be prevented. In this case, the frame-shaped member 20c does not necessarily have to have an opening.

[0056]

As described above, according to the chip component mounting method of the present invention, the final positioning of the chip component with respect to the substrate is performed by pushing and sliding the side surface of the chip component to strongly move the chip component. Since there is no pressing, the positioning can be performed accurately while minimizing the influence of the adhesive remaining on the chip component.

Further, according to the chip component mounting apparatus of the present invention, the final positioning of the chip component with respect to the substrate is performed by:
Since the side of the chip component is pushed and moved by the periphery of the opening of the positioning jig having the opening, and the chip component is not strongly pressed, the influence of the adhesive remaining on the chip component is minimized. be able to.

[Brief description of the drawings]

FIGS. 1A and 1B show a chip component mounting apparatus according to a first embodiment of the present invention, wherein FIG. 1A is a plan view and FIG. 1B is a side view.

FIGS. 2A to 2C are side views showing the steps of forming solder bumps by punching, showing the order of the steps. FIGS.

FIGS. 3A and 3B are diagrams illustrating a method for positioning a chip component by a positioning jig according to the present invention, wherein FIGS.
2) is a plan view, (b-1) and (b-2) are side views, and (c).
-1) is a side view, and (c-2) is a rear view.

4A and 4B show a second embodiment of the chip component of the present invention, wherein FIG. 4A is a plan view and FIG. 4B is a side view.

5A and 5B show another embodiment of the positioning jig according to the present invention, wherein FIG. 5A is a plan view showing a third embodiment, and FIG.
1) is a bottom view showing the fourth embodiment, and (b-2) is a side view thereof.

FIG. 6A is a side view showing a conventional chip component mounting apparatus, FIG. 6B is a side view showing a state where a semiconductor laser and an optical fiber are mounted on a substrate, and FIG. FIG.

FIGS. 7A to 7D show a method of mounting chip components by self-alignment using solder bumps, and FIGS. 7A to 7D are side views showing the steps.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 Chip component mounting device 10 XYZ stage 20 Frame member 21 Opening 30 Semiconductor laser 40 Substrate 41 V groove 50 Solder bump

Claims (8)

[Claims] 1. A method of mounting a chip component, wherein a chip component to be mounted on a substrate is positioned and mounted at a predetermined mounting position on the substrate, wherein the chip component is located near a predetermined mounting position on the substrate. A chip component mounting method, wherein the chip is mounted at the predetermined mounting position by pushing the chip component and sliding the chip component on the substrate after the mounting. 2. The chip component mounting method according to claim 1, wherein the chip component is placed at a predetermined position on the substrate, and then the chip component and the substrate are joined by performing solder reflow. A chip component mounting method characterized by the above-mentioned. 3. A chip component mounting apparatus for positioning a chip component to be mounted on a substrate at a predetermined mounting position on the substrate and mounting the chip component, wherein the chip component is mounted near the predetermined mounting position on the substrate. A positioning jig for pushing a side surface of the chip component to slide on the substrate to move the chip to the predetermined mounting position, and a driving unit for moving the positioning jig. apparatus. 4. The chip component mounting apparatus according to claim 3, wherein the positioning jig is a frame-shaped member having an opening surrounding a periphery of a side surface of the chip component. apparatus. 5. The chip component mounting apparatus according to claim 3, wherein the side surface of the opening of the positioning jig has a tapered shape gradually expanding from the lower side to the upper side. apparatus. 6. The mounting device for a chip component according to claim 3, wherein the positioning jig has a plurality of projections each having an acute angle at the inner edge of the opening of the frame. An apparatus for mounting a chip component, comprising: 7. The chip component mounting apparatus according to claim 3, wherein the positioning jig includes a plurality of pins projecting below a member. apparatus. 8. The chip component mounting apparatus according to claim 3, wherein a plurality of the openings of the positioning jig are provided corresponding to the mounting position of the chip component. A chip component mounting method characterized by the above-mentioned.