JPH11293213A - Production of die attach paste - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a die attach paste for semiconductors, which is excellent in humidity-resistant adhesiveness, workability, storability, low-stress properties, and soldering-cracking resistance and can be cured even within a short time. SOLUTION: There is provided a process for producing a die attachment paste essentially consisting of (A) a urethane diacrylate or dimethacrylate obtained by reacting a hydroxylalkyl acrylic acid or methacrtylic acid with a lactone-modified diol, and a diisocyanate, (B) an acryl- or methacryl-modified polybutadiene, (C) a monoacrylate represented by the formula: CH2 =CHCOOR1 or a monomethacrylate represented by the formula: CH2 =CCH3 COOR1 (wherein R1 contains a 10C or higher substituent containing alicyclic and/or aromatic groups), (D) a phospho-containing acrylate or a phospho-containing methacrylate, (E) an alkoxysilane having an alicyclic epoxy group, (F) an organic peroxide and/or an azo compound, and (G) a silver powder, which process comprises: mixing components A to E, leaving the mixture to stand at 0-50 deg.C for 1 hr to 30 days, and adding components F and G to the mixture.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a semiconductor bonding (die attach) paste which is excellent in low stress, adhesion after moisture absorption (solder crack resistance), and rapid curing.

[0002]

2. Description of the Related Art With the recent spread of computers, the production volume of semiconductor packages has been increasing year by year, and reducing the manufacturing cost has become an important issue. In assembling a semiconductor package, there is a step of bonding a semiconductor (IC chip) and a lead frame with a die attach paste. In this step, time reduction and low-temperature curing are important requirements in order to increase production efficiency. As a method of curing the die attach paste, there are a batch oven method and a method of curing in-line (such as a hot plate). From the viewpoint of cost reduction, a method of curing in-line is spreading. When using a fast-curing paste prepared for in-line curing, the usual die mount (chip bonding) process is 150 ° C.
The reaction is performed at a temperature of from 30 to 60 seconds at a temperature of from 200 to 200 ° C. However, in the future, development of a paste that can be cured at a lower temperature and for a shorter time is desired.

On the other hand, as for the reliability of a completed package, solder crack resistance, particularly in a large chip, is important. Even when the package is exposed to a high temperature during solder bonding, cracks in the package caused by peeling of the die attach paste layer are reduced. In order to prevent this, the die attach paste is required to have particularly low stress properties and adhesion after moisture absorption treatment.

As a base resin of the die attach paste, a cyanate resin, a bismaleimide resin, and the like are known, mainly an epoxy resin. However, a paste cured in-line (for example, within 30 seconds) has a wire bonding temperature (about 250 ° C.). ), No material has been found that maintains the adhesive strength and maintains the properties suitable for solder crack resistance (low stress, adhesiveness after moisture absorption treatment, etc.).
Even if the properties could be satisfied, the viscosity of the paste at room temperature increased sharply (the pot life was short), and there were only materials that were not suitable for being provided as commercial products. As another resin, an acrylate resin (a general acrylate resin into which a urethane bond or the like is not introduced) has been proposed as a candidate. However, there is a problem that the cured product is brittle and the curing shrinkage is large. What could be used as was not obtained.

As a material of the lead frame, for example, 42
Metals such as alloys, copper, and nickel / palladium have become mainstream, but recently, BGA (ball grid array) packages have been increasingly used for higher performance computers. For this reason, the adhesion between the chip (semiconductor) and the solder resist (organic substrate) has been gaining considerable importance. In this case, the paste that is cured at 150 ° C. to 200 ° C. for 60 to 120 minutes has already been commercialized using an epoxy resin, but in the future, curing within 15 minutes is required to further improve productivity. As a result, new materials need to be developed.

[0006]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned drawbacks of acrylate resins, and provides quick curing, low stress, adhesion to frames of various materials, and adhesion after moisture absorption (solder crack resistance). ) Was attempted to develop a die attach paste excellent in the above.

[0007]

Means for Solving the Problems The present inventors have studied to improve such disadvantages of the acrylate resin, and as a result, based on an acrylate or methacrylate resin having a flexible and viscous urethane structure introduced therein, By mixing a specific reactive diluent, a specific coupling agent, and a polymerization initiator combination therewith, a die attach with excellent adhesiveness (rapid curing) and low stress to a metal frame or organic substrate. Successfully obtained the paste. Furthermore, by introducing a lactone-modified structure into the core structure as a soft segment structure of urethane acrylate, the adhesive strength was successfully maintained even after the moisture absorption treatment (85 ° C./85%), and the (meth) acrylate-modified butadiene was further added thereto. It has become possible to increase the hydrophobicity and to realize the solder crack resistance by the addition of the compound. However, even if all components of the adhesive are kneaded at the same time in the paste manufacturing process, the viscosity increases sharply after the paste is formed, and it is tested as a product for use in die attach applications that require an accurate coating amount for a long time. It is not possible. Therefore, as a result of trial and error, kneading in advance other than silver powder or (silver powder + polymerization initiator)
It is allowed to stand at a predetermined time / temperature, and the alicyclic epoxyalkoxysilane and the phosphoric acid group-containing (meth) acrylate are sufficiently reacted under a diluting condition. Then, the remaining components are mixed and kneaded. It was found that the increase in viscosity was suppressed by the method. Further, by adding a reactive diluent (component C), a non-reactive diluent (solvent), and a thixotropic agent to the resin component system which has been left still, the workability is increased while maintaining the adhesiveness (viscosity). And the resulting paste has excellent adhesiveness, low stress, solder crack resistance, and can be cured in a very short time. Since the present invention was found to be a touch paste, the present invention was completed.

That is, according to the present invention, the following components (A) to (G) are essential components, and the weight ratio of each component is represented by [a] to [f]. , 0 to 50 ° C for 1 hour to 30 days, and then adding component F and component G. (A) urethane diacrylate or methacrylate obtained by reacting hydroxyalkylacrylic acid or methacrylic acid, lactone-modified diol, and diisocyanate; (B) acrylic or methacryl-modified polybutadiene (C) monoacrylate represented by the general formula (1a) Or a monomethacrylate represented by the general formula (1b):
(D) a phosphoric acid group-containing acrylate represented by the general formula (2) or a phosphoric acid group-containing methacrylate represented by the general formula (3); (E) an alkoxysilane having an alicyclic epoxy group; (F) an organic peroxide And / or azo compound, and (G) silver powder

[0009]

Embedded image (In the formula, R ₁ : a substituent containing an alicyclic and / or aromatic group and having 10 or more carbon atoms)

[0010]

Embedded image (In the formula (2), a: 0 or 1, b: 1 or 2, c: 1 or 2, b + c =
3)

[0011]

Embedded image (In the formula (3), a: 0 or 1, b: 1 or 2, c: 1 or 2, b + c =
3)

[A] 4 ≦ A / B ≦ 100 [b] 0.3 ≦ (A + B) /C≦6.0 [c] 0.001 ≦ (D + E) / (A + B + C) ≦
0.05 [d] 0.1 ≦ D / E ≦ 10 [e] 0.001 ≦ F / (A + B + C) ≦ 0.05 [f] 0.60 ≦ G / (A + B + C + D + E + F +
G) ≦ 0.85

[0013]

DETAILED DESCRIPTION OF THE INVENTION Urethane acrylate (component A) used in the present invention is synthesized by a reaction of hydroxyalkylacrylic acid, lactone-modified diol, and diisocyanate in a conventional manner.

Examples of hydroxyalkylacrylic acids include 2-hydroxyethyl acrylate or methacrylate, 2-hydroxypropyl acrylate or methacrylate. Examples of the lactone-modified diol include poly (ε-caprolactone) diol and a copolymer of alkylene glycol (for example, ethylene glycol, propylene glycol, etc.) and ε-caprolactone. Examples of diisocyanates include hexamethylene diisocyanate, isophorone diisocyanate, toluene diisocyanate and hydrogenated products thereof.

Examples of the component B include Nisseki polybutadiene: MAC-1000-80 (modified with acrylate), MM-1000-80 (modified with methacrylate) and the like (manufactured by Nippon Petrochemical Co., Ltd.).

The mixing ratio of component A to component B is 4 ≦ A / B ≦ 1
It must be 00. If the ratio is less than 4, the curability of the paste becomes extremely poor, and the cured product becomes brittle. Conversely 10
If it exceeds 0, the moisture-resistant adhesiveness decreases.

The components A and B have high viscosities, so that even if they are pasted, the coating workability is poor and they are not suitable for practical use. Therefore, a mono (meth) acrylate containing one (meth) acryl group is added as a reactive diluent. Further, the mono (meth) acrylate used in the present invention has the formula (1a)
Or (1b), wherein the substituent R ₁ is an alicyclic group,
And / or contains an aromatic group and the total number of carbon atoms in the substituent R ₁ is 1
It is essential that the number is zero or more. By satisfying this condition, not only the effect as a diluent but also the presence of a bulky substituent can suppress shrinkage during curing, thereby improving the bonding reliability of the interface. In the case of a substituent having 10 or more carbon atoms which does not contain an alicyclic or aromatic group, curing shrinkage can be reduced, but the adhesiveness is undesirably reduced due to the characteristics of the aliphatic hydrocarbon. As an example of the mono (meth) acrylate, R _{1 in} the general formula (1a) or (1b) is

[0018]

Embedded image

And the like. One or more of them can be blended and added.

The ratio of the component C to the components A and B is preferably 0.3 ≦ (A + B) /C≦6.0. If it is less than 0.3, the crosslinking density is extremely reduced, and the adhesive strength at the time of heating is reduced. On the other hand, if it exceeds 6.0, the viscosity becomes too high, and the coating workability deteriorates, which is not preferable.

The alkoxysilane containing an alicyclic epoxy group is, for example, KBM-3 manufactured by Shin-Etsu Chemical Co., Ltd.
03 and the like are known. The total amount of the components D and E is 0.001 ≦ (D + E) / to the total weight of the components A to C.
It is preferable that (A + B + C) ≦ 0.05. 0.
If it is less than 001, no effect is exerted on the adhesiveness, and if it is more than 0.05, the viscosity is remarkably increased with the reaction between the components D and E, and the adhesiveness is rather decreased.

In the present invention, component D and component E are essential components, and the present invention cannot be realized even if one of them is used.
The composition ratio is preferably 0.1 ≦ D / E ≦ 10. 0.1
If it is lower than the above, the concentration of the alkoxysilane becomes low, and the effect on the adhesive interface is lowered. On the other hand, if it exceeds 10, the phosphoric acid group concentration becomes too high and acts on the bonding interface more than necessary, thereby lowering the adhesiveness.

The effects of the components D and E are presumed to be that when they are mixed, the alicyclic epoxy is polymerized, an oligomer having an alkoxysilane in the side chain is formed, and the adhesion to the interface is strengthened. You.

Next, examples of organic peroxides include cumyl peroxyneodecanate, t-butylperoxyneodecanate, 1-cyclohexyl-1-methylethylperoxyneodecanate, 1,1,3 , 3-Tetramethylbutylperoxyneodecanate, 1,1,3,3-
Tetramethylbutylperoxy-2-ethylhexanate, bis (4-butylcyclohexyl) peroxydicarbonate, t-butylperoxyisopropylmonocarbonate, 1,1-bis (t-butylperoxy)-
3,3,5-trimethylcyclohexane, t-butylperoxybenzoate, t-butylperoxy 3,5
5-trimethylhexanate, t-butylperoxy-
Examples include 2-ethylhexyl monocarbonate and t-hexylperoxy-2-ethylhexanate. Examples of azo compounds include 2,2′-azobisisobutyronitrile and 1,1′-azobis (1-acetoxy). -1-phenylethane) and the like.

These organic peroxides and / or azo compounds may be used alone or in combination of two or more to control curability. Further, various polymerization inhibitors can be added in advance in order to improve the storage stability of the resin.

The amount of the organic peroxide and / or azo compound to be added is 0.001 ≦ F / (A + B + C) ≦
It is preferably 0.05. If the amount is less than 0.001, the curing speed becomes low. If the amount is more than 0.05, the adhesive strength is lowered due to the reaction between the organic peroxides and / or the azo compounds, and the pot life of the paste is deteriorated.

Next, as an example of the silver powder, a flake shape is preferable, and further, the average particle size is 0.5 μm to 15 μm.
m is preferred. If the average particle size is smaller than 0.5 μm, the product viscosity increases, and kneading with a roll or the like becomes impossible. If the average particle size is larger than 15 μm, nozzle clogging during paste application using a dispenser or the like, or an adhesive layer Is difficult to control, which is not preferable. The amount added is preferably in the range of 60% by weight to 85% by weight based on the total paste. When it is less than 60%, the volume resistivity increases, and when it exceeds 85%, the paste viscosity increases,
It is not preferable in application workability.

As for the component C, the viscosity after the formation of the paste is reduced and the workability is improved when the component C is added in two divided portions rather than before all the components are allowed to stand. As a ratio of the division, it is desirable to add 50 to 95% by weight of the total added amount of the component C before the standing, and to add the rest after the standing. If it is less than 50%, the viscosity of the standing resin system becomes extremely high, and a sufficient standing effect cannot be obtained. Conversely, if it exceeds 95%, there is no point in dividing. More preferably, the amount added before standing is 8
It is good to make it about 0%.

The addition amount of the solvent is preferably 7% or less of the total addition amount of the components A to F. If added more than this, the curability deteriorates and the adhesive strength is extremely reduced. Examples of the solvent include ethylene glycol-mono-n-butyl ether acetate and the like.

The amount of the thixotropic agent to be added is as follows:
5% or less of the total addition amount of the component F is desirable. Addition of more than that increases the paste viscosity too much and extremely reduces the adhesive strength. Examples of thixotropic agents include Nippon Aerosil Co., Ltd., an inorganic (silica) thixotropic agent.
Manufactured by Aerosil and Kyoeisha Chemical Co., Ltd., which is an organic thixotropic agent.

In the resin paste of the present invention, additives such as an antifoaming agent and a surfactant can be used if necessary.
Furthermore, it is also possible to add a monofunctional (meth) acrylate and / or a bifunctional (meth) acrylate having a structure different from that of the component C for adjusting (decreasing) the viscosity (workability). These are generally lower in viscosity than component C,
Examples include lauryl acrylate, 1,6-hexanediol diacrylate, and the like. The lactone-modified urethane acrylate alone has a very high viscosity and is difficult to handle. Therefore, the number of raw materials that have been diluted with a small amount of the low-viscosity acrylate in advance is increasing at present.

Hereinafter, the present invention will be described specifically with reference to Examples.

[0033]

EXAMPLES Example 1 Urethane diacrylate consisting of diol obtained by reaction of hydroxyethyl acrylate, ε-caprolactone and ethylene glycol, isophorone diisocyanate (however, containing 12% of 1,6-hexanediol diacrylate as a diluent) 38 parts by weight of methacryl-modified polybutadiene (MM-1000-80, manufactured by Nippon Petrochemical Co., Ltd.) 2 parts by weight of nonylphenol propylene oxide-modified monoacrylate (manufactured by Daicel UCB Co., Ltd., EB-284) Toagosei Co., Ltd., M-117) 20 parts by weight Phenoxydiethylene glycol monoacrylate (Shin Nakamura Chemical Co., Ltd., AMP-20GY) 20 parts by weight Phosphate group-containing methacrylate (Nippon Kayaku Co., Ltd.) KAYAMER, PM-2 ) 0.8 parts by weight of alicyclic epoxy alkoxysilane (Shin-Etsu Chemical (Co.), KBM-303) 0.4 parts by weight

The above-mentioned raw materials are kneaded with three rolls to form a transparent uniform viscous solution, and then allowed to stand in a thermostat at 25 ° C. for 24 hours. The following raw materials are added to the obtained solution. Nonylphenol propylene oxide-modified monoacrylate (manufactured by Toagosei Co., Ltd., M-117) 5 parts by weight Phenoxydiethylene glycol monoacrylate (Shinnakamura Chemical Industry Co., Ltd., AMP-20GY) 5 parts by weight Organic peroxide initiator (Nippon Oil & Fats Co., Ltd., Parkmill ND) 1.2 parts by weight Solvent (Tokyo Kasei Co., Ltd., ethylene glycol mono-n-butyl ether acetate) 2 parts by weight Thixoregulator (Nippon Aerosil Co., Ltd.) Octylsilane surface-treated Aerosil (R-805)) 0.8 parts by weight After all of the above-mentioned raw materials were added, the mixture was immediately kneaded again with a three-roll mill, and 25 parts by weight of the obtained solution (referred to as varnish) was mixed with silver powder ( Mix 65 parts by weight of Degussa SF-65) and 10 parts by weight of silver powder (TCG-1 manufactured by Tokurika Chemical Laboratory Co., Ltd.) Disperse and knead with a roll. Subsequently, a degassing treatment was performed under vacuum to obtain a silver paste.

The viscosity of the obtained silver paste was measured at 2.5 rpm using an E-type rotational viscometer (after that, the viscosity was measured).
The viscosity was measured over time, and the time until the viscosity increased by 15% was measured. That is, the longer the time, the longer the pot life and the higher the practicality. ). Further, a 6 mm square chip was mounted after applying the obtained silver paste to a 42 alloy frame, and cured on a hot plate (175 ° C., 40 seconds).
Adhesive strength was measured at room temperature (25 ° C) and hot (250 ° C) by an automatic shear strength measuring device (D-100, BT-100).
It measured using. Further, the adhesion to the organic substrate was measured in exactly the same manner. A solder resist (manufactured by Taiyo Ink Co., Ltd., PSR-4000 / CA-) is formed on a bismaleimide-triazine (BT) resin substrate as an organic substrate.
40) was used. The paste was cured in an oven (170 ° C. for 15 minutes).

As a result, at both the 42 alloy frame and the organic substrate, the wire bonding temperature (about 250
) Or at 85 ° C after curing and 85% RH treatment, it was confirmed that sufficient adhesive strength could be obtained, and no chip peeling was observed even with an ultrasonic flaw detector (see Table 1). 2).

Other evaluation methods Peeling after wire bonding: 6 m on lead frame
A chip of 15 mm in size was cured after mounting, and wire bonding was performed at 250 ° C., and the presence or absence of peeling of the chip was observed.

Warpage value: Measured as an evaluation of low stress.
6mmX15mmX0.
175 ° C using a 3 mm silicon chip with paste,
The paste was adhered so that the thickness of the paste became 20 μm in 40 seconds, the displacement of the chip in the longitudinal direction was measured using a contact type surface roughness meter, and the warpage value was measured based on the height difference.

Solder crack resistance: Sumicon EME-73
Using a sealing material of No. 20 (manufactured by Sumitomo Bakelite Co., Ltd.), a package molded under the following conditions was subjected to a water absorption treatment at 85 ° C. and a relative humidity of 85% for 168 hours, followed by IR reflow (240 ° C., 10 seconds × 3 times) ), The number of internal cracks was measured by cross-sectional observation and used as an index of solder crack resistance.

Package: 80pQFP (14X20X)
2mm) Chip size: 7.5 x 7.5mm (Aluminum wiring only) Lead frame: 42 alloy Molding: 175 ° C, 2 minutes Post mold cure: 175 ° C, 4 hours Total package number: 12 Total evaluation: Can be used as die attach paste The sample was evaluated as ○ and the unusable sample was evaluated as ×.

Examples 2 to 5 and Comparative Examples 1 to 9 Except for the compositions and conditions shown in Tables 1 and 3, a silver paste was obtained in exactly the same manner as in Example 1, and its characteristics were evaluated.
The results are as shown in Tables 2 and 4.

[0042]

[Table 1]

[0043]

[Table 2]

[0044]

[Table 3]

[0045]

[Table 4]

Description of Compounds in Table Urethane acrylate 1: Urethane diacrylate comprising diol obtained by reaction of hydroxyethyl acrylate, ε-caprolactone and ethylene glycol, isophorone diisocyanate (however, 1,6-hexanediol is used as a diluent) EB-2 (containing 12% diacrylate) (manufactured by Daicel UCB)
84) Methacryl-modified butadiene: manufactured by Nippon Petrochemical Co., Ltd.
MM-1000-80

[0047]

Embedded image

Component D: a = 1, b in the general formula (3)
= 1, C = 2 Component E: Alicyclic epoxy group-containing alkoxysilane (KBM-303, manufactured by Shin-Etsu Chemical Co., Ltd.) Polymerization initiator 1: Cumyl peroxyneodecanate (Nippon Oil & Fats Co., Ltd.) Polymer Initiator 2: Wako Pure Chemical Industries, Ltd., 2,2'-azobisisobutyronitrile silver powder 1: Degussa, SF-6
5 (average particle size: 11 μm) Silver powder 2: TCG-1 (average particle size: 2 μm) manufactured by Tokurika Chemical Laboratory Co., Ltd. Solvent 1: manufactured by Tokyo Chemical Industry Co., Ltd., ethylene glycol-mono-n-butyl ether Acetate thixotropic agent 1: Nippon Aerosil Co., Ltd., octylsilane surface-treated Aerosil (R-805)

[0049]

According to the present invention, it is possible to complete a paste excellent in moisture-resistant adhesiveness (both metal frames and resist substrates), solder crack resistance, workability, and storability, in addition to fast curing and low stress. succeeded in.

Claims (14)

[Claims] 1. A die attach paste having the following components (A) to (G) as essential components, and the weight ratio of each component is represented by [a] to [f]. 5
Component F and Component G after allowing to stand at 0 ° C. for 1 hour to 30 days
And a method for producing a die attach paste. (A) urethane diacrylate or methacrylate obtained by reacting hydroxyalkylacrylic acid or methacrylic acid, lactone-modified diol, and diisocyanate; (B) acrylic or methacryl-modified polybutadiene (C) monoacrylate represented by the general formula (1a) Or a monomethacrylate represented by the general formula (1b):
(D) a phosphoric acid group-containing acrylate represented by the general formula (2) or a phosphoric acid group-containing methacrylate represented by the general formula (3); (E) an alkoxysilane having an alicyclic epoxy group; (F) an organic peroxide And / or azo compound, and (G) silver powder (Wherein, R _{1 is} a substituent having an alicyclic and / or aromatic group and having 10 or more carbon atoms) (In the formula (2), a: 0 or 1, b: 1 or 2, c: 1 or 2, b + c =
3) (In the formula (3), a: 0 or 1, b: 1 or 2, c: 1 or 2, b + c =
3) [a] 4 ≦ A / B ≦ 100 [b] 0.3 ≦ (A + B) /C≦6.0 [c] 0.001 ≦ (D + E) / (A + B + C) ≦
0.05 [d] 0.1 ≦ D / E ≦ 10 [e] 0.001 ≦ F / (A + B + C) ≦ 0.05 [f] 0.60 ≦ G / (A + B + C + D + E + F +
G) ≦ 0.85 2. The composition according to claim 1, wherein (A) to (G) described in claim 1 are essential components, and the weight ratio of each of the components is [a] to [a].
In the die attach paste represented by [f], after blending the components A to F, the mixture is allowed to stand at 0 to 50 ° C. for 1 hour to 30 days, and then the component G is added. Method. 3. The die attach paste according to claim 1, wherein (A) to (G) according to claim 1 are essential components, and the total weight ratio of each of the components is represented by [a] to [f]. After blending the components A to E, 1 hour to 3 hours at 0 to 50 ° C.
After allowing to stand for 0 days, Component C is added again, and Component F is added.
And a component G are added. 4. The die attach paste according to claim 1, wherein (A) to (G) according to claim 1 are essential components, and a total weight ratio of each of the components is represented by [a] to [f]. After blending the components A to F, 1 hour to 3 hours at 0 to 50 ° C.
A method for producing a die attach paste, comprising allowing component C and component G to be added again after allowing to stand for 0 days. 5. The die attach paste according to claim 1, wherein (A) to (G) according to claim 1 are essential components, and a total weight ratio of each of the components is represented by [a] to [f]. After blending the components A to E, 1 hour to 3 hours at 0 to 50 ° C.
A method for producing a die attach paste, comprising, after leaving still for 0 days, adding Component C again and adding a non-reactive diluent, Component F and Component G. 6. The die attach paste according to claim 1, wherein (A) to (G) according to claim 1 are essential components, and the total weight ratio of each of the components is represented by [a] to [f]. After blending the components A to F, 1 hour to 3 hours at 0 to 50 ° C.
A method for producing a die attach paste, comprising, after leaving still for 0 days, adding Component C again and adding a non-reactive diluent and Component G. 7. The die attach paste according to claim 1, wherein (A) to (G) according to claim 1 are essential components, and a total weight ratio of each of the components is represented by [a] to [f]. After blending the components A to E, 1 hour to 3 hours at 0 to 50 ° C.
A method for producing a die attach paste, comprising adding Component C again after allowing to stand for 0 days, and adding a non-reactive diluent, a thixotropic agent, Component F and Component G. 8. The die attach paste according to claim 1, wherein (A) to (G) according to claim 1 are essential components, and a total weight ratio of each of the components is represented by [a] to [f]. After blending the components A to F, 1 hour to 3 hours at 0 to 50 ° C.
A method for producing a die attach paste, comprising adding Component C again after allowing to stand for 0 days, and adding a non-reactive diluent, a thixotropic agent, and Component G. 9. The die attach paste according to claim 1, wherein (A) to (G) according to claim 1 are essential components, and a total weight ratio of each of the components is represented by [a] to [f]. Component A, Component B, Component D, Component E and Component C After blending 50 to 95% by weight of the total amount of Component C, leave at 0 to 50 ° C for 1 hour to 30 days, then add the remaining Component C And a non-reactive diluent, a thixotropic agent, a component F and a component G. 10. The die attach paste according to claim 1, wherein (A) to (G) according to claim 1 are essential components, and a total weight ratio of each of the components is represented by [a] to [f]. After blending Component A, Component B, Component D, Component E, Component F and Component C in an amount of 50 to 95% by weight based on the total amount of the components added,
A method for producing a die attach paste, comprising adding a non-reactive diluent, a thixotropic agent, and a component G while adding the remaining component C after allowing to stand at 50 ° C. for 1 hour to 30 days. 11. The lactone-modified diol in component A,
A lactone-modified diol obtained by reacting ε-caprolactone with an alkylene glycol.
0. The method for producing a die attach paste according to any one of items 0 to 10. 12. The component G has an average particle size of 0.5 to 15 μm.
The method for producing a die attach paste according to any one of claims 1 to 11, wherein 13. The addition amount of the non-reactive diluent is 7% by weight or less based on the total addition amount of the components A to F.
The method for producing a die attach paste according to any one of items 10 to 10. 14. The amount of the thixotropic agent added is 5% by weight or less based on the total amount of the components A to F added.
0. The method for producing a die attach paste according to any one of items 0 to 10.