JPH11256346A - Formation of partial plating film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a partial plating film capable of forming a plating film only on the part requiring plating in the surface of a substrate made of resin by using a resin plating method without depending on a vacuum deposition method. SOLUTION: In the method for forming a partial plating film where, of the surface of a substrate 1 made of resin having an objective part A to be subjected to plating, only on the surface of the objective part A, a plating film is formed, a chemical plating film 10 is formed on the surface of the substrate 1, next, an electrode is applied (erectrically energized) to a part B other than the objective part A to form an electrical plating film 11 on the surface of the chemical plating film 10, thereafter the objective part A is covered by a covering means 12, then, the substrate 1 is subjected to etching treatment, and only the chemical plating film 10 and electrical plating film 11 of the objective part A are made left.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a partial plating film on a surface of a resin substrate, which requires plating only on a portion of the substrate that requires plating.

[0002]

2. Description of the Related Art In recent years, in the case of home electric appliances, particularly portable electric appliances, the weight of the apparatus has been required to increase the added value of the products, and resin parts have been used frequently. .

[0003] Of these resin parts, the one shown in FIG. 2 includes a plurality of flexible parts 1 extending from a main body 1 a of a base 1.
b,… is a part with columnar operation buttons 1c,…
It is attached to the operation unit of the device. That is, only the operation buttons 1c,... Are exposed to the outside from the operation unit of the apparatus in a state where the parts are assembled to the apparatus, and the user of the apparatus presses the operation buttons 1c,. Perform the operation.

In such components, since the operation buttons 1c,... Are visible from the outside, it is common practice to apply a plating process to the operation buttons 1c,. However, a point to be noted in the plating process is that the operation buttons 1c,... Are prevented in order to prevent static electricity and the like charged to the user from being conducted to the inside of the apparatus through the plating layer and damaging the electronic components. Need only be partially plated on the surface.

Therefore, conventionally, a vacuum deposition method and a sputtering method have been used as a method of partially plating.

[0006]

However, in the above-mentioned vacuum evaporation method and the like, the adhesion of the film to the resin base 1 is poor. It is necessary to paint, but due to this base coating, the surface pattern of the operation button 1c composed of hairline, diamond cut, sand blast etc. disappears, and the problem that the appearance of the surface of the operation button 1c is lost is lost. there were.

Further, since the vapor-deposited plating film has low strength against friction, there is a problem that the vapor-deposited plating film is peeled off by using the apparatus.

In order to solve such a problem, a resin plating method which does not require a base coat and has a high strength against friction (a method in which a resin substrate is subjected to a chemical plating process and then subjected to an electroplating process). However, such a method has a problem that the operation becomes very complicated since it is necessary to individually plate the plurality of operation buttons 1c,....

Furthermore, when performing electroplating, it is necessary to apply an electrode to each of the operation buttons 1c for electrical conduction. However, the electrode leaves a scratch on the plating film, and this part, and eventually this part, is assembled. There is also a problem that the commercial value of the device is reduced.

Therefore, the present invention has been made in view of the above-mentioned problems, and requires plating on the surface of a resin substrate using a resin plating method without using a vacuum deposition method or the like. It is an object of the present invention to provide a partial plating film forming method capable of forming a plating film only on a part.

[0011]

In order to solve the above-mentioned problems, a method for forming a partial plating film according to the present invention is directed to a method for forming a partial plating film on a surface of a resin base 1 having a target portion A to be plated. In the method of forming a partial plating film only in which a plating film is formed only on the surface of the
After forming the electroplating film 11 on the surface of the chemical plating film 10 by applying a site B other than the target site A, the target site A is covered by the coating means 12, and then the substrate 1 is etched to cover the target area A
Characterized in that only the chemical plating film 10 and the electroplating film 11 are left.

In the method for forming a partial plating film having the above structure, first, a chemical plating treatment is applied to the substrate 1 to form a chemical plating film 10 on a target portion A on the substrate 1 and a portion B other than the target portion A. I do.

Next, an electrode is applied to a portion B other than the target portion A and applied (electrical conduction), and the base 1 is subjected to an electroplating process to form an electroplating film 11 on the surface of the chemical plating film 10.

Thereafter, the target portion A is covered with the coating means 12 to protect the surface of the electroplating film 11 at the target portion A.

Finally, the substrate 1 is subjected to an etching treatment to dissolve the coated chemical plating film 10 and the electroplated film 11 on the portion B other than the target portion A, and to cover the coated chemical plating film on the target portion A. Only 10 and the electroplating film 11 are left.

When a plurality of target portions A are present on the base 1, the base 1 is first subjected to a chemical plating treatment so that the target portions A,. By forming the chemical plating film 10 so as to be continuous with the portion B, the target portions A,.

Next, an electrode is applied to a part B other than the target parts A,... (Electric conduction), and the base 1 is subjected to an electroplating treatment to form an electroplating film 11 on the surface of the chemical plating film 10. I do.

Thereafter, the target portions A,.
To protect the surface of the electroplated film 11 at the target portions A,.

Finally, the base 1 is subjected to an etching treatment to dissolve the chemical plating film 10 and the electroplating film 11 in the portions B other than the covered target portions A,. Chemical plating film 10 and electroplating film
Only 11 remains.

Here, in the above-described coating step, the jig 2 is constructed such that only the target portion A of the base 1 is exposed to the outside. Then, only the target portion A is exposed, and a coating film is formed on the surface of the target portion A by spray painting in such a state, and the coating means 12 is used to cover the target portion A. can do.

Further, as described in claim 3, the substrate 1 is accommodated in the jig 2 so that only the target portion A is exposed, and in this state, a coating film is formed on the surface of the target portion A by electrostatic coating. It is also possible to adopt a method in which the target portion A is formed as a coating means 12 by forming the target portion.

Further, as described in claim 4, the target site A
The cap is externally fitted to the
A method of coating A can also be adopted.

Further, as described in claim 5, a coating film is formed on the surface of the target portion A by immersing the target portion A of the substrate 1 in the coating body 15 housed in the container 14. As 12, the method of covering the target portion A can be adopted.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the method for forming a partial plating film according to the present invention will be described below with reference to FIG.
In FIG. 1, the base 1 is represented by a cube as an abstract concept, but specifically, an apparatus component as shown in FIG. That is, a plurality of flexible portions 1b extending from the main body 1a of the base 1 have columnar operation buttons 1c,.
An apparatus component provided with is a target object in the present embodiment.
Therefore, in the present embodiment, the plurality of operation buttons 1c,
Are target portions A requiring plating, and the main body portion 1a and the flexible portion 1b are portions B other than the target portion A.

First, in the chemical plating step, the substrate 1 is immersed in a chemical plating solution to form a chemical plating film 10 on the entire surface of the substrate 1.

Next, in the electroplating step, the base 1 is immersed in the electroplating solution, and the main body 1a of the base 1 is formed.
An electrode is applied to the substrate to make electrical conduction, and an electroplating film 11 is formed on the surface of the chemical plating film 10. As a result, the portion of the main body 1a of the base 1 where the electrode is applied is not formed with the electroplating film 11, but remains as a scratch.

Next, the coating step is started. The details of this step will be described later. In this step, the coating 12 is formed on the surface of the electroplating film 11 for the operation button 1c, while the surface of the electroplating film 11 is exposed for the main body 1a and the flexible portion 1b. I do.

In the etching step, the substrate 1
Is immersed in an etching solution, the electroplating film 11 and the chemical plating film 10 on the surface of the operation button 1c are protected by the coating film 12 and escape from dissolution, while the main body 1a and the flexible portion
The electroplating film 11 on the surface of 1b is dissolved by an etching solution, then the chemical plating film 10 is dissolved by the etching solution, and the surface of the substrate 1 is exposed, that is, the electroplating film 11 on the surface of the operation button 1c and Chemical plating film 10
Only the remaining state.

Finally, in a peeling step, the substrate 1 is immersed in an alkaline solution as a peeling agent to dissolve and peel off the coating film 12 coated on the surface of the operation button 1c.

Through the above steps, as shown in FIGS. 2 and 3, the plating films 10, 11 can be formed only on the plurality of operation buttons 1c,.

Next, the coating step of the method for forming a partial plating film in the present embodiment will be described below with reference to FIG. Reference numeral 2 denotes a jig for housing and holding the base 1, and the jig 2 includes a box-shaped housing 3 for housing the base 1 and the housing
The cover 4 is formed by inserting pins 6, 6 projecting from the lower surface of the cover 4 into holes 3a, 3a formed in the container 3. Can be fixed to the container 3.

The cover 4 has an operation button 1 on the base 1.
At positions corresponding to c, ..., insertion holes 5, ... through which the operation buttons 1c, ... can be inserted are formed. The insertion holes 5, ...
The reason for forming the stepped surface 4b in which a part 5,5 is formed lower than the upper surface 4a is that the operation button 1c,
This is due to the difference in height. That is, the prismatic operation button 1c of the base 1 is formed at a position lower than the columnar operation button 1c.

Therefore, after the base 1 is accommodated in the housing 3, the lid 4 is attached to the housing 3 from above.
Only the operation buttons 1c,... Of the base 1 are exposed to the outside of the jig 2 through the insertion holes 5,.

The jig 2 in the above-mentioned state is attached to the support conveyed while rotating, and the jig 2 is spray-painted in the process of conveying the support.

Therefore, the jig 2 is spray-painted while rotating, so that the operation buttons 1c, 1c,
A uniform coating film is formed on the surface of
The electroplating film 11 on the surface of 1c,.

Although the method for forming a partial plating film according to the present embodiment is used as described above, the method for forming a partial plating film according to the present invention is not limited to the above embodiment. That is, in the above embodiment, the case where the target portion A to be subjected to the plating process is a plurality of portions has been described.
Even if there is only one target site A, the same effect can be obtained.

The electroplating film 11 may have not only a single-layer structure but also a two-layer or multilayer structure in which layers having different plating materials are superposed.

The coating step in the above embodiment is not limited to the above. That is, in the above embodiment, the coating film is formed by spray coating, and the coating film is used as the coating means. However, the coating means is not limited thereto, and the coating film is formed by electrostatic coating, and the coating film is formed. May be used as the covering means.

Further, a negative type photoresist film is formed on the surface of the substrate 1 before assembling to the jig 2, and thereafter, the substrate 1 is assembled to the jig 2 and exposed.
The chemical resistance of only the photoresist film on the surface of the operation buttons 1c,… is increased, and the photoresist film other than the surface of the operation buttons 1c,… is dissolved by a chemical, so that the surface of the operation buttons 1c,… The photoresist film may be left and used as the coating means.

Further, a positive type photoresist film is formed on the surface of the substrate 1, and thereafter, a portion other than the operation buttons 1c,. The photoresist film on the surface of 1c,... May be left and used as a coating means. At this time, it is necessary to provide a jig so that only the operation buttons 1c,... Are not exposed.

Further, regardless of the jig 2, the operation buttons
A cap may be externally fitted to 1c, and this may be used as covering means. Even with such a cap, the operation button 1c
And the surface of the substrate 1 can be clearly divided into a portion requiring plating and a portion not requiring plating, so that a partial plating film having a clear boundary line and a good finish can be obtained. Can be formed.

Further, as another method of coating, as shown in FIG. 5, the coating 15 as coating material accommodated in a container 14,
By dipping the operation button 1c of the base 1, the paint 15 may be applied only to the operation button 1c, and this coating film may be used as the coating means. At this time, since the prismatic operation button 1c of the base 1 is formed at a lower position than the columnar operation button 1c, the height difference of the partition line by the covering means is h.
In order to cope with this, the height difference H of the container 14 is set to be the same as the height difference h. Therefore, by providing a plurality of containers 14,... Corresponding to the respective positions of the operation buttons 1c,... And the respective height differences, the plurality of operation buttons 1c,. In addition, container 14
The paint 15 is supplied to the container 14 by a pump 16 in a fixed amount in order to prevent the volume of the paint 15 from decreasing and the surface position of the paint 15 from lowering. In addition, as an application body, paint 15
However, the present invention is not limited to this, and any substance that can adhere to and cover the surface of the operation button 1c, such as wax, liquid resin, or the like, can be used.

Further, in the above-described embodiment, the peeling step is performed last. However, for example, in order to prevent corrosion of the plating film when the plating material is easily corroded such as copper, For the purpose of giving a color tone to the appearance using a chromatic paint, the peeling step is omitted and the coating film is left as it is.

In the case of peeling the coating film, the release agent is not limited to the above-mentioned alkaline solution, and any agent capable of dissolving and peeling the coating film can be used.

[0045]

As described above, according to the method for forming a partial plating film according to the present invention, the plating film is formed only on the target portion of the surface of the resin base, which requires plating, without using the vacuum evaporation method. In addition, since this plating is performed by chemical plating and electroplating, it is not necessary to apply a base coating to the base, and therefore, the target portion which is constituted by hair lines, diamond cuts, sand blasts, etc., and has a beautiful appearance. It can appear on the surface of the plating film without losing the surface pattern.

Further, the method for forming a partial plating film according to the present invention does not perform chemical plating and electroplating for each target portion requiring plating, but performs plating treatment on a plurality of target portions collectively. Therefore, the working efficiency can be improved, and the occurrence of scratches on the plating film, which lowers the commercial value of the component, can be suitably prevented.

Further, in the method for forming a partial plating film according to the present invention, since only the plating film at the target portion is suitably protected by the covering means, the boundary line is reliably formed only at the target portion. Can be formed, and the commercial value as a plated product can be enhanced.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a method for forming a partial plating film according to an embodiment of the present invention.

FIG. 2 is a perspective view of an object of the method for forming a partial plating film of the embodiment.

FIG. 3 is a sectional view taken along line PP of FIG. 2;

FIG. 4 is a perspective view showing a state in which an object of the method for forming a partial plating film is mounted on the jig in the coating step of the embodiment.

FIG. 5 is a front view showing a state of a coating step according to another embodiment.

[Explanation of symbols]

1 ... substrate, A ... target site, 2 ... accommodation jig, 10 ... chemical plating film, 11 ... electroplating film, 12 ... coating means

Claims (5)

[Claims] In a method for forming a partial plating film on a resin-made substrate (1) having a target portion (A) to be plated, a plating film is formed only on the surface of the target portion (A). A chemical plating film (10) is formed on the surface of (1), and then a part (B) other than the target part (A) is applied to apply the chemical plating film (1).
After the electroplating film (11) is formed on the surface of (0), the target portion (A) is covered by the covering means (12), and then the substrate
(1) A method for forming a partial plating film, characterized by leaving only the chemical plating film (10) and the electroplating film (11) of the covered target portion (A) by etching. 2. The coating means (12) is a jig configured so that only a target portion (A) of the base (1) is exposed to the outside.
The method for forming a partial plating film according to claim 1, wherein the coating is formed by spray coating after accommodating the substrate (1) in (2). 3. A jig configured so that only the target portion (A) of the base (1) is exposed to the outside.
2. The method for forming a partially plated film according to claim 1, wherein the film is a film formed by applying the electrostatic coating after accommodating the substrate (1) in (2). 4. The method according to claim 1, wherein said coating means is a cap externally fitted to a target portion of said base. 5. The coating means (12) comprises a coating film formed by immersing the target portion (A) of the substrate (1) in an application body (15) contained in a container (14). The method for forming a partial plating film according to claim 1.