JPH11252867A - Resin molded circuit board and its manufacture, electrical machinery and apparatus provided with resin molded circuit board and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin molded circuit board, wherein resin is virtually prevented from sneaking into a soldered portion and circuit parts can be mounted later and connected by an automatic machine. SOLUTION: This resin molded circuit board 3 is formed by forming an insulating resin 10 a trench-shaped recess 18 for circuit part installation on the soldering face 9 side, where the circuit parts of a circuit board 8 are to be mounted for exposing the soldering face 9, providing holding holes 19 for holding the circuit board 8 by clamping on the side opposite to the recess 18, and resin-molding the entire workpiece using insulating resin 10 so that the circuit parts can be later installed to the soldering face 9 using the recess 18.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-molded circuit board to which a circuit component is to be retrofitted, a method of manufacturing the same, an electric apparatus having a resin-molded circuit board to which a circuit component is retrofitted, and a method of manufacturing the same.

[0002]

2. Description of the Related Art There are various types of resin-molded circuit boards and electric devices using the same. For example, a resin-molded circuit board embedded in a resin together with a circuit component on which a circuit board is mounted for waterproofing and insulation, or a resin-molded circuit board in which a charged portion of the mounted circuit component is embedded in the resin together with the circuit board. Further, as an electric apparatus provided with a resin-molded circuit board, there is, for example, a molded electric motor disclosed in Japanese Utility Model Laid-Open No. Hei 6-77458. As shown in FIG. 8, a stator 2 of a motor of this type includes a stator core 5 formed by laminating a plurality of ring-shaped cores 4 of the same shape and size.
And a winding 6 wound on the stator core 5 and a stator core 5 for electrically connecting the winding 6 to the lead wire 7 in a direction in which the stator core 5 is laminated. And a circuit board 8 disposed at a predetermined position, and the outer periphery of the circuit board 8 leaves the soldering surface 9 of the circuit board 8 on the soldering side.
0 is resin-molded. On the center line of the stator 2, a rotating shaft 11 is rotatably supported by bearings 12, and a rotating yoke 13 is fitted to the rotating shaft 11, and a rotor core integrated with the rotating yoke 13 is fixed. Child iron core 5
And a gap is maintained.

[0003] The stator 2 of the mold motor having the above-described structure.
Conventionally, the resin mold using the insulating resin 10 is composed of a fixed mold 40 and a movable mold 4 as shown in FIG.
It has been carried out using a separate resin mold.
On the movable side mold 41 of the resin mold, a reference surface 24 on which a stator (hereinafter also referred to as a work) 42 as an assembly before molding is provided, and a protrusion 25 for forming one bearing holding portion is provided. It is provided on the end face. The fixed side mold 40 has a protruding portion 27 for molding the other bearing holding portion, and a circuit board 8.
And a holding surface 28 corresponding to one side of the holding member 28 are provided. A molding space that forms the outer periphery of the resin mold portion of the stator 2 is formed in the resin mold that has been molded on the mating surface 30.

[0004] The stator 42 before resin molding is formed by covering the both ends of the stator core 5 with the core insulating material 31, winding the winding 6 thereon, and implanting the coil 6 at one end of the core insulating material 31. Pin 3
2, the circuit board 8 is placed on the end face of the core insulating material 31 and soldered. This work 42 is inserted into the molding space of the movable mold 41 until the reference surface 26 of the stator core 5 on the counter circuit board side comes into contact with the reference surface 24 of the movable mold 41, and The movable mold 41 is moved to the fixed mold 40 together with the movable mold 42, and the insulating resin 10 is inserted through the injection port 33 in a state where the fixed mold 40 and the movable mold 41 are joined together at the mating surface 30.
Is injected into the molding space, and the work 42 is subjected to a resin mold treatment. If the fixed mold 40 and the movable mold 41 are opened and taken out after a cooling period, the circuit board 8 can be obtained as the stator 2 resin-molded with the insulating resin 10.

[0005]

The above-mentioned conventional resin-molded circuit board is resin-molded as a whole after circuit components are mounted. Therefore, circuit components cannot be replaced. Deterioration of components due to heat during molding is also a problem, and the amount of mold resin used tends to increase. On the other hand, the above-described circuit board 8 of the conventional molded motor has a configuration in which circuit components are retrofitted to the soldering surface 9 of the resin-molded circuit board 8. No,
Since the position of the circuit board 8 is likely to be unstable in the resin mold, the insulating resin 10 goes around to the soldering surface 9 of the circuit board 8 during the resin molding, and adheres to the insulating resin 10 to hinder soldering. There was a problem that often came.

In particular, like the above-described stator 2 of the mold motor, the dimension from the reference surface 24 of the resin mold to the holding surface 28 corresponding to the circuit board 8 is measured from the reference surface 26 of the work 42 to the circuit. If the size of the circuit board 8 is larger than the dimension up to the soldering surface 9, the resin easily wraps around the soldering surface 9 of the circuit board 8, and the mounting and connection of the circuit components and the lead wires 7 to the circuit board 8 can be automated. Making it difficult. That is, as shown in FIG. 9, the distance P at which the soldering surface 9 of the circuit board 8 is held in the resin mold is the thickness L of the stator core 5 from the reference surface 24 and the distance The total distance of the height A and the thickness B of the circuit board 8 (P = L +
A + B). The variation in the thickness of each iron core is large, and the greater the number of laminations, the greater the variation in the value of the stack thickness L. Since the size of the resin mold is determined in anticipation of the maximum change, the resin mold Most of the dimensions of the mold are larger than the dimensions of the work 42. The reason for determining the dimensions of the resin mold in consideration of the maximum change is that the distance P of the resin mold is equal to the distance P of the workpiece 42.
If it becomes shorter, the circuit board 8
Is applied, and the circuit board 8 is broken.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems. An object of the present invention is to provide a resin-molded circuit board capable of automating the mounting of circuit components. The purpose is to improve the reliability of the molded circuit board, and to obtain a resin-molded circuit board that hardly wraps the resin into the soldered portion and that can be attached or connected to circuit components by an automatic machine. It is to establish a manufacturing method for manufacturing a circuit board, and there is almost no resin wrapping around the soldered part,
An object of the present invention is to obtain an electric device provided with a resin-molded circuit board that can be attached and connected to circuit components by an automatic machine, and to establish a manufacturing method for manufacturing the electric device.

[0008]

According to a first aspect of the present invention, a groove-shaped concave portion for arranging a circuit component is formed of an insulating resin on a soldering side of a circuit board on which a circuit component is mounted. It has a holding hole by holding the circuit board in the sandwiched state on the opposite side of this groove-shaped recess, so that the circuit component is attached to the soldering surface using the groove-shaped recess. A means of resin-molding the whole with an insulating resin so that it can be retrofitted is adopted.

In order to achieve the above object, a second aspect of the present invention is to provide a groove-shaped recess for arranging circuit components on a soldering surface side of a circuit substrate on which circuit components are mounted by using an insulating resin obtained by resin-molding the circuit substrate. Then, a means for exposing the soldering surface of the portion, exposing the circuit component in the groove-shaped concave portion, and mounting the circuit component on the soldering surface of the circuit board is adopted.

In order to achieve the above object, a third aspect of the present invention employs a means for filling an insulative resin into a groove-shaped recess accommodating a circuit component according to the first or second aspect of the present invention.

In order to achieve the above object, a fourth aspect of the present invention employs the means according to any one of the first to third aspects, wherein the entire resin surface on the groove-shaped concave side is covered with a cover. .

According to a fifth aspect of the present invention, in order to achieve the above object, the bottom surface of the groove-shaped concave portion for mounting a circuit component in the means according to any one of the first to fourth aspects is a soldering surface of a circuit board. A means for lowering the configuration is adopted.

In order to achieve the above object, a sixth aspect of the present invention is to hold a soldering side of a circuit board on which a circuit component is mounted and a surface facing the soldering side by a holding structure of a resin mold having a divided structure. Then, hold the circuit board in the resin mold, hold the circuit board in a sandwiched state, inject the insulating resin into the resin mold, and form a groove-shaped concave portion of the insulating resin. Means for resin-molding the circuit board with an insulating resin in a state where the circuit component is exposed so that it can be attached later can be adopted.

According to a seventh aspect of the present invention, there is provided a circuit board having a soldering surface on which a circuit component is mounted and an opposite side of the soldering surface facing a portion to be soldered. The surface of the circuit board is sandwiched by the holding structure of the resin mold of the divided configuration, the circuit board is held in the resin mold in a sandwiched state, the insulating resin is injected into the resin mold, and the insulating resin is Means is employed in which the groove-shaped recess is formed, and the circuit board is resin-molded with an insulating resin in a state where the soldering surface side of the circuit board is exposed so that circuit components can be attached later.

In order to achieve the above object, the invention according to claim 8 is to mount the circuit component on the outer periphery of the circuit board disposed at a position apart from the functional component together with the functional component later. In addition to having a configuration in which the soldering surface side is resin-molded with an insulating resin, a circuit-part mounting portion of the circuit board on the soldering surface side is provided with a groove-shaped concave portion for mounting a component lacking the resin mold. On the opposite side, means having a holding hole formed by pinching and holding the circuit board during molding of the resin mold is employed.

According to a ninth aspect of the present invention, in order to achieve the above object, a circuit board provided at a position distant from the functional component together with the functional component is mounted later on the circuit component of the circuit board. In addition to having a configuration in which the soldering surface side is resin-molded with an insulating resin, a circuit-part mounting portion of the circuit board on the soldering surface side is provided with a groove-shaped concave portion for mounting a component lacking the resin mold. Means having a holding hole formed by pinching and holding the circuit board during the molding of the resin mold is employed on the opposite side of the soldering surface corresponding to the portion to be soldered.

According to a tenth aspect of the present invention, in order to achieve the above object, the circuit component provided on the circuit board provided at a position apart from the functional component together with the functional component is mounted later. When manufacturing an electric device having a configuration in which the soldering surface side is resin-molded with an insulating resin, the mounting portion side of the circuit component on the soldering surface side of the circuit board and a part of the opposite side are made of resin. Means is employed in which the circuit board is held in the resin mold by being sandwiched by the holding structure of the mold, and an insulating resin is injected into the resin mold to perform resin molding.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Next, an embodiment of the present invention will be described with reference to the drawings. A first embodiment shown in FIGS. 1 to 6 is a molded electric motor 1 as an electric device.
And a method of manufacturing the same. The stator 2 includes a stator core 5 as a functional component formed by laminating a plurality of ring-shaped cores 4 each having a groove (not shown) on an outer periphery thereof;
The windings 6 wound via the grooves of the stator core 5 and the stator cores 5 for electrically connecting the windings 6 to the lead wires 7 are disposed apart from each other in the stacking direction. Circuit board 8
These portions are resin-molded with the insulating resin 10 except for the soldering surface 9 of the circuit board 8 on the soldering side, and the resin-molded circuit board 3 is formed in this portion.

As shown in FIG. 1, a rotary shaft 11 is rotatably supported by bearings 12 on the center line of the stator 2, and a rotary yoke 13 is fitted to the rotary shaft 11, and is integrated with the rotary yoke 13. The assembled rotor core 14 is assembled to the stator core 5 so as to be opposed to the stator core 5 with an air gap therebetween, thereby forming the molded motor 1. The lead wire 7 is electrically connected to the winding 6 via a circuit component 17 such as a capacitor 15 and a thermal fuse 16, and is retrofitted including the lead wire 7 at a soldering location on the soldering surface 9 of the circuit board 8. (See FIG. 2). This stator 2 is characterized by the resin-molded circuit board 3 and the resin-molded circuit board 3
On the soldering surface 9 side on which the circuit components 17 are mounted, groove-shaped recesses 18 for disposing the circuit components 17 such as the capacitor 15 and the thermal fuse 16 are provided on the insulating resin 10 according to the shape of each circuit component 17. And the soldering surface 9 for soldering them is exposed. Further, a holding hole 19 formed by holding the circuit board 8 in a sandwiched state at the time of resin molding is formed on the opposite side of the groove-shaped concave portion 18. Each of the groove-shaped concave portions 18 is provided with a component holding portion 20.
Each of the circuit components 17 is housed therein, is later soldered to the soldering surface 9, and is electrically connected to form an electric circuit.

The resin molding using the insulating resin 10 for the stator 2 of the molded motor 1 having such a configuration is performed by using a resin molding die separated into a fixed die 21 and a movable die 22 as shown in FIG. Thus, the stator 2 including the resin-molded circuit board 3 is manufactured. The movable side mold 22 of the resin mold has a reference surface 24 on which a stator (hereinafter also referred to as a work) 23 as an assembly before the resin mold is set, and a protrusion 25 for molding one bearing holding portion. Is provided on the end surface of The reference surface 24 comes into contact with a reference surface 26 formed by the end of the stator core 5 as shown in FIG. The fixed-side mold 21 has a protruding portion 27 for molding the other bearing holding portion, and a holding surface 28 for contacting the soldering surface 9 for soldering the circuit component 17 of the circuit board 8.
Are provided. The holding surface 28 is for molding each groove-shaped concave portion 18, and the movable mold 22 side facing each holding surface 28 has a tip on the holding surface 28 when the molds are matched to the thickness of the circuit board 8. Opposing holding rods 29 protrude with gaps that substantially match. The holding surface 28 and the holding rod 29 are a holding structure that sandwiches the circuit board 8 and positions the circuit board 8 in a stable state. A molding space (filled with the insulating resin 10 in the figure) that forms the outer periphery of the resin mold portion of the stator 2 is formed in the resin mold that has been molded on the mating surface 30.

The stator 23 before molding includes a stator core 5
Are covered with an iron core insulating material 31 formed of an insulating resin at both ends, and the winding 6 is wound thereon, and a terminal 32 of the winding 6 is connected to a pin 32 planted at one end of the core insulating material 31. In this embodiment, the circuit board 8 is mounted on the end face of the core insulating material 31 and soldered. This work 23 is placed in the molding space of the movable mold 22, and the stator core 5 is placed on the reference surface 24 of the movable mold 22.
Of the work 2
3 and the movable mold 22 is moved to the fixed mold 21 side, and the fixed mold 21 and the movable mold 22
In this state, the insulating resin 10 is injected into the molding space from the injection port 33 and the work 23 is subjected to resin molding.
After a fixed cooling period, the fixed mold 21 and the movable mold 2
By opening and taking out 2, the stator 2 resin-molded with the insulating resin 10 and the resin-molded circuit board 3 can be manufactured.

In the clamped state, the soldering surface 9 of the circuit board 8 of the work 23 is pressed against the holding surface 28 of the fixed mold 21 by the holding rod 29 of the movable mold 22 and is in close contact therewith. Accordingly, the position of the circuit board 8 at the time of the resin molding process is stable due to the sandwiching between the holding surface 28 and the holding rod 29 and there is no gap between the holding surface 28 and the soldering surface 9. It hardly reaches the soldering surface 9 of the substrate 8 and adheres there. Therefore, the soldering of the circuit component 17 and the lead wire 7 is not hindered, and the soldering surface 9 is exposed in the groove-shaped recess 18. Automatic soldering can be performed while being accommodated in the groove-shaped concave portion 18 by an automatic machine, and the attachment of the circuit component 17 and the lead wire 7 to the circuit board 8 can be automated. The use of the insulating resin 10 is reduced by the formation of the groove-shaped concave portion 18 and the holding hole 19, so that the cost can be reduced. Further, since the circuit component 17 is not deteriorated by heat at the time of molding, the molding motor 1 The productivity and quality of the stator 2 or the resin-molded circuit board 3 can be improved.

The resin molded circuit board 3 having such a structure
Can be widely applied to washing machines, hand dryers and the like in addition to the mold motor 1. The circuit component 17 is retrofitted, and is not buried in the insulating resin 10.
Exchange of 7 is also possible. In addition, the soldering surface 9 of the circuit board 8 does not need to be exposed over the entire groove-shaped concave portion 18. If only the portion to be soldered is exposed, there is no problem in soldering. May be positioned with respect to the soldering portion of the circuit board 8 corresponding to the groove-shaped concave portion 18, so that even if the insulating resin 10 adheres to other portions than the soldering portion, the insulating function of the circuit board 8 is rather increased, which is inconvenient. Does not occur.

The automation of the soldering of the circuit components 17 and the lead wires 7 is achieved by the resin molding circuit board 3A in which only the groove-shaped concave portions 18 for accommodating the components are formed as shown in FIG. It can be carried out in the same manner as the circuit board 3. Further, as shown in FIG. 5, if the circuit component 17 is buried in the groove-shaped concave portion 18 of the resin molded circuit board 3 after the mounting of the circuit component 17 by the potting 34 of the insulating resin, the insulation of the wiring portion can be maintained high. Water resistance and moisture resistance can also be improved. However, the amount of resin used is slightly increased, and replacement of the circuit component 17 becomes impossible. In addition, as shown in FIG. 6, by adopting a configuration in which the entire surface of the insulating resin 10 on the side of the groove-shaped concave portion 18 is covered with the insulating resin cover 35, it is possible to enhance insulation properties and prevent dust from adhering. In particular, in the molded motor 1, by providing such an insulating resin cover 35, foreign matter can be prevented from entering the bearing 12, which is advantageous. It is to be noted that a metal cover may be used as long as only dust adhesion is prevented. By adopting the above configuration in combination,
It is possible to receive each effect accordingly.

Embodiment 2 The second embodiment shown in FIG. 7 also relates to a stator 2 and a resin-molded circuit board 3 of a molded electric motor 1 as an electric device as in the first embodiment, and the basic configuration is the same as that of the first embodiment. is there.
Therefore, the same parts as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and the description thereof will be omitted.

In the stator 2 and the resin-molded circuit board 3 of the second embodiment shown in FIG. 7, the bottom surface of the groove 18 for component mounting shown in the first embodiment is connected to the soldering surface of the circuit board 8. It is configured to be lower than 9. The notch 36 may be formed in the portion of the circuit board 8 corresponding to the groove-shaped concave portion 18 while leaving the soldering portion, and the resin molding may be performed as described in the first embodiment. As a result, the mounting position of the circuit component 17 can be lowered, and by setting the connection foot of the circuit component 17 to the same height as the soldering portion of the circuit board 8, the position of the connection portion is stabilized and the connection portion of the automatic connection is formed. Reliability can be improved. Other configurations, functions, and advantages are basically the same as those of the first embodiment.

[0027]

As is apparent from the above description of the embodiment, according to the first aspect of the present invention, there is almost no resin wraparound to the soldered portion, and the reliability of the automatic mounting of the circuit component is possible. A highly molded resin molded circuit board can be obtained.

According to the second aspect of the present invention, a highly reliable resin molded circuit board capable of automating the mounting of circuit components can be obtained.

According to the third aspect of the present invention, the insulating property is improved together with the effect according to the first or second aspect.

According to the fourth aspect of the present invention, it is possible to prevent dust from being attached together with the effect according to any one of the first to third aspects.

According to the fifth aspect of the present invention, the effect of any one of the first to fourth aspects and the reliability of the connection part of the circuit component are improved.

According to the sixth aspect of the present invention, a highly reliable resin-molded circuit board capable of automating the post-installation of circuit components can be obtained with high productivity, with almost no resin wrapping around the soldered portion. Also decreases.

According to the seventh aspect of the present invention, a resin-molded circuit board having high reliability, which hardly wraps the resin into the soldered portion and which can automate the post-installation of circuit components, can be obtained with high productivity. Also decreases.

According to the eighth aspect of the present invention, it is possible to obtain an electric apparatus having a resin-molded circuit board which hardly wraps the resin around the soldered portion and can be attached and connected to circuit parts by an automatic machine.

According to the ninth aspect of the present invention, it is possible to obtain an electric apparatus having a resin-molded circuit board that hardly wraps the resin around the soldered portion and can be attached or connected to circuit parts by an automatic machine.

According to the tenth aspect of the present invention, an electric device having a highly reliable resin-molded circuit board capable of automating the post-installation of circuit components with almost no resin wraparound to the soldering portion can be manufactured with high productivity. And the amount of resin is also reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a molded motor according to a first embodiment.

FIG. 2 is a side view showing the configuration of a molded motor according to the first embodiment.

FIG. 3 is a cross-sectional view showing a stator during processing of a resin mold according to the first embodiment together with a resin mold.

FIG. 4 is a cross-sectional view showing another mold motor according to the first embodiment.

FIG. 5 is a sectional view showing another mold electric motor according to the first embodiment.

FIG. 6 is a sectional view showing another mold motor according to the first embodiment.

FIG. 7 is a cross-sectional view illustrating a molded electric motor according to a second embodiment.

FIG. 8 is a cross-sectional view showing a conventional mold motor.

FIG. 9 is a cross-sectional view showing a stator during processing of a resin mold of a conventional mold motor together with a resin mold.

[Explanation of symbols]

1 Mold motor, 2 Stator, 3 Resin molded circuit board, 8 Circuit board, 9 Soldering surface, 1
0 Insulating resin, 17 circuit parts, 18 groove-shaped recess,
Reference Signs List 19 holding hole, 21 fixed mold, 22 movable mold, 27 projecting part, 28 holding surface, 29 holding rod, 33 inlet, 34 potting, 35
Insulating resin cover, 36 notch.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Takeshi Arai 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Inside Mitsubishi Electric Corporation (72) Inventor Kouki Kieda 2-3-2 Marunouchi, Chiyoda-ku, Tokyo No. Mitsubishi Electric Co., Ltd. (72) Inventor Hideaki Miyagawa 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Kazue Izawa 2-3-2 Marunouchi, Chiyoda-ku, Tokyo 3 (72) Inventor Kakuji Wakita 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Sanishi Electric Co., Ltd.

Claims (10)

[Claims] 1. A groove-shaped recess for arranging circuit components is formed of an insulating resin on a soldering surface side of a circuit board on which circuit components are mounted, and the soldering surface is exposed, and the opposite side of the groove-shaped recess is formed. Has a holding hole by holding the circuit board in a sandwiched state, and is entirely resin-molded with an insulating resin so that the circuit component can be attached to the soldering surface using the groove-shaped concave portion. A resin molded circuit board characterized by the above-mentioned. 2. A groove-shaped recess for arranging circuit components is formed on a soldering surface side of a circuit board on which circuit components are mounted by using an insulating resin obtained by resin-molding the circuit board, and a soldering surface of the portion is exposed. A resin-molded circuit board, wherein a circuit component is housed in the groove-shaped recess, and the circuit component is retrofitted to a soldering surface of the circuit board. 3. The resin-molded circuit board according to claim 1, wherein an insulating resin is filled in the groove-shaped concave portion containing the circuit component. 4. The resin-molded circuit board according to claim 1, wherein the entire resin surface on the groove-shaped concave side is covered with a cover. 5. The resin-molded circuit board according to claim 1, wherein a bottom surface of the groove-shaped recess for mounting a circuit component is configured to be lower than a soldering surface of the circuit board. Characteristic resin molded circuit board. 6. A circuit board having a soldering surface side on which circuit components are mounted and a surface facing the soldering portion sandwiched by a holding structure of a resin mold having a divided configuration, and the circuit is placed in the resin mold. The insulating resin was injected into the resin mold while holding the substrate in a sandwiched state, a groove-like concave portion of the insulating resin was formed, and the soldering side of the circuit board was exposed so that circuit components could be retrofitted. A method for manufacturing a resin-molded circuit board, wherein the circuit board is resin-molded with an insulating resin in a state. 7. A resin-molded die having a configuration in which a soldering surface side of a circuit board on which circuit components are mounted and a surface of the soldering surface opposite to a portion to be soldered are divided. Holding the circuit board in the resin mold, holding the circuit board in a sandwiched state, injecting an insulating resin into the resin mold, and forming a groove-shaped concave portion of the insulating resin; A method of manufacturing a resin-molded circuit board, wherein the circuit board is resin-molded with an insulating resin so that a soldering surface side of the board is exposed so that circuit components can be attached later. 8. A resin mold of an outer periphery of a circuit board disposed at a position apart from the functional component together with the functional component with an insulating resin except for a soldering surface side on which the circuit component of the circuit board is mounted later. The circuit board mounting portion of the circuit board on the soldering surface side has a groove-shaped concave portion for mounting a component lacking a resin mold, and the opposite side of the circuit board at the time of molding the resin mold is formed on the opposite side. An electric device comprising a resin-molded circuit board having a holding hole formed by sandwiching and holding the board. 9. An outer periphery of a circuit board provided at a position away from the functional component together with the functional component is molded with an insulating resin except for a soldering surface on which the circuit component of the circuit board is mounted later. The circuit board has a groove-shaped concave portion for mounting a component lacking a resin mold in a mounting portion of the circuit component on the soldering surface side of the circuit board, and corresponds to a portion to be soldered on the soldering surface. An electric device having a resin-molded circuit board, characterized in that the opposite surface has a holding hole formed by sandwiching and holding the circuit board during molding of the resin mold. 10. An outer periphery of a circuit board provided at a position apart from the functional component together with the functional component is molded with an insulating resin except for a soldering surface on which the circuit component of the circuit board is mounted later. In manufacturing an electric device having the configuration described above, the mounting portion side of the circuit component on the soldering surface side of the circuit board and a part of the opposite side are sandwiched by a holding structure of a resin mold. A method of manufacturing an electric device equipped with a resin-molded circuit board, wherein the circuit board is held in a resin mold, and an insulating resin is injected into the resin mold to perform resin molding.