JPH11226858A - Wire cut device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent breaking of a wire by rapidly extending a life of a roller, guide roller, etc., for running the wire. SOLUTION: A wire 10 winding both ends to a reel is wound repeatedly to three grooved rollers 6a, 6b, 6c via guide rollers 3, 3,.... A workpiece 15 is cut by the wire 10 extended between the grooved rollers 6a, 6b, on both sides of a region of the wire 10, a work fluid supply nozzle 16, 16 for supplying a work fluid to the wire 10 is arranged. Further, in the intermediate of the work fluid supply nozzles 16, 16 and the grooved rollers 6a, 6b, cleaning devices 21, 21 are provided, which blow out high pressure air to blow off the work fluid and cutting chips adhering to the wire 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a wire cutting device. In particular, the present invention relates to a wire cutting device used for cutting electronic components and the like.

[0002]

2. Description of the Related Art In a wire cutting apparatus, a wire wound at both ends on a pair of reels is run through a plurality of rollers, and a working fluid containing abrasive grains is supplied to the wire running between the rollers. By pressing the workpiece against the wire, the workpiece is cut with the wire entangled with abrasive grains.

[0003]

However, since such a wire cutting apparatus cuts a workpiece with a wire, chips and the like of the workpiece adhere to the wire together with the processing liquid. The wire travels along the rollers and guide rollers, and the wires passing through the wire, such as the roller outer peripheral surface and the guide rollers, are rubbed by wires that are entangled with abrasive grains, chips, etc. And simultaneously wear parts such as rollers and guide rollers. For this reason, in the related art, the rollers and guide rollers are severely worn, and the worn rollers and guide rollers need to be replaced with new parts, and the cutting operation is interrupted each time. In addition, the wire was easily broken by rubbing with a roller, a guide roller, or the like while entangled with abrasive grains or chips. Furthermore, there is a problem that the processing cost is high because the life of these parts is short.

Conventionally, in order to prolong the life of rollers and guide rollers and extend the replacement cycle of these parts, parts made of highly wear-resistant materials such as ultra-high molecular weight polyethylene, urethane, and ceramic have to be used. Although it was used, the exchange cycle could not be drastically improved, and no significant effect was obtained. Further, since these materials are expensive, there is a disadvantage that the cost is rather high. Moreover, there was no effect on the breaking of the wire.

The present invention has been made in view of the above-mentioned drawbacks of the conventional example, and an object of the present invention is to dramatically increase the life of rollers and guide rollers for running a wire. An object of the present invention is to provide a wire cutting device capable of preventing wire breakage.

[0006]

DISCLOSURE OF THE INVENTION A wire cutting apparatus according to the present invention presses a workpiece against a wire running between a plurality of rollers and supplies a working fluid containing abrasive grains to the wire to cut the workpiece. The cutting device is characterized in that it is provided with a cleaning device that removes machining fluid and chips attached to the wire from the wire by blowing air onto the wire.

[0007] This wire cutting device is provided with a cleaning device for cleaning the wire with air to remove the working fluid and chips from the wire. Therefore, a roller, a guide roller, etc., depending on the position where the cleaning device is provided. Abrasion of parts rubbing with the wire can be drastically reduced. Therefore, the life of components such as the roller and the guide roller is extended, and the replacement cycle can be lengthened. Similarly, the wires are less likely to break. Therefore,
The cutting work is not interrupted frequently due to parts replacement.

Further, since the cleaning device can be used semi-permanently once it is provided, and the structure can be simple, the effect of cost reduction can be expected by prolonging the life of components.

In addition, since the wire is cleaned by blowing air onto the wire, the working fluid blown off the wire can be collected and reused, without increasing the processing cost.

[0010] The cleaning device is desirably provided so as to remove machining fluid and chips from the wire near the roller. If the cleaning device is provided at such a position, the cleaning device can be provided near the processing position, and severe wear of the rollers and guide rollers can be reduced. Therefore, the roller replacement cycle can be drastically increased, and the cost is extremely high.

Particularly, it is preferable that the cleaning device is provided so as to clean the wire between the rollers. If the cleaning device is provided at this position, the working liquid can be prevented from adhering to the rollers and the like, so that the highest effect can be obtained in reducing the wear of the rollers and the like and preventing the wire from being disconnected.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) Hereinafter, a wire cutting apparatus A according to one embodiment of the present invention will be described.
FIG. 1 is a schematic view showing the entire configuration of the wire cutting apparatus A, and FIG. 2 is a perspective view showing a processing position and a structure around the processing position. Both ends of the wire 10 are wound around a pair of reels 1 and 7, respectively, and run on a wire running path formed between the reels 1 and 7. That is, the wire 10 wound around one of the reels 1 passes through the wire guide device 2, the plurality of fixed guide rollers 3, 3,... After being sequentially wound around rollers (hereinafter, referred to as grooved rollers) 6a, 6b, and 6c to form a wire row 11, the plurality of guide rollers 3, 3,... It is wound on a reel 7. The respective reels 1 and 7 are connected to drive motors 8 and 9 that can rotate forward and reverse, and one of the three grooved rollers 6c positioned above is driven by a drive motor that can rotate forward and reverse (not shown). ). Thus, the wire 10 unreeled from one reel 1 is wound around the other reel 7 while traveling at high speed in the direction of the solid arrow a in the drawing. Alternatively, the wire 10 wound on the other reel 7 runs backward in the direction of the dashed arrow b in the drawing and is wound on the one reel 1. That is, the wire 10 reciprocates between the one reel 1 and the other reel 7. Further, a weight (weight) 5 having a predetermined weight is suspended from the lifting roller 4, and a required tension is always applied to the wire 10 traveling on the wire traveling path by the load of the weight 5.

A work feed table 12 on which a workpiece 15 is placed is provided below a wire row 11 stretched between a pair of grooved rollers 6a and 6b opposed on the lower side. The work feed table 12 can be moved up and down by a screw shaft 14 rotated by a motor 13.

Further, between the pair of grooved rollers 6a, 6b and the work feed table 12, machining fluid supply nozzles 16, 16 for spraying a machining fluid 18 containing abrasive grains onto the wire row 11 are provided, respectively. A processing fluid 18 stored in a storage tank 17 is supplied to the processing fluid supply nozzles 16, 16 via a processing fluid supply path 19.

Thus, the working fluid 18 is ejected from the working fluid supply nozzles 16, 16 and the working fluid 18
When the workpiece feed table 12 is gradually raised while entangled, the workpiece 15 on the workpiece feed table 12 is pressed against the high-speed traveling wire row 11, and the abrasive grains of the working fluid 18 supplied to the wire row 11 are supplied. The workpiece 15 is cut into a large number of thin plates by the lapping action of the workpiece.

Further, between the working fluid supply nozzles 16 and the lower grooved rollers 6a and 6b, the cleaning devices 21 and 21 are arranged along the direction in which the wire rows 11 are arranged.
Are provided, and the cleaning devices 21 and 21 include:
Air is supplied through a high-pressure air supply path 23 provided with an on-off valve 22, so that air can be jetted to each wire row 11 with great force.

Accordingly, the cleaning devices 21 and 21 are located on both outer sides of the working fluid supply nozzles 16 and 16 and the grooved rollers 6a and 6b are located on the outer sides thereof. , 16, the wire array 11 is supplied with the working fluid 18 from the working fluid supply nozzles 16, 16, and cuts the workpiece 15 in a state where the working fluid 18 is entangled. When the wire 10 that has been blown out from the section between the cleaning devices 21 and 21, the working fluid 18 and chips are blown off by the high-pressure air that is being blown from the cleaning devices 21 and 21. Therefore, the grooved rollers 6a, 6b, 6c
The wire 10 from which the machining fluid 18 and the chips have been removed travels, and the wear of the grooved rollers 6a, 6b, 6c and the guide rollers 3, 3 can be extremely reduced. Further, disconnection of the wire 10 can also be prevented.

In the conventional wire cutting device, the grooved roller and the guide roller had to be replaced at a very short cycle (about one week to two months). By using this, the replacement cycle of the grooved rollers 6a, 6b, 6c and the guide rollers 3, 3 can be made extremely long.

Since the cleaning device 21 has a simple structure that only blows air, the cleaning device 21 has a grooved roller 6.
The cost can be greatly reduced as compared with frequent replacement of the guide rollers 3, 3 and the like a, 6b, 6c.

Also, as shown in FIG.
a, 6b, 6c, the work feed table 12, the working fluid supply nozzles 16, 16, the cleaning devices 21, 21 and the like are housed in a chamber 24. Therefore, the processing liquid 18 and the chips that have been blown off by the cleaning device 21 do not scatter outside the chamber 24 and do not contaminate the surroundings.
Moreover, the blown working fluid 18 and chips are collected on the floor of the chamber 24. Since the cleaning device 21 does not contain a liquid, the processing liquid 18 dropped on the floor of the chamber 24 can be reused, collected in the storage tank 17 through the collection path 20, and reused.

(Second Embodiment) FIG. 3 is a front view showing a main part of a wire cutting apparatus B according to another embodiment of the present invention. In the wire cutting device B, cleaning devices 21 and 21 are arranged at the middle between the grooved rollers 6a and 6c and the middle between the grooved rollers 6b and 6c, respectively. Since the traveling distance of the wire 10 is considerably long, even if the cleaning devices 21 and 21 are provided at these positions, there is a sufficient effect to reduce the wear of the grooved rollers 6a, 6b, 6c and the guide rollers 3, 3,.

(Third Embodiment) FIG. 4 is a perspective view showing a main part of a wire cutting device C according to another embodiment of the present invention. In this wire cutting device C, cleaning devices 25, 25 are arranged at a wire running position between the grooved roller 6c and the two guide rollers 3, 3. As shown in FIG. 5, the cleaning devices 25 have a groove 26 and blow out high-pressure air from the groove 26 with great force. The wire 10 is disposed so as to run in the groove 26. When the wire 10 runs in the groove 26, the working fluid 18 and chips are blown off by high-pressure air.

In this embodiment, the guide rollers 3,
3 is effective in preventing wear, but as described above, wire 1
0, the traveling distance of the guide rollers 3 and 3 is not only reduced, but also the grooved rollers 6a, 6b and 6c are reduced.
It is also highly effective in preventing abrasion.

Further, as in a wire cutting device D shown in FIG. 6, a pair of cleaning devices 21 is disposed between the grooved rollers 6a and 6b.
Cleaning device 2 between the guide rollers 3 and 3
5, 25 may be arranged.

(Fourth Embodiment and Others) FIG. 7 is a perspective view showing a main part of a wire cutting apparatus E according to another embodiment of the present invention. In the wire cutting device E, the wire 10 guided through the guide rollers 3 is wound between two grooved rollers 6a and 6b. Even in the wire cutting device E having such a structure, the cleaning devices 21 and 21 can be provided between the processing liquid supply nozzles 16 and 16 and the grooved rollers 6a and 6b.

As shown in FIG. 8, in the wire cutting device F using two grooved rollers 6a and 6b, both sides of the wire row 1 stretched on the upper surface side between the grooved rollers 6a and 6b. Cleaning devices 21 and 21 may be arranged.

Alternatively, the cleaning device G shown in FIG.
, The grooved rollers 6a, 6b and the guide rollers 3,
Cleaning devices 25, 25 may be provided in the middle of each of the three.

In the wire cutting device H shown in FIG.
Two cleaning devices 21 and 21 are provided between the grooved rollers 6a and 6b, and the cleaning device 2 is provided between the grooved rollers 6a and 6b and the guide rollers 3 and 3.
5, 25 are provided. Further, cleaning devices 28 and 28 for blowing off the processing liquid 18 and chips are provided inside the opening 27 of the chamber 24.
To prevent the machining fluid 18 and chips from scattering outside.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a wire cutting device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a main part of the same wire cutting device.

FIG. 3 is a front view showing a main part of a wire cutting device according to another embodiment of the present invention.

FIG. 4 is a perspective view showing a main part of a wire cutting device according to still another embodiment of the present invention.

FIG. 5 is a plan view showing a head portion of the cleaning device according to the first embodiment;

FIG. 6 is a perspective view showing a main part of a wire cutting device according to still another embodiment of the present invention.

FIG. 7 is a perspective view showing a main part of a wire cutting device according to still another embodiment of the present invention.

FIG. 8 is a front view showing a main part of a wire cutting device according to still another embodiment of the present invention.

FIG. 9 is a perspective view showing a main part of a wire cutting device according to still another embodiment of the present invention.

FIG. 10 is a perspective view showing a main part of a wire cutting device according to still another embodiment of the present invention.

[Explanation of symbols]

 3, 3 Guide roller 6a, 6b, 6c Grooved roller 10 Wire 11 Wire row 15 Workpiece 16 Working fluid supply nozzle 18 Working fluid 21, 25, 28 Cleaning device

Claims (3)

[Claims] 1. A wire cutting apparatus for cutting a workpiece by pressing a workpiece against a wire running between a plurality of rollers and supplying a working fluid containing abrasive grains to the wire, wherein the wire has air. A wire cutting device comprising a cleaning device that removes machining fluid and chips attached to the wire from the wire by spraying. 2. The wire cutting device according to claim 1, wherein the cleaning device removes a working fluid and chips from the wire near the roller. 3. The wire cutting device according to claim 1, wherein the cleaning device removes a working fluid and chips from the wire between the rollers.