JPH11181218A - Resin composition for plating use and plated molded product - Google Patents

Resin composition for plating use and plated molded product

Info

Publication number
JPH11181218A
JPH11181218A JP36587897A JP36587897A JPH11181218A JP H11181218 A JPH11181218 A JP H11181218A JP 36587897 A JP36587897 A JP 36587897A JP 36587897 A JP36587897 A JP 36587897A JP H11181218 A JPH11181218 A JP H11181218A
Authority
JP
Japan
Prior art keywords
monomer
plating
weight
parts
molded product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP36587897A
Other languages
Japanese (ja)
Other versions
JP4084875B2 (en
Inventor
Masanori Ito
雅典 伊藤
Hiromitsu Aoki
寛充 青木
Hidetoshi Egawa
秀俊 江川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUMIKA ABS LATEX KK
Original Assignee
SUMIKA ABS LATEX KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUMIKA ABS LATEX KK filed Critical SUMIKA ABS LATEX KK
Priority to JP36587897A priority Critical patent/JP4084875B2/en
Publication of JPH11181218A publication Critical patent/JPH11181218A/en
Application granted granted Critical
Publication of JP4084875B2 publication Critical patent/JP4084875B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To obtain a plated molded product made of an improved AES resin- based composition capable of easy plating operation under similar conditions to those for conventional ABS resin plating operation. SOLUTION: The subject resin composition comprises a total of 100 pts.wt. of (A) 10-80 pts.wt. of a graft polymer produced by grafting an aromatic vinyl monomer and vinyl cyanide monomer or another monomer copolymerizable therewith to an ethylene-propylene-based rubber, (B) 10-60 pts.wt. of a graft polymer produced by grafting a (meth)acrylic ester-based or another monomer copolymerizable therewith to a conjugated diene-based rubber 0.1-0.4 μm in weight-average particle size, and (C) 10-80 pts.wt. of a copolymer produced by copolymerization between aromatic vinyl monomer and vinyl cyanide monomer or another monomer copolymerizable therewith. The other objective plated molded product is obtained by plating a resin molded product obtained by molding the above composition.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、エチレン−プロピ
レン系ゴムに芳香族ビニル系単量体およびシアン化ビニ
ル系単量体を重合してなるグラフト重合体、いわゆるA
ES樹脂に特定の粒子径を有する特定のグラフト重合体
を配合してなるメッキ用樹脂組成物および該樹脂組成物
を成形してなる樹脂成形品にメッキを施してなるメッキ
成形品に関するものである。
The present invention relates to a graft polymer obtained by polymerizing an aromatic vinyl monomer and a vinyl cyanide monomer on an ethylene-propylene rubber, so-called A
The present invention relates to a plating resin composition obtained by blending a specific graft polymer having a specific particle diameter with an ES resin, and a plated molded product obtained by plating a resin molded product obtained by molding the resin composition. .

【0002】[0002]

【従来の技術】アクリロニトリルーブタジエンースチレ
ン樹脂(ABS樹脂)は、従来から金属様外観を付与す
るためにメッキ装飾を行うケースが非常に多く、また比
較的容易にメッキ加工が可能な材料として知られてい
る。近年、メッキ装飾に対する要望が強まり、成形品全
体にメッキを施すだけでなく、一部分のみメッキ加工を
施すいゆゆる部分メッキや、また同一成形品に対してメ
ッキと塗装とを併用する等、従来とは異なる仕様が増加
しつつある。特に部分メッキに関しては、一部分の樹脂
が意匠面に露出することから、従来使用されていたAB
S樹脂では耐候性に劣るため、使用できる環境が限定さ
れるという問題があった。このような問題点に対して、
ABS樹脂のゴム成分であるブタジエン成分をエチレン
−プロピレン系ゴムに変更してなる耐候性に優れた樹脂
である、いわゆるAES樹脂での代替え等が検討されて
いるが、一般的なABS樹脂のメッキ条件ではメッキ金
属膜と樹脂との密着性を高めるための手段であるエッチ
ング工程において、エッチングが進みすぎたり(オーバ
ーエッチング)、逆にエッチング不足等の不具合が発生
しやすく、ABS樹脂と同等のメッキ性は得られていな
いのが現状である。
2. Description of the Related Art Acrylonitrile-butadiene-styrene resin (ABS resin) has been used in many cases for plating and decoration to give a metallic appearance, and is known as a material which can be plated relatively easily. Have been. In recent years, there has been an increasing demand for plating decoration, and in addition to plating not only on the entire molded product, but also plating on only a part, so-called partial plating, or using plating and painting on the same molded product in the past Specifications that differ from are increasing. In particular, with regard to partial plating, since a part of the resin is exposed on the design surface, the conventionally used AB
Since the S resin has poor weather resistance, there is a problem that the usable environment is limited. For such a problem,
Substitution of a so-called AES resin, which is a resin having excellent weather resistance, in which a butadiene component, which is a rubber component of an ABS resin, is changed to an ethylene-propylene rubber, is being studied. Under the conditions, in the etching step, which is a means for improving the adhesion between the plating metal film and the resin, the etching tends to proceed too much (over-etching), and conversely, a problem such as insufficient etching is likely to occur. At present, it has not been obtained.

【0003】[0003]

【発明が解決しようとする課題】本発明は、従来のAB
S樹脂メッキと同様の条件で容易にメッキが可能な改良
されたメッキ用AES系樹脂組成物、および該樹脂組成
物を成形してなる樹脂成形品にメッキを施してなるメッ
キ成形品を提供することを目的とするものである。
SUMMARY OF THE INVENTION The present invention relates to a conventional AB
Provided are an improved AES resin composition for plating that can be easily plated under the same conditions as S resin plating, and a plated molded article obtained by plating a resin molded article obtained by molding the resin composition. The purpose is to do so.

【0004】[0004]

【課題を解決するための手段】すなわち、本発明は、エ
チレン−プロピレン系ゴムに芳香族ビニル系単量体およ
びシアン化ビニル系単量体またはこれらの単量体と共重
合可能な他の単量体とを重合してなるグラフト重合体
(A)10〜80重量部、重量平均粒子径が0.1〜
0.4μmである共役ジエン系ゴムに(メタ)アクリル
酸エステル系単量体またはこれと共重合可能な他の単量
体とを重合してなるグラフト重合体(B)10〜60重
量部および芳香族ビニル系単量体およびシアン化ビニル
系単量体またはこれらの単量体と共重合可能な他の単量
体とを重合してなる共重合体(C)10〜80重量部
((A)+(B)+(C)=100重量部)よりなるメ
ッキ用樹脂組成物および該樹脂組成物を成形してなる樹
脂成形品にメッキを施してなるメッキ成形品を提供する
ものである。
That is, the present invention provides an aromatic vinyl monomer and a vinyl cyanide monomer or another monomer copolymerizable with these monomers on an ethylene-propylene rubber. 10-80 parts by weight of a graft polymer (A) obtained by polymerizing a monomer and a weight average particle diameter of 0.1-80.
10 to 60 parts by weight of a graft polymer (B) obtained by polymerizing a conjugated diene rubber having a diameter of 0.4 μm with a (meth) acrylate monomer or another monomer copolymerizable therewith; 10 to 80 parts by weight of a copolymer (C) obtained by polymerizing an aromatic vinyl monomer and a vinyl cyanide monomer or another monomer copolymerizable with these monomers (( A) + (B) + (C) = 100 parts by weight) and a plated molded product obtained by plating a resin molded product obtained by molding the resin composition. .

【0005】[0005]

【発明の実施の形態】以下、本発明につき詳細に説明す
る。本発明におけるグラフト重合体(A)を構成するエ
チレン−プロピレン系ゴムとしては、エチレン−プロピ
レン系共重合体ゴム、エチリデンノルボルネン、ジシク
ロペンタジエン、1,4−ヘキサジエンなどの非共役ジ
エン成分を導入してなるエチレン−プロピレン−非共役
ジエン共重合体ゴム等が挙げられる。特にエチレン含有
量30〜80重量%、ムーニー粘度(ML1+4 12
1℃)40〜80のものが好ましい。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. As the ethylene-propylene rubber constituting the graft polymer (A) in the present invention, non-conjugated diene components such as ethylene-propylene copolymer rubber, ethylidene norbornene, dicyclopentadiene and 1,4-hexadiene are introduced. Ethylene-propylene-non-conjugated diene copolymer rubber. In particular, ethylene content is 30 to 80% by weight, Mooney viscosity (ML1 + 412
(1 ° C) 40 to 80 is preferred.

【0006】芳香族ビニル系単量体としては、スチレ
ン、α−メチルスチレン、パラメチルスチレン、ブロム
スチレン等が挙げられ、一種又は二種以上用いることが
できる。特にスチレン、α−メチルスチレンが好まし
い。シアン化ビニル系単量体としてはアクリロニトリ
ル、メタクリロニトリル等が挙げられ、一種又は二種以
上用いることができる。
Examples of the aromatic vinyl monomer include styrene, α-methylstyrene, p-methylstyrene, bromostyrene and the like, and one or more of them can be used. Particularly, styrene and α-methylstyrene are preferred. Examples of the vinyl cyanide-based monomer include acrylonitrile, methacrylonitrile, and the like, and one or more kinds can be used.

【0007】本発明においては、上記グラフト重合体
(A)を構成する単量体として、芳香族ビニル系単量体
およびシアン化ビニル系単量体と共に共重合可能な他の
単量体を使用することも可能である。このような単量体
としては、メタクリル酸メチル、アクリル酸メチル等の
(メタ)アクリル酸エステル系単量体、N−フェニルマ
レイミド、N−シクロヘキシルマレイミドなどのマレイ
ミド系単量体、アクリル酸、メタクリル酸、イタコン
酸、フマル酸などの不飽和カルボン酸が挙げられ、それ
らはそれぞれ一種又は二種以上用いることができる。
In the present invention, as the monomer constituting the graft polymer (A), another monomer copolymerizable with an aromatic vinyl monomer and a vinyl cyanide monomer is used. It is also possible. Examples of such monomers include (meth) acrylate monomers such as methyl methacrylate and methyl acrylate, maleimide monomers such as N-phenylmaleimide and N-cyclohexylmaleimide, acrylic acid, methacrylic acid and the like. Examples thereof include unsaturated carboxylic acids such as acid, itaconic acid and fumaric acid, each of which can be used alone or in combination of two or more.

【0008】上記芳香族ビニル系単量体(i)、シアン
化ビニル系単量体(ii)および共重合可能な他の単量体
(iii) の組成比率には特に制限はないが、(i)50〜
95重量%、(ii)5〜50重量%および(iii) 0〜4
5重量%であることが好ましい。また、エチレン−プロ
ピレン系ゴムと単量体(合計)との組成比率についても
特に制限はないが、エチレン−プロピレン系ゴムゴム状
重合体10〜80重量%および単量体(合計)90〜2
0重量%であることが好ましい。
The above-mentioned aromatic vinyl monomer (i), vinyl cyanide monomer (ii) and other copolymerizable monomers
The composition ratio of (iii) is not particularly limited, but (i) 50 to 50%
95% by weight, (ii) 5 to 50% by weight and (iii) 0 to 4
Preferably it is 5% by weight. The composition ratio of the ethylene-propylene rubber and the monomer (total) is also not particularly limited, but is 10 to 80% by weight of the ethylene-propylene rubber-like polymer and 90 to 2 of the monomer (total).
It is preferably 0% by weight.

【0009】また、グラフト重合体(A)のグラフト率
には特に制限はないが、10〜150%が好ましく、特
に成形性と強度のバランスから30〜100%の範囲が
好ましい。
The graft ratio of the graft polymer (A) is not particularly limited, but is preferably from 10 to 150%, and particularly preferably from 30 to 100% from the balance between moldability and strength.

【0010】本発明におけるグラフト重合体(B)を構
成する共役ジエン系ゴムとしては、ポリブタジエン、ス
チレン−ブタジエン共重合体、アクリロニトリル−ブタ
ジエン共重合体等が挙げられる。該共役ジエン系ゴムの
重量平均粒子径は0.1〜0.4μmである。該重量平
均粒子径が0.1μm未満ではメッキ工程でのエッチン
グ性に劣るため部分的にメッキが定着しない現象(スキ
ップ)が発生しやすいため好ましくない。また、重量平
均粒子径が0.4μmよりも大きい場合、逆にオーバー
エッチングになりやすく、メッキ膜と樹脂との密着性が
低下するため好ましくない。メッキ性と強度の面から特
に0.20〜0.30μmの範囲が好ましい。
The conjugated diene rubber constituting the graft polymer (B) in the present invention includes polybutadiene, styrene-butadiene copolymer, acrylonitrile-butadiene copolymer and the like. The conjugated diene rubber has a weight average particle diameter of 0.1 to 0.4 μm. If the weight average particle diameter is less than 0.1 μm, the etching property in the plating step is poor, and the phenomenon that the plating is not partially fixed (skip) tends to occur, which is not preferable. On the other hand, if the weight average particle diameter is larger than 0.4 μm, it is not preferable because conversely, overetching tends to occur and the adhesion between the plating film and the resin is reduced. The range of 0.20 to 0.30 μm is particularly preferable in terms of plating property and strength.

【0011】(メタ)アクリル酸エステル系単量体とし
ては、(メタ)アクリル酸メチル、(メタ)アクリル酸
エチル、(メタ)アクリル酸プロピル、(メタ)アクリ
ル酸ブチル、(メタ)アクリル酸2−エチルヘキシル等
が挙げられれ、一種又は二種以上用いることができる。
The (meth) acrylate-based monomers include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and (meth) acrylic acid 2 -Ethylhexyl and the like, and one kind or two or more kinds can be used.

【0012】上記(メタ)アクリル酸エステル系単量体
と共重合可能な他の単量体としては、スチレン、α−メ
チルスチレン、パラメチルスチレン、ブロムスチレン等
の芳香族ビニル系単量体、アクリロニトリル、メタクリ
ロニトリル等のシアン化ビニル系単量体、さにらはN−
フェニルマレイミド、N−シクロヘキシルマレイミドな
どのマレイミド系単量体、アクリル酸、メタクリル酸、
イタコン酸、フマル酸などの不飽和カルボン酸等が挙げ
られるが、特に芳香族ビニル系単量体および/またはシ
アン化ビニル系単量体が好ましい。
Other monomers copolymerizable with the (meth) acrylic ester monomers include aromatic vinyl monomers such as styrene, α-methylstyrene, paramethylstyrene and bromostyrene; Vinyl cyanide monomers such as acrylonitrile and methacrylonitrile;
Maleimide monomers such as phenylmaleimide and N-cyclohexylmaleimide, acrylic acid, methacrylic acid,
Examples thereof include unsaturated carboxylic acids such as itaconic acid and fumaric acid, and particularly preferred are aromatic vinyl monomers and / or vinyl cyanide monomers.

【0013】上記(メタ)アクリル酸エステル系単量体
(i)および共重合可能な他の単量体(ii)の組成比率
には特に制限はないが、(i)30〜100重量%、
(ii)0〜70重量%であることが好ましい。また、共
役ジエン系ゴムと単量体(合計)との組成比率について
も特に制限はないが、共役ジエン系ゴム10〜80重量
%および単量体(合計)90〜20重量%であることが
好ましい。
The composition ratio of the (meth) acrylate monomer (i) and the other copolymerizable monomer (ii) is not particularly limited, but (i) 30 to 100% by weight,
(Ii) It is preferably from 0 to 70% by weight. The composition ratio of the conjugated diene rubber and the monomer (total) is not particularly limited, but may be 10 to 80% by weight of the conjugated diene rubber and 90 to 20% by weight of the monomer (total). preferable.

【0014】また、グラフト重合体(B)のグラフト率
には特に制限はないが、10〜150%が好ましく、特
に成形性と強度のバランスから20〜100%の範囲が
好ましい。
The graft ratio of the graft polymer (B) is not particularly limited, but is preferably from 10 to 150%, and particularly preferably from 20 to 100% from the balance between moldability and strength.

【0015】本発明における共重合体(C)を構成する
芳香族ビニル系単量体としては、スチレン、α−メチル
スチレン、パラメチルスチレン、ブロムスチレン等が挙
げられ、一種又は二種以上用いることができる。特にス
チレン、α−メチルスチレンが好ましい。シアン化ビニ
ル系単量体としてはアクリロニトリル、メタクリロニト
リル等が挙げられ、一種又は二種以上用いることができ
る。
As the aromatic vinyl monomer constituting the copolymer (C) in the present invention, styrene, α-methylstyrene, paramethylstyrene, bromostyrene and the like can be mentioned. Can be. Particularly, styrene and α-methylstyrene are preferred. Examples of the vinyl cyanide-based monomer include acrylonitrile, methacrylonitrile, and the like, and one or more kinds can be used.

【0016】本発明においては、上記共重合体(C)を
構成する芳香族ビニル系単量体およびシアン化ビニル系
単量体と共に共重合可能な他の単量体を使用することも
可能である。このような単量体としては、メタクリル酸
メチル、アクリル酸メチル等の(メタ)アクリル酸エス
テル系単量体、N−フェニルマレイミド、N−シクロヘ
キシルマレイミドなどのマレイミド系単量体、アクリル
酸、メタクリル酸、イタコン酸、フマル酸などの不飽和
カルボン酸が挙げられ、それらはそれぞれ一種又は二種
以上用いることができる。
In the present invention, it is also possible to use other monomers copolymerizable with the aromatic vinyl monomer and vinyl cyanide monomer constituting the copolymer (C). is there. Examples of such monomers include (meth) acrylate monomers such as methyl methacrylate and methyl acrylate, maleimide monomers such as N-phenylmaleimide and N-cyclohexylmaleimide, acrylic acid, methacrylic acid and the like. Examples thereof include unsaturated carboxylic acids such as acid, itaconic acid and fumaric acid, each of which can be used alone or in combination of two or more.

【0017】上記芳香族ビニル系単量体(i)、シアン
化ビニル系単量体(ii)および共重合可能な他の単量体
(iii) の組成比率には特に制限はないが、(i)50〜
95重量%、(ii)5〜50重量%および(iii) 0〜4
5重量%であることが好ましい。
The above-mentioned aromatic vinyl monomer (i), vinyl cyanide monomer (ii) and other copolymerizable monomers
The composition ratio of (iii) is not particularly limited, but (i) 50 to 50%
95% by weight, (ii) 5 to 50% by weight and (iii) 0 to 4
Preferably it is 5% by weight.

【0018】また、共重合体(C)の固有粘度(30
℃、ジメチルホルムアミド)には特に制限はないが、
0.4〜1.0であることが好ましい。
Further, the intrinsic viscosity of the copolymer (C) (30
C, dimethylformamide) is not particularly limited,
It is preferably from 0.4 to 1.0.

【0019】本発明で用いられる上記グラフト重合体
(A)および(B)、さらに共重合体(C)の重合方法
には制限は無く、公知の乳化重合法、塊状重合法、溶液
重合法、懸濁重合法あるいはこれらの重合法を任意に組
み合わせた方法を採用することができる。
The method for polymerizing the graft polymers (A) and (B) and the copolymer (C) used in the present invention is not limited, and may be a known emulsion polymerization method, bulk polymerization method, solution polymerization method, or the like. A suspension polymerization method or a method in which these polymerization methods are arbitrarily combined can be employed.

【0020】本発明の樹脂組成物は、上記グラフト重合
体(A)10〜80重量部、グラフト重合体(B)10
〜60重量部および共重合体(C)10〜80重量部
((A)+(B)+(C)=100重量部)からなる。
樹脂組成物の混合割合が該範囲外では良好なメッキ性が
得られないため好ましくない。また、該樹脂組成物中に
占める(A)成分および(B)成分からもたらされるゴ
ム成分の割合は10〜40重量%であることが好まし
く、該割合が10重量%未満では成形品の強度が低下す
ると共にエッチング不足になり易く、また40重量%を
超えると成形性が低下すると共にオーバーエッチングに
なり易く、メッキ膜と樹脂との密着性が低下するため好
ましくない。
The resin composition of the present invention comprises 10 to 80 parts by weight of the above graft polymer (A) and 10 parts by weight of the graft polymer (B).
6060 parts by weight and 10 to 80 parts by weight of the copolymer (C) ((A) + (B) + (C) = 100 parts by weight).
If the mixing ratio of the resin composition is out of the range, good plating properties cannot be obtained, which is not preferable. Further, the proportion of the rubber component derived from the component (A) and the component (B) in the resin composition is preferably from 10 to 40% by weight, and when the proportion is less than 10% by weight, the strength of the molded article is low. When the content is less than 40% by weight, the moldability tends to be reduced and the film tends to be over-etched, and the adhesion between the plating film and the resin is undesirably reduced.

【0021】本発明の樹脂組成物には、必要に応じて、
ポリカーボネート、ポリエステル、ポリフェニレンエー
テル、ポリアミド等の他の樹脂、着色剤、分散剤、酸化
防止剤、紫外線吸収剤、難燃剤等の各種添加剤、あるい
はガラス繊維、カーボン繊維、炭酸カルシウム等の各種
補強材等を加えることができる。また本発明の樹脂組成
物の混合は、通常使用されるロール、バンバリーミキサ
ー、押出機、ニーダー等公知の方法で実施できる。
In the resin composition of the present invention, if necessary,
Other resins such as polycarbonate, polyester, polyphenylene ether and polyamide, various additives such as colorants, dispersants, antioxidants, ultraviolet absorbers, flame retardants, etc., or various reinforcing materials such as glass fiber, carbon fiber and calcium carbonate Etc. can be added. The mixing of the resin composition of the present invention can be carried out by a commonly used method such as a roll, a Banbury mixer, an extruder, or a kneader.

【0022】このようにして得られた樹脂組成物は、射
出成形、押出成形、圧縮成形、射出圧縮成形、ブロー成
形等により成形され、得られた樹脂成形品は、公知のメ
ッキ方法、例えば通常のABS樹脂のメッキ条件と同様
の条件にてメッキ加工される。
The resin composition thus obtained is molded by injection molding, extrusion molding, compression molding, injection compression molding, blow molding, or the like. The plating process is performed under the same conditions as the plating conditions of the ABS resin.

【0023】〔実施例〕以下に実施例を用いて本発明を
具体的に説明するが、本発明はこれらによって何ら制限
されるものではない。なお、実施例中にて示す部および
%は重量に基づくものである。
[Examples] The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. In the examples, parts and percentages are based on weight.

【0024】−グラフト重合体(A)− A−1:エチレン−プロピレン−エチリデンノルボルネ
ンゴム(エチレン含有量60重量%、ムーニー粘度6
5)50重量部、スチレン35部およびアクリロニトリ
ル15部を公知の溶液重合法によりグラフト重合し、グ
ラフト重合体(A−1)を得た。
-Graft polymer (A)-A-1: Ethylene-propylene-ethylidene norbornene rubber (ethylene content 60% by weight, Mooney viscosity 6)
5) 50 parts by weight, 35 parts of styrene and 15 parts of acrylonitrile were graft-polymerized by a known solution polymerization method to obtain a graft polymer (A-1).

【0025】−グラフト重合体(B)− B−1:スチレン−ブタジエン共重合体ゴム(重量平均
粒子径0.25μm)50部、メタクリル酸メチル45
部およびアクリル酸エチル5部を公知の乳化重合法によ
りグラフト重合し、グラフト重合体(B−1)を得た。 B−2:ポリブタジエンゴム(重量平均粒子径0.40
μm)60部、メタクリル酸メチル25部、スチレン1
0部およびアクリロニトリル5部を公知の乳化重合法に
よりグラフト重合し、グラフト重合体(B−2)を得
た。 B−3:ポリブタジエンゴム(重量平均粒子径0.30
μm)40部、メタクリル酸メチル45部およびアクリ
ロニトリル15部を公知の乳化重合法によりグラフト重
合し、グラフト重合体(B−3)を得た。 B−4:ポリブタジエンゴム(重量平均粒子径0.20
μm)50部、メタクリル酸メチル30部およびスチレ
ン20部を公知の乳化重合法によりグラフト重合し、グ
ラフト重合体(B−4)を得た。 B−i:ポリブタジエンゴム(重量平均粒子径0.05
μm)50部、メタクリル酸メチル30部およびスチレ
ン20部を公知の乳化重合法によりグラフト重合し、グ
ラフト重合体(B−i)を得た。 B−ii:ポリブタジエンゴム(重量平均粒子径0.50
μm)50部、メタクリル酸メチル30部およびスチレ
ン20部を公知の乳化重合法によりグラフト重合し、グ
ラフト重合体(B−ii)を得た。 B−iii:ポリブタジエンゴム(重量平均粒子径0.40
μm)50部、アクリロニトリル15部およびスチレン
35部を公知の乳化重合法によりグラフト重合し、グラ
フト重合体(B−iii)を得た。
-Graft polymer (B)-B-1: 50 parts of styrene-butadiene copolymer rubber (weight average particle diameter 0.25 μm), methyl methacrylate 45
Parts and 5 parts of ethyl acrylate were graft-polymerized by a known emulsion polymerization method to obtain a graft polymer (B-1). B-2: polybutadiene rubber (weight average particle size 0.40
μm) 60 parts, methyl methacrylate 25 parts, styrene 1
0 parts and 5 parts of acrylonitrile were graft-polymerized by a known emulsion polymerization method to obtain a graft polymer (B-2). B-3: polybutadiene rubber (weight average particle size 0.30
μm) 40 parts, 45 parts of methyl methacrylate and 15 parts of acrylonitrile were graft-polymerized by a known emulsion polymerization method to obtain a graft polymer (B-3). B-4: polybutadiene rubber (weight average particle size 0.20
μm), 50 parts of methyl methacrylate, and 30 parts of styrene were graft-polymerized by a known emulsion polymerization method to obtain a graft polymer (B-4). Bi: polybutadiene rubber (weight average particle size 0.05
μm), 50 parts of methyl methacrylate and 30 parts of styrene were graft-polymerized by a known emulsion polymerization method to obtain a graft polymer (B-i). B-ii: polybutadiene rubber (weight average particle size 0.50
μm), 50 parts of methyl methacrylate, 30 parts of styrene and 20 parts of styrene were graft-polymerized by a known emulsion polymerization method to obtain a graft polymer (B-ii). B-iii: polybutadiene rubber (weight average particle size 0.40
μm), 50 parts of acrylonitrile and 35 parts of styrene were graft-polymerized by a known emulsion polymerization method to obtain a graft polymer (B-iii).

【0026】−共重合体(C)− C−1:スチレン75部およびアクリロニトリル25部
を公知の塊状重合法により重合し、共重合体(C−1)
を得た。
-Copolymer (C)-C-1: 75 parts of styrene and 25 parts of acrylonitrile are polymerized by a known bulk polymerization method to obtain a copolymer (C-1).
I got

【0027】〔実施例1〜7および比較例1〜4〕上記
のグラフト共重合体(A−1)、グラフト共重合体(B
−1〜4、B〜i〜iii )および共重合体(C−1)を
表1に示す配合割合で混合し、40mm二軸押出機を用
いて230℃で溶融混合、ペレットとした後、射出成形
機にてメッキ用成形品(100×50×3mm)を成形
し、得られた成形品につき耐光性を測定した。また、以
下の方法にてメッキを施し、メッキ成形品を得た。以下
の方法により、各特性を測定した。結果を表1に示す。
Examples 1 to 7 and Comparative Examples 1 to 4 The above graft copolymer (A-1) and graft copolymer (B
-1 to 4, B to i to iii) and the copolymer (C-1) were mixed at the compounding ratio shown in Table 1, and melt-mixed at 230 ° C. using a 40 mm twin-screw extruder to form pellets. A molded article for plating (100 × 50 × 3 mm) was molded by an injection molding machine, and the light resistance of the obtained molded article was measured. Further, plating was performed by the following method to obtain a plated molded product. Each characteristic was measured by the following methods. Table 1 shows the results.

【0028】メッキ処理プロセス:脱脂(界面活性剤
水溶液、55℃×3分間)、エッチング(硫酸−無水
クロム酸混液、65〜70℃×15分間)、中和(塩
酸水溶液、室温×3分間)、キャタリスト(塩化パラ
ジウム−塩化第一スズ−塩酸水溶液、室温×2分間)、
アクセレーター(硫酸水溶液、45℃×3分間)、
無電解メッキ(硫酸ニッケル−次亜燐酸ソーダ−クエン
酸ソーダを主体とするニッケルメッキ液)、電気メッ
キ(硫酸銅浴→硫酸ニッケル浴→無水クロム酸浴)
Plating process: degreasing (surfactant aqueous solution, 55 ° C. × 3 minutes), etching (sulfuric acid-chromic anhydride mixed solution, 65-70 ° C. × 15 minutes), neutralization (hydrochloric acid aqueous solution, room temperature × 3 minutes) , Catalyst (palladium chloride-stannous chloride-hydrochloric acid aqueous solution, room temperature x 2 minutes),
Accelerator (sulfuric acid aqueous solution, 45 ° C x 3 minutes),
Electroless plating (nickel plating solution mainly composed of nickel sulfate-sodium hypophosphite-sodium citrate), electroplating (copper sulfate bath → nickel sulfate bath → chromic anhydride bath)

【0029】oエッチング後の表面光沢:上記エッチ
ング後、ハンディ光沢計((株)堀場製作所製 グロス
チェッカIG−310)で表面光沢(%)を測定した。 oピーリング強度:JIS H−8630に基づき、メ
ッキ膜の密着強度(メッキ成形品の金属膜に基材に達す
る1cm間隔の切傷を入れ、金属膜を垂直な方向に引き
剥がす時の応力で示した)を測定した(kg/c
2 )。 o成形品外観:メッキ後の外観(メッキ未着)を目視に
より、以下の判定基準にて判定した。 ○;全体にメッキが着いており良好。 △;一部メッキ未着の状態でやや不良。 ×;メッキ未着の状態で不良。 o耐光性:耐光性測定用試験片(100×50×3m
m)をFOM(スガ試験機製)を用いて63℃にて40
0時間の耐光性試験を実施した後、試験片を色差計(ス
ガ試験機製)により(ΔE)を測定した。
O Surface gloss after etching: After the etching, the surface gloss (%) was measured with a handy gloss meter (Gloss Checker IG-310 manufactured by Horiba, Ltd.). o Peeling strength: Based on JIS H-8630, adhesion strength of plating film (indicated by stress when a metal film of a plated product is cut at 1 cm intervals reaching the substrate and peeled off in a vertical direction) ) Was measured (kg / c
m 2 ). o Molded product appearance: The appearance after plating (no plating) was visually judged according to the following criteria. ;: Good plating with plating on the whole. Δ: Slightly inferior in a part without plating. ×: defective in a state where plating was not applied. o Light fastness: Test piece for light fastness measurement (100 × 50 × 3 m
m) at 63 ° C. using FOM (manufactured by Suga Test Instruments)
After performing the light resistance test for 0 hours, (ΔE) of the test piece was measured by a color difference meter (manufactured by Suga Test Instruments).

【0030】[0030]

【表1】 [Table 1]

【0031】[0031]

【発明の効果】本発明における樹脂組成物は、耐候性に
優れたAES系樹脂組成物であって、従来のABS樹脂
メッキと同様の条件で容易にメッキが可能なメッキ性に
優れた樹脂組成物であり、部分メッキであっても環境
(屋外)に制限されることなく使用できるものであり、
各種メッキ成形品として有効に利用できる。
The resin composition according to the present invention is an AES-based resin composition having excellent weather resistance, and has excellent plating properties which can be easily plated under the same conditions as conventional ABS resin plating. It can be used without being limited to the environment (outdoor) even if it is partially plated,
It can be effectively used as various plating products.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 エチレン−プロピレン系ゴムに芳香族ビ
ニル系単量体およびシアン化ビニル系単量体またはこれ
らの単量体と共重合可能な他の単量体とを重合してなる
グラフト重合体(A)10〜80重量部、重量平均粒子
径が0.1〜0.4μmである共役ジエン系ゴムに(メ
タ)アクリル酸エステル系単量体またはこれと共重合可
能な他の単量体とを重合してなるグラフト重合体(B)
10〜60重量部および芳香族ビニル系単量体およびシ
アン化ビニル系単量体またはこれらの単量体と共重合可
能な他の単量体とを重合してなる共重合体(C)10〜
80重量部((A)+(B)+(C)=100重量部)
よりなるメッキ用樹脂組成物。
1. A graft weight obtained by polymerizing an ethylene-propylene rubber with an aromatic vinyl monomer and a vinyl cyanide monomer or another monomer copolymerizable with these monomers. Combined (A) 10 to 80 parts by weight, conjugated diene rubber having a weight average particle diameter of 0.1 to 0.4 μm, a (meth) acrylate monomer or another monomer copolymerizable therewith Polymer (B) obtained by polymerizing a polymer
10 to 60 parts by weight of an aromatic vinyl-based monomer and a vinyl cyanide-based monomer or a copolymer (C) obtained by polymerizing these monomers with another monomer copolymerizable therewith ~
80 parts by weight ((A) + (B) + (C) = 100 parts by weight)
A plating resin composition comprising:
【請求項2】 請求項1記載の樹脂組成物を成形してな
る樹脂成形品にメッキを施してなるメッキ成形品。
2. A plated molded article obtained by plating a resin molded article obtained by molding the resin composition according to claim 1.
JP36587897A 1997-12-22 1997-12-22 Plating resin composition and plated molded product Expired - Fee Related JP4084875B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36587897A JP4084875B2 (en) 1997-12-22 1997-12-22 Plating resin composition and plated molded product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36587897A JP4084875B2 (en) 1997-12-22 1997-12-22 Plating resin composition and plated molded product

Publications (2)

Publication Number Publication Date
JPH11181218A true JPH11181218A (en) 1999-07-06
JP4084875B2 JP4084875B2 (en) 2008-04-30

Family

ID=18485346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36587897A Expired - Fee Related JP4084875B2 (en) 1997-12-22 1997-12-22 Plating resin composition and plated molded product

Country Status (1)

Country Link
JP (1) JP4084875B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023087A1 (en) * 2001-09-11 2003-03-20 Daicel Polymer Ltd. Plated resin molding and process for producing the same
WO2007063732A1 (en) * 2005-11-30 2007-06-07 Techno Polymer Co., Ltd. Resin composition for direct metal plating, molded article, and metal-plated molded article
JP2017179530A (en) * 2016-03-31 2017-10-05 旭化成株式会社 Plated product and method for manufacturing the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003023087A1 (en) * 2001-09-11 2003-03-20 Daicel Polymer Ltd. Plated resin molding and process for producing the same
KR100917141B1 (en) * 2001-09-11 2009-09-15 다이셀 폴리머 가부시끼가이샤 Plating resin molded article and process for producing the same
US7645370B2 (en) 2001-09-11 2010-01-12 Daicel Polymer Ltd. Plating resin molded article and process for producing the same
WO2007063732A1 (en) * 2005-11-30 2007-06-07 Techno Polymer Co., Ltd. Resin composition for direct metal plating, molded article, and metal-plated molded article
EP1956043A1 (en) * 2005-11-30 2008-08-13 Techno Polymer Co., Ltd. Resin composition for direct metal plating, molded article, and metal-plated molded article
EP1956043A4 (en) * 2005-11-30 2009-03-11 Techno Polymer Co Ltd Resin composition for direct metal plating, molded article, and metal-plated molded article
KR101320254B1 (en) * 2005-11-30 2013-10-23 테크노 폴리머 가부시키가이샤 Resin composition for direct metal plating, molded article, and metal-plated molded article
US9315662B2 (en) 2005-11-30 2016-04-19 Techno Polymer Co., Ltd. Resin composition for direct metal plating, molded article, and metal-plated molded article
JP2017179530A (en) * 2016-03-31 2017-10-05 旭化成株式会社 Plated product and method for manufacturing the same

Also Published As

Publication number Publication date
JP4084875B2 (en) 2008-04-30

Similar Documents

Publication Publication Date Title
JP5593581B2 (en) Composite molded product
JP4618692B2 (en) Rubber-containing graft polymer and thermoplastic resin composition
JP4438128B2 (en) Direct vapor deposited thermoplastic resin molded product
JPH11181218A (en) Resin composition for plating use and plated molded product
JPH11286587A (en) Thermoplastic resin composition and coated molded product
JP7186653B2 (en) Thermoplastic resin composition
JP2000017138A (en) Resin composition for plating and plated moldings
JP2000017170A (en) Thermoplastic resin composition
JP4144941B2 (en) Plating resin composition and plated molded product
JP2004131716A (en) Thermoplastic resin composition
JPH11181217A (en) Resin composition for plating use and plated molded product
JP4084876B2 (en) Plating resin composition and plated molded product
KR102117741B1 (en) Thermoplastic resin composition for plating
JP2003138089A (en) Thermoplastic resin composition for hot plate welding, and resin molded article
JP4048575B2 (en) Thermoplastic resin composition having scratch resistance
JP4204703B2 (en) Vehicle exterior molded parts that are suitable for plating and painting, and can be used without painting or plating.
JP6850932B1 (en) Resin composition for painting
JP2003147153A (en) Thermoplastic resin composition
JP2004161855A (en) Thermoplastic resin composition and molding for automobile using the same
JP2002322356A (en) Resin composition for plating and plated molded article
JPH11181224A (en) Resin composition and blow molded product using the same
JPH06322544A (en) Plated molding
JP2019098564A (en) Coating molded body
JP3074879B2 (en) Thermoplastic resin composition with excellent paintability
JP2000007881A (en) Resin composition with high chemical resistance

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041221

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060810

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20061010

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061211

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080205

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080218

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110222

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110222

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120222

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120222

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130222

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140222

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees