JPH11156564A - Heat resistant transparent member and manufacture - Google Patents

Heat resistant transparent member and manufacture

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Publication number
JPH11156564A
JPH11156564A JP9328285A JP32828597A JPH11156564A JP H11156564 A JPH11156564 A JP H11156564A JP 9328285 A JP9328285 A JP 9328285A JP 32828597 A JP32828597 A JP 32828597A JP H11156564 A JPH11156564 A JP H11156564A
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JP
Japan
Prior art keywords
body
mark
internal
heat
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9328285A
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Japanese (ja)
Inventor
Toshio Horikoshi
俊雄 堀越
Original Assignee
Toshiba Ceramics Co Ltd
東芝セラミックス株式会社
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Publication date
Application filed by Toshiba Ceramics Co Ltd, 東芝セラミックス株式会社 filed Critical Toshiba Ceramics Co Ltd
Priority to JP9328285A priority Critical patent/JPH11156564A/en
Publication of JPH11156564A publication Critical patent/JPH11156564A/en
Application status is Pending legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/02Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/02Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
    • C03B29/025Glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B32/00Thermal after-treatment of glass products not provided for in groups C03B19/00, C03B25/00 - C03B31/00 or C03B37/00, e.g. crystallisation, eliminating gas inclusions or other impurities; Hot-pressing vitrified, non-porous, shaped glass products

Abstract

PROBLEM TO BE SOLVED: To form an internal mark without traces such as a crack, a cutting trace, and an indentation of an outer surface which cause the contamination by focusing a focal point of a transmission laser light on a required internal portion position inside a heat resistant transparent body, and concentrating the energy. SOLUTION: A scanning optical system is arranged at the position of 1/2 thickness of a body 5 of a quartz glass substrate for a photomask with, for example, thickness of 6.5 mm which is manufactured in a required dimension and washed cleanly, in a manner that a center shaft 13b of a second laser light 11b forming a fine focal point of 10 μm diameter is crossed at the angle of 15 deg. against a center shaft 13a of a first laser light 11a adjusted to focus a focal point 14a of the 2 mm diameter. The laser lights 11a, 11b are oscillated and a regular triangle is drawn on the focal point 14a face by the light 11b. Then, the energy density is heightened to dissolve the face by overlaying the lights 11a, 12b so as to form a vivid internal mark 12 which has the regular triangle at the internal position of the body 5 and comprises three lines.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は石英ガラスのような耐熱性透明体に係わり、特にその本体内部にマークを付けた耐熱性透明体およびその製造方法に関する。 The present invention relates to relates to a heat-resistant transparent material such as quartz glass, particularly to heat-resistant transparent material and a manufacturing method marked therein body.

【0002】 [0002]

【従来の技術】半導体産業の製造工程における工程管理、在庫管理等のため半導体シリコンウェーハや製造工程に使用される石英ガラス等の耐熱性透明体の外表面に位置決めのマークや光学的読みとり可能な記号を付することが行われている。 Process control in the manufacturing process of the semiconductor industry, which can be semiconductor silicon wafers and the positioning on the outer surface of the heat-resistant transparent material of the quartz glass or the like used in the manufacturing process marks and optical reading for inventory management, etc. subjecting the symbol is being performed.

【0003】シリコンウェーハの外表面に付けられているオリエンテーションフラットやノッチは代表的なマークであるが、これらオリエンテーションフラットやノッチから発生するパーティクル等は、半導体素子の超LS [0003] Although the orientation flat or a notch which is attached to the outer surface of the silicon wafer which is a typical mark, such as particles generated from these orientation flat or notch, super LS of the semiconductor element
I化に伴い、シリコンウェーハおよび製造工程の汚染問題に影響を与えるために汚染問題対策が一段と重要になってきている。 With the I of, pollution problem measures in order to influence the pollution problem of the silicon wafer and the manufacturing process has become more important.

【0004】しかし、シリコンウェーハは不透明な材料であるため外表面にマークを付けるしか方法がない。 [0004] However, there is no way only mark on the outer surface for the silicon wafer is an opaque material.

【0005】一方、石英ガラスは、高純度性、耐熱性、 On the other hand, quartz glass, high purity, heat resistance,
低膨張牲、高硬度性、化学的耐性、高透明度性等多くの優れた特性を有しているため、半導体工業、化学工業、 Low expansion sacrifice, high hardness properties, because it has a chemical resistance, high transparency, etc. many excellent properties, the semiconductor industry, chemical industry,
精密機械工業、宇宙産業等広い分野で使用されている。 Precision machinery industry, are used in the space industry, such as a wide range of fields.

【0006】多くの用途において、精密な位置合せあるいは工程管理上必要となるため、石英ガラス製品にマークを付けることが要求されることが多い。 [0006] In many applications, because it requires the precise alignment or process control often be marked quartz glass product is required.

【0007】この要求に応えるため半導体の製造工程に使われるフォトマスクの石英ガラスの基板にも、図1に示すように四角形フォトマスクの基板1の一個ないし複数の角に機械的な加工方法で面取りをしてマーク用の切欠2を付けていた。 [0007] Also a substrate of quartz glass photomask used in a semiconductor manufacturing process to meet this demand, a mechanical processing method in one or more corners of the substrate 1 square photomask as shown in FIG. 1 He wore a notch 2 of the mark and the chamfer. この面取りの部分からパーティクル等が発生したり、飛散して工程中の汚れが面取り部に局部的に付着したりして問題になっていた。 This portion of particles and the like may occur from the chamfering, dirt during the process scatters had a problem with or locally attached to the chamfer.

【0008】また、特開平8−245230号公報記載の半導体製造プロセス用石英ガラス製品およびその製造方法には、石英ガラスに符号を付けるために、高純度の炭素、珪素、炭化珪素もしくは窒化珪素または石英ガラスとの混合物である着色剤3を、図2に示すような趣旨の構造で半導体製造の酸化・拡散工程で使用される石英ガラス製の炉芯管4の表面に塗布するもの、あるいは表面の記号状の溝部に着色剤を塗布したものが開示されている。 Further, in the semiconductor manufacturing process for quartz glass products and a manufacturing method thereof in Japanese Patent 8-245230 JP, to a sign in the quartz glass, high-purity carbon, silicon, silicon carbide or silicon nitride or the mixture is colorant 3 of the quartz glass, as applied to the surface of the quartz glass furnace tube 4 used in the spirit structure oxidation and diffusion steps of the semiconductor manufacturing in the shown in FIG. 2, or the surface that the groove symbol shape of the coloring agent is applied is disclosed.

【0009】 [0009]

【発明が解決しようとする課題】マークを外表面に機械的、あるいは熱的な外力を加えて付けるものは基板表面に何らかの傷痕が残り、パーティクルなどの発生源になることがあった。 Mark [0005] Mechanical on the outer surface, or those put added thermal force retains some scar on the substrate surface, there be a source of such particles.

【0010】また、ガラスの表面に着色剤を塗布するかあるいは表面に記号状に溝部に着色剤を塗布する特開平8−245230号公報記載のものは、本体と異なる材質の着色剤の塗布であり長期使用時の耐用性や信頼性に疑問があるばかりでなく、超LSI生産のフォトリソグラフィー工程で焼き付け回路のネガの役割を果たし、高純度、超高平坦性、高平滑性が極端に要求される石英ガラスのフォトマスクの基板には純度、平坦性、平滑性の観点からも不適当である。 Furthermore, those of JP-A-8-245230 JP applying a colorant to a symbol shape groove on or surface for applying the coloring agent to the surface of the glass, the coating of the body different from the material of the colorant There not only is questionable durability and reliability in long-term use, serves as a negative of the baking circuit photolithography process ultra LSI production, high purity, ultra high flatness, high smoothness is extremely required the substrate of the photomask of the quartz glass that is pure, flatness, is inadequate in terms of smoothness.

【0011】特に、半導体工業や光学器械工業などの場合は、パーティクルなどの汚れは極めて厳しく管理されており、高純度でシリコンウェーハや使用環境を汚染せず、かつ高平坦性、高平滑性が保たれたフォトマスクの基板等に適する石英ガラス等の耐熱性透明体が要望されていた。 [0011] Particularly, in the case of a semiconductor industry, optical instrument industry, contamination such as particles are very strictly controlled, it does not contaminate the silicon wafers and the operating environment in high purity, and high flatness and high smoothness heat-resistant transparent material such as quartz glass suitable for the substrate or the like of the preserved photomask has been desired.

【0012】本発明は上述した事情を考慮してなされたもので、耐熱性で透明な本体内部の所定の位置にレーザ光のエネルギー集中することにより付けられた内部マークを有することで、汚れの原因となる外表面の裂痕、削り跡、圧痕等、いかなる痕跡もない耐熱性透明体ならびにこの耐熱性透明体の製造方法を提供することを目的とする。 [0012] The present invention has been made in consideration of the circumstances described above, by having an internal mark attached by energy concentration of the laser beam to a predetermined position within the transparent body in heat resistance, dirt causative of the outer surface 裂痕 aims grinding marks, indentations, etc., to provide a method for producing any trace nor heat resistance transparent body and the heat-resistant transparent material.

【0013】 [0013]

【課題を解決するための手段】上記目的を達成するためになされた本願請求項1の発明は、耐熱性で透明な本体とこの本体に付けられたマークとを有する耐熱性透明体において、前記マークは前記本体内のマークが付けられる内部位置に発振レーザ光の焦点を合わせ、エネルギー集中させて形成された内部マークであることを特徴とする耐熱性透明体を要旨としている。 The invention of claim 1 has been made in order to achieve the above object, there is provided a means for solving], in heat-resistant transparent material having a mark attached to the body and the transparent body in heat resistance, the mark to focus the emitted laser beam at an internal position of the mark within the body is attached, are summarized as refractory transparent material, characterized in that an internal mark formed by energy concentration.

【0014】本願請求項2の発明は、耐熱性で透明な本体内の所定内部位置に焦点を結ぶように複数のレーザ光を同時に入射角度を異にして入射させ、発振レーザ光の重畳作用でエネルギー密度を高め、前記本体内に内部マークを形成することを特徴とする耐熱性透明体を要旨としている。 [0014] The present invention of claim 2, at the same time is different from to the incident the incident angle plurality of laser beams so as to focus at a predetermined internal position in the transparent body in heat resistance, in superposition effect of the oscillation laser beam increase energy density, it is summarized as heat resistance transparent material and forming an interior mark in said body.

【0015】本願請求項3の発明は、耐熱性で透明な本体が石英ガラスであることを特徴とする請求項1または2記載の耐熱性透明体であることを要旨としている。 [0015] the invention of claim 3 is directed to subject matter that transparent body in heat resistance is a heat-resistant transparent material according to claim 1 or 2, wherein it is a quartz glass.

【0016】本願請求項4の発明は、耐熱性で透明な本体がフォトマスクの石英ガラスの基板であることを特徴とする請求項1または2記載の耐熱性透明体であることを要旨としている。 [0016] The present invention of claim 4 is directed to subject matter that transparent body in heat resistance is a heat-resistant transparent material according to claim 1 or 2, wherein it is a substrate of quartz glass photomask .

【0017】本願請求項5の発明は、内部マークが情報媒体であることを特徴とする請求項1または2記載の耐熱性透明体を要旨としている。 [0017] the invention of claim 5 is directed to subject matter of claim 1 or 2, the heat resistance transparent body, wherein the internal mark is the information medium.

【0018】本願請求項6の発明は、内部マークがバーコードであることを特徴とする請求項1または2記載の耐熱性透明体を要旨としている。 [0018] the invention of claim 6, the internal marks are summarized as claimed in claim 1 or 2, the heat resistance transparent body, wherein the is a bar code.

【0019】本願請求項7の発明は、耐熱性で透明な本体を用意し、この本体内の所定内部位置に発振レーザの焦点を合わせてエネルギーを集中し、本体内に内部マークを付けることを特徴とする耐熱性透明体の製造方法を要旨としている。 [0019] the invention of claim 7 is prepared transparent body a heat-resistant, focused energy focused oscillation laser at a predetermined interior position within the body, that should be internally marks in the body the method for producing a heat-resistant transparent material, wherein is the gist.

【0020】本願請求項8の発明は、本体内の所要内部位置に焦点を合わせるように複数の発振レーザ光を同時に入射させ、発振レーザ光の重畳エネルギー密度を高め、前記本体内に内部マークを付することを特徴とする請求項7記載の耐熱性透明体の製造方法を要旨としている。 [0020] the invention of claim 8, is required internally positioned a plurality of oscillation laser beam to focus at the same time entering in the body, increasing the superimposed energy density of the emitted laser beam, an internal mark in said body It is summarized as method for producing a heat-resistant transparent material according to claim 7, wherein the subjecting.

【0021】本願請求項9の発明は、耐熱性で透明な本体がフォトマスクの石英ガラスの基板であることを特徴とする請求項7または8記載の耐熱性透明体の製造方法を要旨としている。 [0021] the invention of claim 9 is a transparent body in heat resistance is summarized as a manufacturing method of a heat-resistant transparent material according to claim 7, wherein it is a substrate of quartz glass photomask .

【0022】 [0022]

【発明の実施の形態】以下、本発明に係る耐熱性透明体およびその製造方法の実施の形態について添付図面に基づき説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the heat resistant transparent material and the embodiment of the manufacturing method with reference to the accompanying drawings illustrating the invention.

【0023】本発明に係る耐熱性透明体、例えば石英ガラスの基板1は超LSI用フォトリソグラフィに用いられるフォトマスク用基板となるもので、SiO2を単一成分として形成され、縦l;152mm、横w;152 The heat-resistant transparent material according to the present invention, for example, a substrate 1 of quartz glass in which a photomask substrate for use in photolithography for ultra LSI, formed of SiO2 as a single component, a vertical l; 152 mm, horizontal w; 152
mm、厚さt;6.3mmの平板状四角形をなしている。 mm, the thickness t; forms a flat square 6.3 mm.

【0024】この基板1の本体5は耐熱性に優れた透明体であり、のちのフォトマスク製造工程でフォトレジストが塗布される表面6と、裏面7、側面8、角曲面9および糸面取り部10からなっている。 The body 5 of the substrate 1 is a transparent body having excellent heat resistance, and surface 6 of photoresist is applied in a later photomask manufacturing process, the rear surface 7, side 8, the corner curved 9 and the thread chamfer It is made up of 10. 本体5の本体の所要内部位置、例えば角曲面9の近傍でかつ本体5内部の厚さ1/2の位置のところにはレーザ11によって付けられた内部マーク12が設けられている。 Required interior position of the body of the body 5, inside the mark 12 is provided which is applied by the laser 11, for example at the vicinity of a and the position of the body 5 inside the thickness half the angular curved 9.

【0025】一般に、フォトマスクの基板として要求される品質は(1)表面欠陥(傷、汚れ、異物等)、 [0025] In general, the quality required as a substrate for photomask (1) surface defects (scratches, dirt, foreign objects, etc.),
(2)内部欠陥(泡、異物、脈理等)、(3)面精度/ (2) internal defects (bubbles, foreign matter, striae, etc.), (3) surface accuracy /
平坦度(そり、うねりを含む)、(4)外形加工精度(大きさ、平均厚さ)、(5)透過率(at365、4 Flatness (warping, including waviness), (4) the outer shape processing accuracy (size, average thickness), (5) the transmittance (At365,4
04、436nm)、(6)熱膨張率である。 04,436Nm), a (6) thermal expansion coefficients.

【0026】従って、本体5は高純度の石英ガラスであることが必要であり、かつ表面6、裏面7はもとより、 [0026] Therefore, the body 5 is required to be highly pure quartz glass, and the surface 6, the rear surface 7 as well, the
側面8、角曲面9および糸面取り部10も高精度に光学研磨されている。 Side 8, also corner curved 9 and the thread chamfer 10 is optically polished with high precision.

【0027】次に、本体5の内部にマーク12が設けられた基板1の製造方法について、図6に基づき説明する。 Next, a method of manufacturing the substrate 1 inside the mark 12 is provided in the main body 5 will be described with reference to FIG.

【0028】合成法により石英ガラスのインゴットを製造し、このインゴットを所定の大きさ、例えば155m The synthesis by manufacture ingots quartz glass, this ingot a predetermined size, for example, 155m
m角の柱状に成型機で成形する。 Molding in a molding machine of the columnar m square. しかるのち、この成形体を所定の厚さ、例えば6.5mmに切断して平板を作る。 Accordingly Thereafter, the molded body a predetermined thickness, making the flat plate by cutting for example, to 6.5 mm. この平板を研削して平面出しを行い、次に面取りを行い、さらに平滑化のために2度目の研削を行う。 Performed out flat the flat by grinding, then subjected to chamfering, further performs a second time grinding for smoothing.

【0029】その後鏡面仕上げのための研磨を行なったのち、研磨剤を落とすための洗浄を行う。 [0029] After then the polishing was performed for the mirror finish, do the cleaning for dropping a polishing agent.

【0030】所定の寸法に製作され、きれいに洗浄された基板1の本体5の所要内部位置に以下に詳述する方法で図示しないレーザ装置から発振されたレーザ光11 The predetermined fabricated dimensioned, washed clean laser light 11 oscillated from a laser device (not shown) in a manner described in detail below to the desired internal position of the body 5 of the substrate 1
a、11bを用いて内部マーク12を付ける。 Add internal mark 12 with a, the 11b.

【0031】所定の位置に基板1を載置し、所定の大きさ、例えば直径2mmの焦点を作り出し、かつ中心軸1 [0031] placing the substrate 1 to a predetermined position, creating a predetermined size, for example, the focus of diameter 2 mm, and the center axis 1
3aを有する第1のレーザ光11aがその焦点14aを本体5の厚さの例えば1/2、すなわち表面3から3. The first laser beam 11a is its focal 14a having 3a thickness of, for example, half of the body 5, i.e. from the surface 3 3.
2mm離れたところで結ぶように図示しない走査光学系の集光レンズあるいは凹面鏡の設定位置を調節する。 Adjusting the setting position of the condenser lens or a concave mirror of the scanning optical system (not shown) so as to connect at a distance 2 mm. 次に、別のレーザ装置から発振される第2レーザ光11b Next, a second laser beam 11b which is oscillated from another laser device
を用いる。 It is used. この第2レーザ光11bで所定の大きさ、例えば直径10μmの微小な焦点を作り出し、かつ第2のレーザ11bはの中心軸13bが第1のレーザ光11a Predetermined size in the second laser beam 11b, for example, creating a very small focus diameter 10 [mu] m, and the second laser 11b Hano central axis 13b is the first laser beam 11a
の中心軸13aと例えば15゜の交差角度をなし、かつ第1のレーザ光11aの焦点14aと同一位置に焦点1 The central axis 13a and for example form a 15 ° crossing angle, and focus 1 to the focal 14a at the same position of the first laser beam 11a
4bを結ぶように図示しない走査光学系を配置する。 Placing the not shown scanning optical system so as to connect 4b.

【0032】しかるのち、レーザ光11aを発振して直径2mmの焦点14aを本体5内の所要内部位置に作り出す一方、第2のレーザ光11bを発振して焦点11a [0032] accordingly after, while creating a focal 14a having a diameter of 2mm oscillating a laser beam 11a to the desired internal location within the body 5, the focus 11a oscillates the second laser beam 11b
と同一位置に焦点14bを作り出し、焦点11aの中心部に正三角形ができるように焦点14a面をレーザ光1 Same position in creating a focal point 14b, the laser beam 1 the focal 14a faces to allow equilateral triangle in the center of the focus 11a and
1bでけがく。 1b Deke calyx. このとき第2のレーザ11bでけがいた焦点11aの位置には、第1のレーザ光11aと第2のレーザ光11bの重畳によってエネルギーが集中しエネルギー密度が高められて溶解し、焦点14aと同一位置の本体5の所要内部位置に正三角形を有し3本線からなる内部マーク12が鮮明に形成される。 At this time the position of the scribed focal 11a in the second laser 11b, the first dissolved energy concentrated energy density is enhanced by superimposing the laser beam 11a and the second laser beam 11b, identical to the focal 14a internal mark 12 consisting of three lines have a regular triangle is formed clearly on the desired interior position of the body 5 position.

【0033】このようにして、本体5内部にマーク12 [0033] In this way, the body 5 inside to mark 12
が付けられた基板1は検査され、出荷される。 Substrate 1 is attached is examined, and shipped. この検査の段階でも、レーザ光11a、11bにより基板1と非接触でかつ本体2内部にマーク12を形成したので、基板1に機械的な加工方法で面取りをしてマーク用の切欠2を付ける必要がないばかりでなく、表面6はもとより裏面7、側面8、角曲面9および糸面取り部10にも汚れの原因となる外表面の裂痕、削り跡、圧痕等、いかなる痕跡もできない。 Even at the stage of the inspection, the laser beam 11a, because the non-contact with the substrate 1 and the formation of the mark 12 in the main body 2 by 11b, applying a notch 2 of the mark by the chamfered substrate 1 by a mechanical machining method not only not necessary, the surface 6 as well backside 7, side 8, in the corner curved 9 and the thread chamfer 10 of the outer surface causing contamination 裂痕, cutting marks, indentations, etc., it can not be any trace.

【0034】なお、上述実施の形態の他に次に説明するマークを付することも可能である。 [0034] Note that it is possible to subject the mark to be next described another embodiment of the above-described embodiment.

【0035】図4のようにレーザ光11a、レーザ光1 The laser beam 11a as shown in FIG. 4, the laser beam 1
1bを直交する2側面8から発信し、角曲面9の近傍にレーザ11aの焦点14aおよびレーザ11bの焦点1 1b originating from two sides 8 orthogonal to the focus of the focus 14a and laser 11b of the laser 11a in the vicinity of the corner curved 9 1
4bを結ぶようにしてエネルギーを集中し、垂直線状のマーク12を作ることもできる。 Concentrating energy so as to connect the 4b, it is also possible to make a vertical line-shaped mark 12.

【0036】図5のように第1のレーザ光11aの焦点14aおよび第2のレーザ11bの焦点14bを結ぶようにしてエネルギーを集中し、レーザ光8bでバーコードを設けるようにけがけば、内部マーク12としてバーコードができ、光学読取装置を用いて効率的な生産管理が行える。 [0036] As focused 14b of the first focal point 14a and the second laser 11b of the laser beam 11a as shown in FIG. 5 to focus energy, to provide a bar code with a laser beam 8b Kegakeba, as an internal mark 12 can bar code, enabling efficient production control using the optical reader.

【0037】なお、バーコードを設けることは、レーザ光8bのみを用いバーコードを設けるようにけがけば、 [0037] Incidentally, the provision of the bar code, Kegakeba to provide a bar code using only the laser beam 8b,
2個のレーザ光8a、8bを用いるのに比べて長時間に発信が必要となるが可能である。 Two laser beams 8a, is possible but requires a call to a long time as compared with the use of 8b. この場合レーザ光8b In this case the laser beam 8b
の出力を上げることで時間の短縮は可能である。 Shorter time by increasing the output of is possible.

【0038】図6のように、1個のレーザ光11aのみを用い角曲面9の近傍に焦点14aを合わせエネルギーを集中し、円形のマーク12を付することも可能である。 [0038] As shown in FIG. 6, the energy combined one focal point 14a in the vicinity of the laser beam 11a only using angle curved 9 concentrates, it is also possible to subject the circular mark 12.

【0039】本発明に係わる耐熱性透明体は、本体5内部にマーク12を形成したので、基板1の表面6に本体と異なる材質の着色剤を塗布してマークを付する必要がなくなり、半導体製造の酸化・拡散工程等過酷な条件下で使用される石英ガラス製の炉芯管の長期使用でも信頼性に全く問題がない。 The present invention related to heat resistance transparent body, since the formation of the mark 12 in the main body 5, it is not necessary to subject the marks by applying a colorant different from the body material on the surface 6 of the substrate 1, a semiconductor no no problem in reliability in long-term use of quartz glass furnace tube that is used under severe conditions such as oxidation and diffusion steps of the production.

【0040】本発明に係わる耐熱性透明体をフォトマスクの石英ガラスの基板1として実施する場合には、本体5内部にマーク12を形成したので、高純度、超高平坦性、高平滑性が極端に要求されるフォトマスクの基板には純度、平坦性、平滑性の観点からも最適である。 [0040] When carrying out the heat-resistant transparent material according to the present invention as a substrate 1 of quartz glass photomask, since the formation of the mark 12 on the inner body 5, high purity, ultra high flatness and high smoothness extremely required purity to the substrate of the photomask, the flatness, it is optimum from the viewpoint of smoothness.

【0041】また、マーク12を基準とし、光学装置を用いあるいは目視により正確な位置決めが可能になり、 Further, a reference mark 12 enables accurate positioning or by visual observation using an optical device,
半導体製造の生産性向上にも寄与する。 It contributes to productivity improvement of the semiconductor manufacturing.

【0042】 [0042]

【実施例】実施例1 縦l;152mm、横w;152mm、厚さt;6.3 EXAMPLE 1 Vertical l; 152 mm, lateral w; 152 mm, the thickness t; 6.3
mmの平板状四角形の石英ガラスの試料1を製作し、図3で説明した方法で発振レーザ光8a、8bを焦点が表面から3.2mm離れたところ結ぶように調節、発振し、3.2mmの所要内部位置に中心部に正三角形を有し3本線からなる鮮明な内部マーク12を得た。 To prepare a sample 1 of quartz glass mm tabular square, the oscillation laser beam 8a in the manner described in FIG. 3, 8b focus adjustment so as to connect away 3.2mm from the surface oscillates, 3.2mm to obtain a clear internal mark 12 consisting of three lines have a regular triangle in the center to the required internal position of.

【0043】実施例2 縦l;152mm、横w;152mm、厚さt;6.3 [0043] Example 2 Vertical l; 152 mm, lateral w; 152 mm, the thickness t; 6.3
mmの平板状四角形の石英ガラスの試料2を製作し、図4で説明した方法で、レーザ光11a、11bを表面6 To prepare a sample 2 of quartz glass mm tabular square, by the method described in FIG. 4, the laser beam 11a, 11b of the surface 6
から3.2mm離れた本体5内の位置で、かつ各側面8 In the position of the body 5 apart 3.2mm from, and each side 8
から3mm離れた位置を中心に一辺2mmの正方形の平板状の焦点13aを形成し、さらにこの焦点13aと直交するレーザ光13bの焦点13bを形成する。 A flat focal 13a of one side of a square 2mm is formed around a position away 3mm from further formed focus 13b of the laser beam 13b orthogonal to the focus 13a. 両焦点13あと13bが交わってできる交線に直線状の長さ2 Both focus 13 after 13b is the intersection line can intersect the linear length 2
mmの内部マーク12ができた。 mm internal mark 12 could be.

【0044】実施例3 縦l;152mm、横w;152mm、厚さt;6.3 [0044] Example 3 Vertical l; 152 mm, lateral w; 152 mm, the thickness t; 6.3
mmの平板状四角形の石英ガラスの試料3を作製し、図6のように、1個の11aのみを用い角曲面の近傍に焦点を合わせエネルギーを集中し、直径2mmの円形のマークを得た。 To form Sample 3 of quartz glass mm tabular square, as shown in FIG. 6, to concentrate one 11a of the energy focused in the vicinity of the angle curved using only to obtain a mark of a circle having a diameter of 2mm .

【0045】 [0045]

【発明の効果】以上に述べたように本発明に係る耐熱性透明体およびその製造方法において、レーザ光を用いマークを耐熱性透明体の本体内部に形成するので、半導体製造の酸化・拡散工程等過酷な条件下で使用される石英ガラス製の炉芯管の長期使用でも信頼性に全く問題がなく、またフォトマスクの石英ガラスの基板として実施する場合には、純度、平坦性、平滑性の観点からも最適で、かつマークを基準としより正確な位置決めが可能になり半導体製造の生産性向上にも寄与する。 In heat-resistant transparent material and a manufacturing method according to the present invention as described above, according to the present invention, since the mark using a laser beam to form the body of the heat-resistant transparency, oxidation and diffusion steps of the semiconductor manufacturing no no problem in reliability prolonged use of quartz glass furnace tube that is used in equal severe conditions, also when implemented as a substrate of quartz glass photomask, purity, flatness, smoothness the optimum from the viewpoint, and also contributes to productivity improvement of the semiconductor manufacturing enables accurate positioning than a reference mark.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】従来のフォトマスクの石英ガラスの基板の一部切欠図。 [1] partially cutaway view of a substrate of quartz glass of a conventional photomask.

【図2】従来の炉芯管の斜視図。 2 is a perspective view of a conventional furnace tube.

【図3】本発明の耐熱性透明体およびその製造方法を示す概略図。 Schematic diagram showing heat resistance transparent body and its manufacturing method of the present invention; FIG.

【図4】本発明の他の実施の形態を示す一部切欠図。 Partially cutaway view showing another embodiment of the present invention; FIG.

【図5】本発明の他の実施の形態を示す一部切欠図。 [5] partial cutaway view showing another embodiment of the present invention.

【図6】本発明の耐熱性透明体の製造工程図。 [6] manufacturing process diagrams of a heat-resistant transparent material of the present invention.

【符号の説明】 1 基板 2 切欠 3 着色剤 4 炉芯管 5 本体 6 耐火物 7 裏面 8 側面 9 角曲面 10 糸面取り部 11a レーザ光 11b レーザ光 12 マーク 13a 中心線 13b 中心線 14a 焦点 14b 焦点 [EXPLANATION OF SYMBOLS] 1 substrate 2 notch 3 colorant 4 core tube 5 body 6 refractory 7 back surface 8 side 9 square curved 10 thread chamfer 11a laser beam 11b laser beam 12 marks 13a centerline 13b centerline 14a focal 14b focal

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl. 6識別記号 FI // H01L 21/205 H01L 21/205 ────────────────────────────────────────────────── ─── front page continued (51) Int.Cl. 6 identifications FI // H01L 21/205 H01L 21/205

Claims (9)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 耐熱性で透明な本体とこの本体に付けられたマークとを有する耐熱性透明体において、前記マークは本体内の所要内部位置に発振レーザ光の焦点を合わせ、エネルギー集中させて形成された内部マークであることを特徴とする耐熱性透明体。 1. A heat-resistant transparent material having a mark attached to the body and the transparent body in heat resistance, the mark is to focus the emitted laser beam to a desired internal location within the body, by energy concentration heat resistant transparent material, characterized in that formed an internal mark.
  2. 【請求項2】 耐熱性で透明な本体内の所定内部位置に焦点を結ぶように複数の発振レーザ光を同時に入射角度を異にして入射させ、発振レーザ光の重畳作用でエネルギー密度を高め、前記本体内に内部マークを形成することを特徴とする耐熱性透明体。 2. A is incident to different in simultaneously incident angle multiple wave laser beam so as to focus at a predetermined internal position in the transparent body in heat resistance, increase energy density by superimposing the action of the oscillation laser beam, heat resistant transparent material and forming an internal mark in the body.
  3. 【請求項3】 耐熱性で透明な本体が石英ガラスであることを特徴とする請求項1または2記載の耐熱性透明体。 3. A process according to claim 1 or 2, heat resistant transparent material according transparent body in heat resistance characterized in that it is a quartz glass.
  4. 【請求項4】 耐熱性で透明な本体がフォトマスクの石英ガラスの基板であることを特徴とする請求項1または2記載の耐熱性透明体。 4. The method of claim 1 or 2, heat resistant transparent material according transparent body in heat resistance, characterized in that a substrate of quartz glass photomask.
  5. 【請求項5】 内部マークが情報媒体であることを特徴とする請求項1または2記載の耐熱性透明体。 5. A method according to claim 1 or 2, the heat resistance transparent body, wherein the internal mark is the information medium.
  6. 【請求項6】 内部マークがバーコードであることを特徴とする請求項1または2記載の耐熱性透明体。 6. A heat-resistant transparent material according to claim 1 or 2, wherein the internal mark is a bar code.
  7. 【請求項7】 耐熱性で透明な本体を用意し、この本体内の所要内部位置に発振レーザ光の焦点を合わせてエネルギーを集中し、本体内に内部マークを付けることを特徴とする耐熱性透明体の製造方法。 7. Prepare a transparent body in heat resistance, required in the interior position to focus the emitted laser light to focus energy, heat resistance, characterized in that to attach the internal marks in the body in the body the method for producing a transparent body.
  8. 【請求項8】 本体内の所要内部位置に焦点をあわせるように複数の発振レーザ光を同時に入射させ、上記発振レーザ光の重畳作用でエネルギー密度を高め、前記本体内に内部マークを付けることを特徴とする請求項7記載の耐熱性透明体の製造方法。 8. is simultaneously incident required internal position in the plurality to focus oscillation laser beam in the body, increase energy density by superimposing operation of the oscillation laser beam, that should be internally mark in said body method for producing a heat-resistant transparent material according to claim 7, wherein.
  9. 【請求項9】 耐熱性で透明な本体がフォトマスクの石英ガラスの基板であることを特徴とする請求項7または8記載の耐熱性透明体の製造方法。 9. A process according to claim 7 or 8 refractory transparent body, wherein the transparent body in heat resistance is a substrate of quartz glass photomask.
JP9328285A 1997-11-28 1997-11-28 Heat resistant transparent member and manufacture Pending JPH11156564A (en)

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